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Patent
Mitsubishi Materials Corporation | Date: 2017-04-12

This sectional hob is provided with: a cylindrical hob body; a plate-shaped blade having a saw-toothed cutting edge, the blade being disposed in at least one attachment seat formed in an outer peripheral part of the hob body such that a direction of the cutting edge is parallel to a center axis direction of the hob body; and a plurality of wedge members configured to detachably-fix the blade disposed in the attachment seat to the hob body, the wedge members being installed in a recess formed on the outer peripheral part of the hob body, wherein the recess is adjacent to the attachment seat in a circumferential direction of the hob body, and the plurality of the wedge members are disposed in a line in the center axis direction in the recess.


Patent
Mitsubishi Materials Corporation | Date: 2016-03-25

A ferroelectric film a plurality of fired films is provided. Each of the plurality of fired films is made of metal oxide in a perovskite structure including Pb, Zr, and Ti, a total content of Li, Na, and K in the each of the plurality of fired films is 3 mass ppm or less, and the total content of Li, Na, and K on one surface of each of the plurality of fired films is 5 times or more of the total concentration of Li, Na, and K on other surface of each of the plurality of fired films.


Patent
Mitsubishi Materials Corporation | Date: 2016-10-05

A clay-like composition for forming a sintered precious metal body, the clay-like composition containing at least one powder selected from the group consisting of precious metal powders and precious metal alloy powders, an organic binder, an organic additive and water, wherein the clay-like composition has an initial hardness measured using a type E durometer of E8 to E20, and has a hardness after standing for one hour at room temperature of E40 or less.


Patent
Mitsubishi Materials Corporation | Date: 2016-04-20

As one aspect, a copper alloy for an electronic device is provided wherein the copper alloy is composed of a ternary alloy of Cu, Mg, and Zn, the ternary alloy comprises Mg at a content in a range of 3.3 to 6.9 atomic% and Zn at a content in a range of 0.1 to 10 atomic%, with a remainder being Cu and inevitable impurities, and a conductivity (%IACS) is within the following range when the content of Mg is given as A atomic% and the content of Zn is given as B atomic%, As another aspect, a copper alloy for an electronic device is provided wherein the copper alloy is composed of a ternary alloy of Cu, Mg, and Zn, the ternary alloy comprises Mg at a content in a range of 3.3 to 6.9 atomic% and Zn at a content in a range of 0.1 to 10 atomic%, with a remainder being Cu and inevitable impurities, and an average number of intermetallic compounds having grain sizes of 0.1 m or more is in a range of 1/m^(2) or less.


This aluminum sintering material is an aluminum sintering material that is used for producing a porous aluminum sintered compact in which a plurality of aluminum base materials are sintered together, and the aluminum sintering material includes: the aluminum base materials; and a plurality of titanium powder particles fixed to outer surfaces of the aluminum base materials, wherein the titanium powder particles are composed of either one or both of metallic titanium powder particles and hydrogenated titanium powder particles.


Patent
Mitsubishi Materials Corporation | Date: 2016-01-20

The inner bit (3) is provided with: a supply hole which is open at the distal end portion of the inner bit (3); and a discharge groove (14) which is formed in an outer peripheral surface of the inner bit (3) and extends in the direction of the axial line. The supply hole is provided with: a distal end blow hole (15) which is open in a distal end surface of the distal end portion of the inner bit (3); and an outer peripheral blow hole (16) which is open in an outer peripheral surface of the distal end portion of the inner bit (3). An outer peripheral groove (19) via which the outer peripheral blow hole (16) communicates with the discharge groove (14) is formed in the outer peripheral surface of the inner bit (3). The outer peripheral groove (19) is covered with the ring bit from the outside in a radial direction and extends so as to be closer to the base end side in the direction of the axial line around the axial line toward the discharge groove (14) from the outer peripheral blow hole (16).


Patent
Mitsubishi Materials Corporation | Date: 2016-07-09

A packing box including lattice members which are arranged in a stacked state into stages, a stage-partition plate which is arranged between the stages of the lattice members, two or more inner tubular-trunk frames which are provided in a stacking direction of the lattice members to surround one or more stages of the lattice members, an outer tubular-trunk frame surrounding an outside of two or more stages of the inner tubular-trunk frames, a bottom lid which is arranged under the outer tubular-trunk frame, and a top lid which is arranged on the outer tubular-trunk frame.


Patent
Mitsubishi Materials Corporation | Date: 2016-08-17

Provided are a sputtering target composed of a Cu-Ga sintered compact that has a further reduced oxygen content and can suppress abnormal discharges, and a method for producing the same. The sintered compact has a component composition containing a Ga content of 20 at% or higher and less than 30 at% with the balance being Cu and inevitable impurities, and has an oxygen content of 100 ppm or lower and an average grain size of 100 m or less, and exhibits the diffraction peaks assigned to the and phases of CuGa as observed in X-ray diffraction, wherein the main peak intensity of the diffraction peaks assigned to the phase is 10% or higher relative to that of the diffraction peaks assigned to the phase.


Patent
Mitsubishi Materials Corporation | Date: 2016-06-08

The present invention provides a sputtering target of a Cu-Ga sintered body in which the oxygen content is further reduced and the abnormal discharging can be suppressed, and a method for producing the same. The sputtering target according to the present invention is a sintered body having: a texture in which Na compound phases are dispersed in a matrix with a phase and a phase of a Cu-Ga alloy; and a component composition made of: 20 atomic% to 30 atomic% of Ga; 0.05 atomic% to 10 atomic% of Na; and the Cu balance and inevitable impurities including elements other than Na in the Na compound, wherein an average grain size of the phase is 30 m to 100 m, and an average grain size of the Na compound phases is equal to or less than 8.5 m.


Patent
Mitsubishi Materials Corporation | Date: 2016-07-06

The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu-P-Sn-based brazing filler material and a Ti material, wherein a Cu-Sn layer, in which Sn forms a solid solution with Cu, is formed at a bonded interface between the ceramic member and the Cu member, and intermetallic compounds containing P and Ti are dispersed in the Cu-Sn layer.

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