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Nishi ku, Japan

The super-abrasive grain fixed type wire saw is equipped with two layers consisting of a brazing material layer (


Patent
Nakamura Choko Co. | Date: 2012-03-06

[Object] To provide a method and device for manufacturing an abrasive grain-fixed saw wire that realize homogeneous distribution of abrasive grains adhered to the outer surface of a wire while suppressing variations in the amount of abrasive grains adhered to the outer surface of the wire, even in a high-efficiency wire feeding mode with a high density of abrasive grains, back-and-forth running of the wire, and the like. [Constitution] The present invention includes: a plating tank


Inoue M.,Nakamura Choko Co. | Ohtani Y.,HIGH-TECH | Shimada H.,Nakamura Choko Co. | Tomiyoshi T.,Nakamura Choko Co. | And 5 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2012

We produced the diamond saw wire using the commercial lead-free solder as a fixing material of diamond abrasive particles, and sliced sapphire ingots into wafers with the saw wires. The co-drawn brass coated piano wire was adopted as a core material. Electroless Ni-P coated diamond abrasive particles were employed to enhance adhesion between the solder and diamond abrasive particle. We developed the equipment that performs solder coating on wire, temporary fitting of diamond abrasive particles on wire, and final fixing, in one continuous operation. We were able to produce saw wires as long as around 2 km. By using these saw wires we succeeded in slicing a sapphire ingot of 50.8 mm diameter into 50 wafers at a time. However, the average thickness of the wafers tended to be thinner toward the winding side of the wire saw machine. The total thickness variation (TTV), the maximum surface waviness (WT) and the maximum surface roughness (RZ) tended to increase toward the winding side. During the slicing process of ingot, the load on the saw wire maximized when the wire had moved a considerable distance away from the center of the ingot. Source


Inoue M.,Nakamura Choko Co. | Kawagishi S.,Nakamura Choko Co. | Hagihara Y.,Nakamura Choko Co. | Tomiyoshi T.,Nakamura Choko Co. | And 5 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2012

We developed a new type of saw wire for slicing hard materials. Then we tried to slice 50.8 mm diameter sapphire ingots into wafers by using this wire. The surfaces of wires are composed of two layers. That is, in the first layer, electroless Ni-P alloy plated diamond abrasive grains were temporarily fixed on the brass coated piano wire by using solder. And in the second layer, Ni was electroplated for reinforcement of the first layer. The curvature radii of filets formed between solder layer and diamond abrasive grains can be adjusted arbitrarily according to change the depth of solder layer. The stress concentration at finally Ni electroplated filets can be reduced according to the preliminary adjusted shapes of filets. When cutting off sapphire ingots by using these saw wires, cutting surface properties, such as average thickness, maximum surface waviness (WT) and total thickness variation (TTV) of sapphire wafers were generally favorable. And when running velocities of saw wires were varied in the range from 600 m/min to 400 m/min, cutting surface properties of sapphire wafers at the lowest running velocity of 400 m/min was superior in these running velocities of saw wires. Source


Nakahira A.,Osaka Prefecture University | Okimura A.,Osaka Prefecture University | Hagiwara Y.,Tohoku University | Nakanishi T.,Tohoku University | And 2 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2015

We have carried out research and development of high-performance diamond abrasive grains fixed saw wire for electronic equipment material for wafer fabrication, such as solar cells for silicon and sapphire for the LED package substrate. It advances the prototype of the saw wire, to produce a product in a way that makes a commercial basis. Through these research and development activities, we report on the process that led to the production of silicon wafers for solar cells and sapphire wafers for LED package substrate using novel saw wires fixed diamond abrasive rains with solder and Ni electroplating process. Source

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