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Leng E.P.,Freescale Semiconductor | Song P.Z.,Freescale Semiconductor | Kheng A.Y.,Freescale Semiconductor | Yong C.C.,Freescale Semiconductor | And 5 more authors.
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium | Year: 2010

For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch 70um and bonded ball diameter #60; 58um), more-so on low k wafer technology with bond-over-active requirement. © 2010 IEEE. Source

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