Nakamura Choko Co.

Nishi-Tokyo-shi, Japan

Nakamura Choko Co.

Nishi-Tokyo-shi, Japan
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Inoue M.,Nakamura Choko Co. | Ohtani Y.,HIGH-TECH | Shimada H.,Nakamura Choko Co. | Tomiyoshi T.,Nakamura Choko Co. | And 5 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2012

We produced the diamond saw wire using the commercial lead-free solder as a fixing material of diamond abrasive particles, and sliced sapphire ingots into wafers with the saw wires. The co-drawn brass coated piano wire was adopted as a core material. Electroless Ni-P coated diamond abrasive particles were employed to enhance adhesion between the solder and diamond abrasive particle. We developed the equipment that performs solder coating on wire, temporary fitting of diamond abrasive particles on wire, and final fixing, in one continuous operation. We were able to produce saw wires as long as around 2 km. By using these saw wires we succeeded in slicing a sapphire ingot of 50.8 mm diameter into 50 wafers at a time. However, the average thickness of the wafers tended to be thinner toward the winding side of the wire saw machine. The total thickness variation (TTV), the maximum surface waviness (WT) and the maximum surface roughness (RZ) tended to increase toward the winding side. During the slicing process of ingot, the load on the saw wire maximized when the wire had moved a considerable distance away from the center of the ingot.


Inoue M.,Nakamura Choko Co. | Higashi T.,Osaka Prefecture University | Onoki T.,Osaka Prefecture University | Yokota M.,Nakamura Choko Co. | And 3 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2011

We have developed the Ag-Cu-Sn-Ni quaternary brazing filler metal having a low melting point, a high strength and a high ductility. Then, we produced wire saws composed of Ni-coated SUS304 wires, on which diamond abrasives are fixed with this brazing filler metal. We tried to slice the Si ingots using this wire saw. Good results were obtained for the application to the production of silicon wafers for solar cells. Accordingly, we focused on the basic experiments for further performance of the fixed abrasive diamond wire saws, leading to low cost of slicing technique of hard materials such as silicon and sapphire. In particular, we examined wettability, interfacial reaction and joint strength between Ag-Cu-Sn-Ni quaternary brazing filler metal and industrial metal plates such as Cu, Ni or flux coated SUS304.


Nakahira A.,Osaka Prefecture University | Okimura A.,Osaka Prefecture University | Hagiwara Y.,Tohoku University | Nakanishi T.,Tohoku University | And 2 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2015

We have carried out research and development of high-performance diamond abrasive grains fixed saw wire for electronic equipment material for wafer fabrication, such as solar cells for silicon and sapphire for the LED package substrate. It advances the prototype of the saw wire, to produce a product in a way that makes a commercial basis. Through these research and development activities, we report on the process that led to the production of silicon wafers for solar cells and sapphire wafers for LED package substrate using novel saw wires fixed diamond abrasive rains with solder and Ni electroplating process.


Inoue M.,Nakamura Choko Co. | Kawagishi S.,Nakamura Choko Co. | Hagihara Y.,Nakamura Choko Co. | Tomiyoshi T.,Nakamura Choko Co. | And 5 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2012

We developed a new type of saw wire for slicing hard materials. Then we tried to slice 50.8 mm diameter sapphire ingots into wafers by using this wire. The surfaces of wires are composed of two layers. That is, in the first layer, electroless Ni-P alloy plated diamond abrasive grains were temporarily fixed on the brass coated piano wire by using solder. And in the second layer, Ni was electroplated for reinforcement of the first layer. The curvature radii of filets formed between solder layer and diamond abrasive grains can be adjusted arbitrarily according to change the depth of solder layer. The stress concentration at finally Ni electroplated filets can be reduced according to the preliminary adjusted shapes of filets. When cutting off sapphire ingots by using these saw wires, cutting surface properties, such as average thickness, maximum surface waviness (WT) and total thickness variation (TTV) of sapphire wafers were generally favorable. And when running velocities of saw wires were varied in the range from 600 m/min to 400 m/min, cutting surface properties of sapphire wafers at the lowest running velocity of 400 m/min was superior in these running velocities of saw wires.


