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Okamura H.,Osaka Prefecture University | Muramatsu K.,Nakanuma Art Screen Co. | Nakajiri H.,Nakanuma Art Screen Co. | Shirai M.,Osaka Prefecture University | Matsumoto A.,Osaka Prefecture University
Journal of Photopolymer Science and Technology | Year: 2015

Photoresists for high resolution screen printing plates was devised using thiol-ene reaction. New resist formulation contains a base polymer which contains acid-labile tetrahydropyranyl-protected carboxylic acid, hydroxyl and methacrylic functions. As crosslinkers, multifunctional acrylates and multifunctional thiols were employed. Photoacid generators were used for pattern formation. A 6-mm feature size of resist on a SUS screen plate was obtained on irradiation at 365 nm and followed by development. Post-exposure curing using 254 nm light with photoradical generators improved the mechanical characteristics of the resist patterns. Addition of a multifunctional thiol compound was effective to improve flexibility of the cured resist and resist sensitivity. © 2015SPST. Source


Okamura H.,Osaka Prefecture University | Kayanoki M.,Shin Nakamura Chemical Co. | Takada K.,Shin Nakamura Chemical Co. | Nakajiri H.,Nakanuma Art Screen Co. | And 3 more authors.
Polymers for Advanced Technologies | Year: 2012

High-resolution screen printing was devised. New resist formulation contains a base polymer, which consists of acid-labile tetrahydropyranyl-protected carboxylic acid, hydroxyl, and methacrylic functions. As crosslinkers, multifunctional acrylates were employed. Photoacid generators were used for pattern formation. A 10-μm feature size of resist on a screen plate was obtained on irradiation at 365nm and followed by development on a stainless steel screen. Post-exposure curing improved the mechanical characteristics of the resist patterns. A 13-μm feature size silver circuit was successfully printed on poly(ethylene terephthalate) film without defect. © 2011 John Wiley & Sons, Ltd. Source

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