Yongin, South Korea
Yongin, South Korea

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Patent
MK Electronic Co., Hoseo University, Korea Advanced Institute of Science, Technology, Korea Institute of Industrial Technology and Korea Electronics Technology Institute | Date: 2015-06-10

Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt% to about 0.8 wt%, Pd in a range from about 0.001 wt% to about 0.1 wt%, Al in a range from about 0.001 wt% to about 0.1 wt%, Si in a range from about 0.001 wt% to about 0.1 wt%, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.


Patent
MK Electronic CO., Hoseo University, Korea Electronics Technology Institute, Korea Institute of Industrial Technology, Korea Advanced Institute of Science and Technology | Date: 2014-12-02

Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.


Patent
MK Electronic Co. | Date: 2014-07-30

A solder ball and a semiconductor device using the same are provided. In a Sn-based solder ball in which a first plating layer and a second plating layer are sequentially formed on a core ball, the second plating layer includes a SnAgCu alloy, and Ag_(3)Sn intermetallic compound (IMC) nanoparticles or AgSn compound nanoparticles exist in the second plating layer. The solder balls have high sphericity and stand-off characteristics and connection reliability so that a semiconductor device having a high degree of integration may be implemented.


Patent
MK Electronic Co. | Date: 2016-02-16

A solder ball includes about 1.0 wt % to about 2.0 wt % silver (Ag), about 4.0 wt % to about 8.0 wt % indium (In), about 10.0 wt % to about 20.0 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % deoxidizer, and the balance of tin (Sn). A melting point of the solder is about 170 C. to about 190 C.


An anode active material for a lithium secondary battery having high-capacity and high-efficient charge/discharge characteristics. The anode active material includes silicon single phases; and silicon-metal alloy phases surrounding the silicon single phases. A dopant is distributed in the anode active material, and the silicon single phases are formed through rapid-cooling solidification, and the silicon single phases have a fine microstructure due to the dopant.


An anode active material for a secondary battery includes an amount of a first element group in a range of about 0 at % (atomic percent) to about 30 at %, an amount of a second element group in a range of about 0 at % to about 20 at %, a balance of silicon and other unavoidable impurities. The first element group may include copper (Cu), iron (Fe), or a mixture thereof, and the second element group may include titanium (Ti), nickel (Ni), manganese (Mn), aluminum (Al), chromium (Cr), cobalt (Co), zinc (Zn), boron (B), beryllium (Be), molybdenum (Mo), tantalum (Ta), sodium (Na), strontium (Sr), phosphorous (P) or mixtures thereof.


A solder ball for fluxless bonding includes a solder core, a first metal layer on a surface of the solder core, and a second metal layer on the first metal layer. The first metal layer includes at least one of nickel (Ni), silver (Ag), zinc (Zn), tin (Sn), chrome (Cr), antimony (Sb), platinum (Pt), palladium (Pd), aluminum (Al), or an alloy thereof. The second metal layer includes gold (Au). As the above solder ball for fluxless bonding is in use, a solder bump having high reliability may be formed via a relatively short, low cost, and simple process.


A negative active material for a secondary battery that provides high capacity, high efficiency charging and discharging characteristics includes: a silicon single phase; and a silicon-metal alloy phase by which the silicon single phase is bounded, wherein the negative active material comprises 5 to 30 wt % of nickel, 5 to 30 wt % of titanium, and 40 to 90 wt % of silicon, the negative active material has a first peak of the silicon-metal alloy phase in an X-ray diffraction analysis spectrum, the silicon single phase is finely distributed in the silicon-metal single phase by mechanical alloying, and the first peak resulting from the (501) surface of the silicon-metal alloy phase has a greater value than the first peak resulting from the (501) surface of the silicon-metal alloy phase that is not subjected to the mechanical alloying, by 0.6 to 0.9.


An anode active material for a secondary battery is provided. The anode active material provides high-capacity, high-efficiency, charging and discharging characteristics. The anode active material for a secondary battery may include a silicon single phase and a silicon-metal alloy phase distributed around the silicon single phase. The silicon-metal alloy phase may include copper, iron, titanium and nickel.


Patent
MK Electronic Co. | Date: 2014-08-29

Provided is a metal ball fabricating apparatus for fabricating a metal ball by melting a material. The metal ball fabricating apparatus includes: a fabricating unit configured to fabricate a metal ball; and a collecting unit configured to collect the metal ball. The fabricating unit includes: a chamber configured to receive and store a material; a heating unit configured to apply heat to melt the material in the chamber; an orifice disposed at a lower portion of the chamber to which a metal ball droplet drops; a piston disposed over the orifice to generate a metal ball droplet; and a purifying system configured to remove a foreign substance from the material.

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