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Kyoto, Japan

Murata Manufacturing Co., Ltd. is a Japanese manufacturer of electronic components, based in Nagaokakyo, Kyoto. Honorary Chairman Akira Murata started Murata Manufacturing as a personal venture in October, 1944. On December 1950 reorganized the company into Murata Manufacturing Co., Ltd. with paid-in Capital ¥1 million.Murata Manufacturing is a leading company primarily involved in the manufacturing of ceramic passive electronic components, primarily capacitors, and it has an overwhelming share worldwide in ceramic filters, high-frequency parts, and sensors. As of March 31, 2013 Murata Manufacturing has 24 subsidiaries in Japan and 52 overseas in the United States, Canada, Mexico, Brazil, Germany, France, Italy, the United Kingdom, Switzerland, the Netherlands, Spain, Hungary, Finland, China, Taiwan, South Korea, Singapore, Malaysia, the Philippines, Thailand, Hong Kong, Vietnam and India.On April 13, 2012, Murata announced a deal to acquire RF Monolithics for $1.78 per share.On August 23, 2014, Murata announced the acquisition of Peregrine Semiconductor Corporation. Wikipedia.

A measurement method is disclosed for measuring the presence or absence of an object to be measured or the quantity thereof, and the measurement method includes irradiating an electromagnetic wave on a void-arranged structural body holding the object to be measured, and detecting characteristics of an electromagnetic wave scattered by the void-arranged structural body. The void-arranged structural body has a plurality of void portions penetrating in a direction perpendicular to a primary surface thereof, and at least a part of the object to be measured is held by the void-arranged structural body with carrier particles provided therebetween.

Murata Manufacturing Co. | Date: 2015-01-14

A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.

Murata Manufacturing Co. | Date: 2016-01-13

In an electronic component, a functional circuit, signal wiring electrically connected to the functional circuit, and ground wiring electrically connected to the functional circuit and electrically connected to a ground potential are located on one surface of a circuit substrate, a frame member is provided to secure a region between itself and an outer peripheral edge of a first main surface of the circuit substrate and so as to surround the functional circuit, the ground wiring extends from inside to outside the frame member, and a shield member extends from a second main surface of the circuit substrate to a region on the first main surface via the side surfaces, the shield member being electrically connected to the ground wiring in the region outside the frame member.

Murata Manufacturing Co. | Date: 2016-01-12

A front-end circuit includes a multiplexer, a circulator, reception ports, and variable filters. A port in the multiplexer is connected to an antenna. A port in the circulator is connected to a port in the multiplexer. The reception ports are connected to a port in the circulator with the variable filters interposed therebetween. The multiplexer outputs a communication signal having a frequency in a low band to the port and outputs a communication signal having a frequency in a middle band to a port. Each of the low band and the middle band includes a plurality of frequency bands. The middle band is a range of frequencies higher than those in the low band and does not overlap the low band.

A ceramic substrate for an electrochemical element that includes a ceramic layer and a high-thermal-expansion-coefficient material layer that is laminated on the surface of the ceramic layer. The high-thermal-expansion-coefficient material layer has a higher coefficient of thermal expansion than the ceramic layer, and applies compressive stress to the ceramic layer.

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