Molex Inc.

Carlsbad, CA, United States

Molex Inc.

Carlsbad, CA, United States
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Huang X.,University of Houston | Zheng J.,University of Houston | Chen J.,University of Houston | Wu X.,Molex Inc. | And 3 more authors.
IEEE International Symposium on Electromagnetic Compatibility | Year: 2014

Using absorption materials to reduce RF heating during MRI procedure is studied in this paper. Materials with different electromagnetic absorption characteristics are used to alter the EM and current distributions on the device. Consequently, the RF induced heating behaviors of external fixation devices can be reduced. Numerical and experimental studies are provided to demonstrate the potentials of reducing the RF heating for external fixation devices of using lossy materials. © 2014 IEEE.

News Article | November 7, 2016

Silicon photonics refers to the application of photonic systems using silicon as an optical medium. The silicon material used in such photonic systems is designed with sub micrometer precision and is deployed into the microphotonic components. The silicon photonics systems works at the wavelength of 1.55 micrometer that falls under the infrared spectrum and is most commonly used for optical communications. Silicon photonics combines technologies such as complementary metal oxide semiconductor (CMOS), micro-electro-mechanical systems (MEMS) and 3D Stacking. The basic operation of silicon photonics includes the transfer of data as optical rays between the computer chips. Silicon photonics is basically an approach for designing optical devices using silicon and use photons to transfer enormous data at high speeds. Additionally, this technology enables data transfer at low power consumption over an optical fiber. Moreover, silicon photonics satisfies the mounting need of high data transfer rate and enhances the capabilities such as computational and processing needs of data centers. Pressing bandwidth, cloud computing performance needs for data centers, virtualization, fast-growing internet traffic and other intensive data are the key factors driving the growth of silicon photonics market. Silicon photonics are majorly used in telecom, datacom, consumer applications (connecting laptops, PCs, HDTVs), datacenters and high performance computers, commercial video, metrology and sensors, medical, military and aerospace. Data communication is one of the major market share holders and it dwarfs all other silicon photonics application. In addition, features such as low environmental footprint, low heating of components, low operating cost, high optical functions integration, high density of interconnects, low error rate and spectral efficiency are adding value to the silicon photonics products. Thus, these factors are expected to drive the market of silicon photonics in the coming years. However, the major challenges such as technical mismatches with high volume markets and availability of substitute technologies such as vertical-cavity surface-emitting laser (VCSEL) are expected to hinder the growth of silicon photonics market. The silicon photonics based systems deploy several components such as wavelength division multiplexer filters, optical modulators, optical interconnects, silicon photonic waveguides, silicon LED's and silicon photo-detectors. The silicon photonics systems exhibits physical properties such as optical guiding and dispersion tailoring, Kerr non-linearity, two-photon absorption, free charge carrier interaction, second order non-linearity and the Raman effect. These properties govern the propagation of light through an optical medium. Silicon photonics technology is used for providing optical interconnects, optical routing and signal processing. Moreover, with technological advancement it is expected that this technology will widely be deployed for long range communication applications over the coming years. Silicon phonics finds its applications in several industries such telecommunications, IT, sensing and metrology, healthcare, consumer electronics and displays, and research and development.\ Countries with high level of technology adoption and advancement across North America and Europe are the leading markets for silicon photonics. Moreover, Asia Pacific market is expected to witness rapid technological upgrades and thus serves as an opportunity for this market in the coming years. The ongoing use of silicon for developing integrated circuits and the compatibility of silicon photonics technology with the existing fabrication techniques encourages several research institutes and large players in the electronic manufacturing industry to adopt silicon photonics technology. Leading players in silicon photonics market are Luxtera, Molex Inc., Mellanox Technologies, Northrop Grumman, Global Foundries, Altis, Texas Instruments, BAE Systems, TSMC, Avago Technologies, LightWire, Intel, Teraxion, Infinera, Color Chip, Fujitsu, Cisco, HP, IBM, NTT, Oracle, Leti, imec, ePIXfab, Scorpios Technologies, Caliopa and Aurrion among others. Persistence Market Research (PMR) is a third-platform research firm. Our research model is a unique collaboration of data analytics and market research methodology to help businesses achieve optimal performance. To support companies in overcoming complex business challenges, we follow a multi-disciplinary approach. At PMR, we unite various data streams from multi-dimensional sources. By deploying real-time data collection, big data, and customer experience analytics, we deliver business intelligence for organizations of all sizes.

Amleshi P.,Molex Inc. | Shah V.,Molex Inc. | Yang Z.,Cisco Systems | Mohan J.,National Semiconductor | Mukherjee T.,National Semiconductor
IEEE International Symposium on Electromagnetic Compatibility | Year: 2011

Designing backplane links at such high data rates requires the consideration of the interaction between active and passive components. The degree of interaction at 25 Gbps data rates requires a co-design approach with respect to active and passive blocks. In this paper, we start with modelling a 25 Gbps backplane channel in frequency domain and establish the correlation between results obtained from passive channel model and measurement. We further extend this analysis to establish correlation between chip test and chip-based simulation. In this study, we focus on the transmission performance of a 0.6-meter backplane channel operating at 25 Gbps, and expect similar performance in the presence of crosstalk with sufficiently isolated TX/RX grouping within the multi-lane backplane system. © 2011 IEEE.

Gao C.,Molex Inc. | Patel P.,Lenovo
2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015 | Year: 2015

For high speed interconnect design, trace crosstalk due to trace mis-registration can be as high as connector and vias. One should make sure such crosstalk is well managed. This paper presents the parametric study on trace crosstalk with respect to the mis-registration margin and provides some guidelines in practical system designs. © 2015 IEEE.

