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Patent
Mitsuboshi Diamond Industrial Co. | Date: 2015-04-17

Two glass substrates are fused using a simple method and a simple apparatus configuration without deformation of processed end surfaces. This method for fusing glass substrates is a method in which two glass substrates in close contact are irradiated with a laser beam and fused together, and includes a first step and a second step. In the first step, a first glass substrate and a second glass substrate are brought into close contact. In the second step, the first glass substrate and the second glass substrate are melted and fused together by scanning a laser beam having a wavelength of 2.7 m or more and 6.0 m or less along a portion where the first and second glass substrates are in close contact.


Patent
Mitsuboshi Diamond Industrial Co. | Date: 2017-02-08

A cutter edge (51) is pressed against a brittle-material substrate (4) so that a protruding portion (PP) of the cutter edge (51) is positioned between a first edge (ED1) of the brittle-material substrate (4) and a side portion (PS) of the cutter edge (51) and that a side portion (PS) of the cutter edge (51) is positioned between the protruding portion (PP) of the cutter edge (51) and a second edge (ED2) of the brittle-material substrate (4). A scribe line is formed by a scratch between a first position closer to the first edge of the first and second edges (ED1, ED2) and a second position closer to the second edge (ED2) of the first and second edges (ED1, ED2). After the formation of the scribe line, a crack is extended in a thickness direction (DT) from the second position toward the first position along the scribe line, thus forming a crack line.


Patent
Mitsuboshi Diamond Industrial Co. | Date: 2017-04-05

A cutter edge (51) is caused to slide to generate a plastic deformation on a first surface (SF1) of a brittle substrate (4), thus forming a trench line (TL). The trench line (TL) is formed so as to obtain a crack-free state in which the brittle substrate (4) seamlessly continues in a direction intersecting the trench line (TL) directly below the trench line (TL). The crack-free state is then maintained. A crack of the brittle substrate (4) in its thickness direction is extended along the trench line (TL) to form a crack line (CL). The brittle substrate (4) is divided along the crack line (CL).


Patent
Mitsuboshi Diamond Industrial Co. | Date: 2017-03-08

Two glass substrates are fused using a simple method and a simple apparatus configuration without deformation of processed end surfaces. This method for fusing glass substrates is a method in which two glass substrates in close contact are irradiated with a laser beam and fused together, and includes a first step and a second step. In the first step, a first glass substrate and a second glass substrate are brought into close contact. In the second step, the first glass substrate and the second glass substrate are melted and fused together by scanning a laser beam having a wavelength of 2.7 m or more and 6.0 m or less along a portion where the first and second glass substrates are in close contact.


Patent
Mitsuboshi Diamond Industrial Co. | Date: 2015-03-20

A first head unit 31A has a tool holder 44 movably in a z axis direction on a base 42 through a linear guide 43. Similarly, a second head unit 31B has a tool holder 48 movably in the z axis direction on a base 46 through a linear guide 47. The interval Wa2 in an x axis direction between the tool and the linear guide of the head unit 31A and the interval Wb2 in the x axis direction between the tool and the linear guide of the head unit 31B are different from each other. When alternately arranging the head units 31A and 31B, displacing the positions of the linear guides 43 and 47 from each other to prevent interference makes it possible to narrow a pitch between the head units.


Patent
Mitsuboshi Diamond Industrial Co. | Date: 2016-02-03

An optical fiber (6) includes a first optical fiber body (61), a second optical fiber body (62) and a first end cap (63). The first optical fiber body (61) includes a first core (611) and a first cladding (612) . The second optical fiber body (62) includes a second core (621) and a second cladding (622), and is joined at a first end surface (623) thereof to a first end surface (613) of the first optical fiber body (61). The first end cap (63) has light permeability and is joined to a second end surface (624) of the second optical fiber body (62). The first core (611) is doped with a laser medium. A mass content of the laser medium in the second core (621) is lower than that of the laser medium in the first core (611).


Patent
Mitsuboshi Diamond Industrial Co. | Date: 2015-01-14

A circumference of a scribing wheel is ground in a V-shape, and a diamond film is formed on a ground surface. Then, performing rough grinding so as to make a zonal area including the ridge line at the tip of the V-shape have an apex angle 2 forms a ground surface 15. Further, performing final grinding of a zonal area including the ridge line of the ground surface 15 until the arithmetic average roughness of a ground surface 16 becomes 0.03 m or less forms the ground surface 16 having an apex angle of 3. Doing so can reduce irregularities of the ridge line and tilted surfaces of the blade edge to improve the end surface strength of a brittle material substrate after scribing.


Patent
Mitsuboshi Diamond Industrial Co. | Date: 2015-04-29

A groove machining head has a dust collecting hood 40 having a suction port in the vicinity where tools 32 protrude from a bottom plate 33 of the groove machining head. When performing groove machining on a substrate W using the groove machining head 30, a blower 35 sucks air inside the dust collecting hood 40 through ducts 34. Doing so can suck dust produced by the groove machining through the suction port of the dust collecting hood 40 before attachment of the dust on the substrate W.


Patent
Mitsuboshi Diamond Industrial Co. | Date: 2015-03-25

The invention concerns a method for manufacturing a cutter wheel (10C) for scribing a brittle material substrate, having the steps of forming a blade edge on a wheel (10A) in a disc form by roughly grinding the blade edge at at least one blade edge angle 1 and then forming the edge side of said blade (10B) by finely grinding the blade edge at a blade edge angle 2 which is different from blade edge angle 1. The invention further concerns a cutter wheel (10C).


Provided is a scribing method capable of forming a vertical crack with a high penetration amount in a thick glass plate and, in cutting thereafter, suppressing the occurrence of chipping or cracking in the thick glas splate. A scribing wheel, in which a blade edge angle is 150 or more and 160 or less and a tip portion of a blade edge is a curved surface whose radius of curvature in a cross section passing through a central axis is 9 m or more and 40 m or less, is prepared. Then, with the thick glass plate placed on a highly rigid table, being horizontally supported, the surface of the thick glass plate is scribed by causing the scribing wheel to roll in a predetermined scribe-line forming direction while causing the blade edge of the scribing wheel to abut the surface of the thick plate glass while applying a scribing load adjusted to a value predetermined in advance in accordance with a quality of material and a thickness of the thick glass plate to be applied from the blade edge to the thick glass plate .

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