Santa Clara, CA, United States
Santa Clara, CA, United States

MoSys, Inc. is a publicly traded fabless semiconductor company based in Santa Clara, California that sells solutions for data path connectivity, speed and intelligence while eliminating data access bottlenecks on line cards and systems scaling from 100G to multi-terabits per second. Prior to 2012 it also sold high-performance embedded DRAM under IP cores under the "1T-SRAM" moniker as well high-speed SerDes cores and DDR interface IP. Customers for MoSys IP included a wide range of IDMs, foundries, and other fabless semiconductor companies. Applications included networking, consumer products, graphics systems, general computing, and storage systems.As of December 2010, MoSys IP cores had shipped in over 370 million devices, including mobile consumer devices, home entertainment systems, graphics systems, networking, and data storage systems. The popular Nintendo GameCube and Wii game consoles used MoSys 1T-SRAM memory IP.In 2011, MoSys expanded its business model to become a fabless semiconductor company with the 1st sampling of integrated circuits for the MoSys "Bandwidth Engine" product family.In 2012, MoSys discontinued its IP business in order to concentrate solely on its line of Bandwidth Engine ICs.In 2013, MoSys introduced its line of LineSpeed integrated circuits with its first offering, a 100G Gearbox. Wikipedia.


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Patent
MoSys, Inc. | Date: 2016-12-26

A Method and Apparatus for Randomizer has been disclosed. In one implementation a sequence of randomized connections then exclusive-OR operations and then an adder produce a randomized output.


Patent
MoSys, Inc. | Date: 2014-12-09

In one embodiment, a voltage mode driver circuit includes a first voltage adjusting circuit configured to provide an adjustable first pseudo-supply voltage to a first node based on a first supply voltage, including generating the first pseudo-supply voltage based on a first reference voltage and feedback from the first node. In this embodiment, the voltage mode driver circuit includes switching circuitry configured to selectively couple one of the first node or a second node to a first differential output terminal and a different one of the first node or the second node to a second differential output terminal based on a data signal. In this embodiment, the voltage mode driver circuit includes a current mode emphasis driver configured to selectively couple one of the first differential output terminal or the second differential output terminal to a first set of one or more current supplies and a different one of the first differential output terminal or second differential output terminal to a second set of one or more current supplies, based on one or more emphasis signals.


A memory device with a background built-in self-repair module (BBISRM) includes a main memory, an arbiter, and a redundant memory to repair a target memory under test (TMUT). The memory device also includes a background built-in self-test module (BBISTM) to identify portions of memory needing background built-in self-repair (BBISR). The BBISRM or the BBISTM can operate simultaneously while the memory device is operational for performing external accesses during field operation. The BBISR can detect and correct a single data bit error in the data stored in the TMUT. The arbiter configured to receive a read or write access memory request including a memory address, to determine if the memory address of the read or write access memory request matches the memory address mapped to the selected portion of the redundant memory, and to read or write data from the selected portion of the redundant memory, respectively.


A memory device that includes an input interface that receives instructions and input data on a first plurality of serial links. The memory device includes a memory block having a plurality of banks, wherein each of the banks has a plurality of memory cells, and wherein the memory block has multiple ports. An output interface provides data on a second plurality of serial links. A cache coupled to the IO interface and to the plurality of banks, stores write data designated for a given memory cell location when the given memory cell location is currently being accessed, thereby avoiding a collision. Memory device includes one or more memory access controllers (MACs) coupled to the memory block and one or more arithmetic logic units (ALUs) coupled to the MACs. The ALUs perform one or more operations on data prior to the data being transmitted out of the IC via the IO, such as read/modify/write or statistics or traffic management functions, thereby reducing congestion on the serial links and offloading appropriate operations from the host to the memory device.