Wu X.,Molex Inc. | Dunham D.,Molex Inc. | Na N.,IBM | Hejase J.A.,IBM
Proceedings - Electronic Components and Technology Conference | Year: 2013

This paper introduces a novel air-dielectric via structure which can improve the interconnect signal bandwidth by reducing the impedance mismatch in vias of high speed system PCBs carrying 20 Gbps+ signals. Design methods of the proposed air-dielectric structure are presented. Using these methods a system target design impedance can be better matched thus causing reductions in the signal degradation caused by the reflections as well as propagation losses. © 2013 IEEE.

Gao C.,University of Houston | Chen J.,University of Houston | Wu X.,Molex Inc. | Amleshi P.,Molex Inc.
IEEE International Symposium on Electromagnetic Compatibility | Year: 2012

The integrated crosstalk noise (ICN) has been proposed in the IEEE 802.3ba standard to measure the crosstalk in the high-speed channel and accepted as a replacement of the ICR (Insertion Crosstalk Ratio) for channel noise estimation. As the PHY options of NRZ, PAM-4 and/or Duobinary are actively explored for higher data rate, a generalized ICN model will be needed for characterizing the channel SI performance. This paper presents the analysis of the integrated crosstalk noise (ICN) model for 10 Gb/s NRZ coding based system and generalizes the ICN model for 25 Gb/s and beyond system adopting the NRZ, PAM-4 or Duobinary coding scheme. © 2012 IEEE.

Amleshi P.,Molex Inc. | Gao C.,Molex Inc.
IEEE International Symposium on Electromagnetic Compatibility | Year: 2014

At 25Gbps and beyond, crosstalk noise can degrade a backplane channel signal quality significantly. High density interconnects can generate high crosstalk noise due to the close proximities of the components. In particular, interfacing dense chips and connectors with PCB requires dense implementation of signal via structures. Placing ground via guards can reduce the field overlap between signal via structures but this would also reduce density and create impedance discontinuities; therefore, these guarding via structures need to be placed strategically to reduce their adverse effects. In this study we analyze how near and far end crosstalk (NEXT and FEXT) within the signal via fields are affected by anti-pad, ground via, and ground plane layers. It will be shown that FEXT and NEXT can be affected differently in the presence of ground plane anti-pads. Relationships between these parameters with respect to ground anti-pads and the effectiveness of guarding via structures in reducing crosstalk will be presented. © 2014 IEEE.

Bahramzy P.,Molex Inc. | Sager M.,Molex Inc.
2010 IEEE International Symposium on Antennas and Propagation and CNC-USNC/URSI Radio Science Meeting - Leading the Wave, AP-S/URSI 2010 | Year: 2010

In the past two decades, antenna engineers have achieved impressive reductions in the size of mobile phone antennas, although physical constraints have essentially limited such reductions [1]. The design challenge posed by handset antennas is becoming more critical as networks evolve to offer a wider range of services, such as video telephony, web browsing, navigation services, entertainment etc. The increasing number of different functionalities in the mobile terminal puts great pressure on the available space for antennas, while handset designers expect that antennas can be operated successfully in close proximity to components such as cameras, ash units, loudspeakers, batteries and other hardware. The operati. © 2010 IEEE.

Dunham D.,Molex Inc. | Lee J.,Molex Inc. | McMorrow S.,Teraspeed Consulting Group | Shlepnev Y.,Simberian Inc.
DesignCon 2011 | Year: 2011

With Data rates climbing to 10-12.5 Gb/s and plans for 28 Gb/s, it becomes important to increase PCB test fixture bandwidth from the typical 20 GHz to 50 GHz. There are several vendor Vector Network Analyzers that will sweep this high, but not many PCB launch connectors that can accurately launch these high frequencies. This paper will: •Present modeling and validate data for a novel compression launch 2.4mm coaxial connector, functional up to 50GHz •Show methods for analytical modeling and measurements for optimizing the PCB launch and escape under the 2.4 mm connector •Demonstrate accurate broadband material characterization, using the method of generalized modal S-parameters, out to 50 GHz The 2.4mm design includes a compression attach center conductor that does not require a solder attach to the PCB. The 2.4mm coax design meets all the standard 2.4mm mechanical interface standards, with a VSWR of < 1.2 @ 50 GHz using back-to-back connector attachment. This paper will review EDA analytic modeling methodology and results for the integrated 2.4mm coaxial connector with several PCB layout designs. The final optimized PCB design was fabricated, measured and correlated to the analytical model.

Malucci R.D.,Molex Inc. | Panella A.P.,Molex Inc.
IEEE Transactions on Components, Packaging and Manufacturing Technology | Year: 2013

The resistance and capacitance of a typical multipoint contact interface have been used to assess the impact on high-frequency signal integrity. In the past, it has been shown how fully degraded interfaces could still provide acceptable performance for signal transfers at high data rates. In the case of fully degraded contacts, signals were shown to transfer by capacitive coupling and wave propagation. This paper focuses on the critical parameters of a capacitive-coupled interface. Moreover, the physics of the contact interface is related to contacts that rely on capacitive (as opposed to metallic) coupling and electronic tunneling. These results help define the physics and design requirements for capacitive coupling. In addition, critical performance parameters such as real contact area, film thickness, and the nature of dielectric films are defined for high-frequency signal propagation. This paper provides a contrast between the requirements for high-frequency signal transfer using capacitive coupling and electron tunneling versus traditional metallic contact. © 2011-2012 IEEE.

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