Higashi T.,Osaka Prefecture University | Inoue M.,Nakamura Choko Co. | Onoki T.,Osaka Prefecture University | Masaru Yokota,Nakamura Choko Co. | And 2 more authors.
Zairyo/Journal of the Society of Materials Science, Japan | Year: 2010

The development of low melting temperature coating materials for brazing diamonds was attempted for diamonds wire saw for slicing single crystal silicon.The diamonds wire saw was made by brazing diamonds on SUS-304 wire with high strength for the sawing equipments. Since the degradation of SUS-304 wire was generally generated at higher temperature over 600°C), the high performance coating materials, composed of 47.5 wt.%Ag-25.5 wt.%Cu27.0 wt.%Sn based materials, was developed by addition of Ni into them to improve the brittleness for SUS-304 wire. These results suggested that the coating material of (47.5 wt.%Ag-25.5 wt.%Cu-27.0 wt.%Sn)-l wt.%Ni was the suitable brazing of the diamonds SUS-304 wire for sawing equipments. © 2010 The Society of Materials Science, Japan.


The super-abrasive grain fixed type wire saw is equipped with two layers consisting of a brazing material layer (13) and a metal plating layer (16), the aforementioned brazing material layer (13) serving to temporarily fix super-abrasive grains (14), and the aforementioned metal plating layer (16) serving to hold the super-abrasive grains (14). The thickness of the brazing material layer (13) is 10% or less of the average grain diameter of the super-abrasive grains (14). The brazing material layer (13) is formed on the surface of a wire (10) in advance. The super-abrasive grains (14) are dispersed and adhered in a single layer onto the brazing material layer (13). Subsequently, the surface of the brazing material layer (13) is melted and solidified, resulting in a super-abrasive-grains-temporarily-adhered wire (12) such that super-abrasive grains (14) are joined to the adhesion surface of the brazing material layer (13). Thereafter, the super-abrasive-grains-temporarily-adhered wire (12) is metal-plated.


The super-abrasive grain fixed type wire saw is equipped with two layers consisting of a brazing material layer (13) and a metal plating layer (16), the aforementioned brazing material layer (13) serving to temporarily fix super-abrasive grains (14), and the aforementioned metal plating layer (16) serving to hold the super-abrasive grains (14). The thickness of the brazing material layer (13) is 10% or less of the average grain diameter of the super-abrasive grains (14). The brazing material layer (13) is formed on the surface of a wire (10) in advance. The super-abrasive grains (14) are dispersed and adhered in a single layer onto the brazing material layer (13). Subsequently, the surface of the brazing material layer (13) is melted and solidified, resulting in a super-abrasive-grains-temporarily-adhered wire (12) such that super-abrasive grains (14) are joined to the adhesion surface of the brazing material layer (13). Thereafter, the super-abrasive-grains-temporarily-adhered wire (12) is metal-plated.


Patent
Nakamura Choko Co. | Date: 2012-03-06

[Object] To provide a method and device for manufacturing an abrasive grain-fixed saw wire that realize homogeneous distribution of abrasive grains adhered to the outer surface of a wire while suppressing variations in the amount of abrasive grains adhered to the outer surface of the wire, even in a high-efficiency wire feeding mode with a high density of abrasive grains, back-and-forth running of the wire, and the like. [Constitution] The present invention includes: a plating tank 16A that stores a plating solution M1 containing abrasive grains D; a wire feeding means 2 that lets a wire W pass through the plating solution M1; an electric current supply means 3 that supplies an electric current to the wire W and the plating solution M1; an abrasive grain amount calculation means 4 that calculates the amount of abrasive grains D adhered to the outer surface of the wire W having passed through the plating solution M1; and an electric current control means 5 that increases or decreases the value of an electric current flown into the wire W in the plating solution M1 by the electric current supply means 3 according to the calculated amount of abrasive grains to control variations in the amount of the abrasive grains adhered to the outer surface of the wire so as to fall within a predetermined range.

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