A delay-lock loop includes two feedback loops for controlling delay elements in the delay-lock loop. The first feedback loop includes a feedback circuit for generating a feedback signal indicating a delay adjustment based on a phase difference between an input clock signal to the delay-locked loop and an output clock signal generated by the delay-locked loop. The second feedback loop includes a power regulator that generates a regulated signal by regulating a power supply using the feedback signal as a reference. The delay-lock loop further includes a variable delay circuit including a resistor-capacitor network. The variable delay circuit controls a capacitance in the resistor-capacitor network based on the feedback signal and controls a resistance of the resistor-capacitor network based on the regulated signal. In this way, variable delay circuit generates the output clock signal by delaying the input clock signal based on both the feedback signal and the regulated signal.


A delay-lock loop includes two feedback loops for controlling delay elements in the delay-lock loop. The first feedback loop includes a feedback circuit for generating a feedback signal indicating a delay adjustment based on a phase difference between an input clock signal to the delay-locked loop and an output clock signal generated by the delay-locked loop. The second feedback loop includes a power regulator that generates a regulated signal by regulating a power supply using the feedback signal as a reference. The delay-lock loop further includes a variable delay circuit including a resistor-capacitor network. The variable delay circuit controls a capacitance in the resistor-capacitor network based on the feedback signal and controls a resistance of the resistor-capacitor network based on the regulated signal. In this way, variable delay circuit generates the output clock signal by delaying the input clock signal based on both the feedback signal and the regulated signal.


Patent
MoSys, Inc. | Date: 2015-08-28

A Method and Apparatus for Randomizer has been disclosed. In one implementation a sequence of randomized connections then exclusive-OR operations and then an adder produce a randomized output.


A delay-lock loop includes two feedback loops for controlling delay elements in the delay-lock loop. The first feedback loop includes a feedback circuit for generating a feedback signal indicating a delay adjustment based on a phase difference between an input clock signal to the delay-locked loop and an output clock signal generated by the delay-locked loop. The second feedback loop includes a power regulator that generates a regulated signal by regulating a power supply using the feedback signal as a reference. The delay-lock loop further includes a variable delay circuit including a resistor-capacitor network. The variable delay circuit controls a capacitance in the resistor-capacitor network based on the feedback signal and controls a resistance of the resistor-capacitor network based on the regulated signal. In this way, variable delay circuit generates the output clock signal by delaying the input clock signal based on both the feedback signal and the regulated signal.


Patent
MoSys, Inc. | Date: 2015-09-30

System, method, and apparatus for integrated main memory (MM) and configurable coprocessor (CP) chip for processing subset of network functions. Chip supports external accesses to MM without additional latency from on-chip CP. On-chip memory scheduler resolves all bank conflicts and configurably load balances MM accesses. Instruction set and data on which the CP executes instructions are all disposed on-chip with no on-chip cache memory, thereby avoiding latency and coherency issues. Multiple independent and orthogonal threading domains used: a FIFO-based scheduling domain (SD) for the I/O; a multi-threaded processing domain for the CP. The CP is an array of independent, autonomous, unsequenced processing engines processing on-chip data tracked by SD of external CMD and reordered per FIFO CMD sequence before transmission. Paired I/O ports tied to unique global on-chip SD allow multiple external processors to slave chip and its resources independently and autonomously without scheduling between the external processors.


Patent
MoSys, Inc. | Date: 2015-09-30

System, method, and apparatus for integrated main memory (MM) and configurable coprocessor (CP) chip for processing subset of network functions. Chip supports external accesses to MM without additional latency from on-chip CP. On-chip memory scheduler resolves all bank conflicts and configurably load balances MM accesses. Instruction set and data on which the CP executes instructions are all disposed on-chip with no on-chip cache memory, thereby avoiding latency and coherency issues. Multiple independent and orthogonal threading domains used: a FIFO-based scheduling domain (SD) for the I/O; a multi-threaded processing domain for the CP. The CP is an array of independent, autonomous, unsequenced processing engines processing on-chip data tracked by SD of external CMD and reordered per FIFO CMD sequence before transmission. Paired I/O ports tied to unique global on-chip SD allow multiple external processors to slave chip and its resources independently and autonomously without scheduling between the external processors.

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