and Technology, United States
and Technology, United States

Time filter

Source Type

This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is given as X at %, an electrical conductivity (% IACS) is in a range of {1.7241/(0.0347X^(2)+0.6569X+1.7)}100, and a stress relaxation rate at 150 C. after 1,000 hours is in a range of 50% or less.


Patent
Mitsubishi Shindoh Co. and Mitsubishi Materials Corporation | Date: 2016-10-19

A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0([Co]0.007)/([P]0.008)6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.


A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.


Patent
Mitsubishi Materials Corporation | Date: 2017-05-10

A porous aluminum heat exchanger (60, 70, 80, 90) including: a porous aluminum body (22) in which aluminum substrates (31) are sintered each other; and a bulk body, which is an aluminum bulk body (21) made of aluminum or aluminum alloy is provided. Pillar-shaped protrusions (32) projecting toward an outside are formed on outer surfaces of the aluminum substrates (31), and pores of the porous aluminum body (22) are configured to form flow channels of a heat medium.


A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass% or higher and 99.9 mass% or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400C or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.


Patent
Nagoya University, Mitsubishi Group and Mitsubishi Materials Corporation | Date: 2017-04-26

A virtual plane obtained by a locus when a tangent line, which passes through a tool distal end edge, of a virtual circle formed when a tool distal end edge of a cutting edge is rotated in a tool circumferential direction is moved parallel to a tool axial line is a reference plane, an angle (ARt) at which a cross line of the reference plane and the cutting edge virtual plane, is inclined with respect to the tool axial line projected onto the reference plane, is in a range of -30 degrees to -60 degrees, an angle (RR) at which a cutting edge tangent line which passes through the tool distal end edge and extends outward in a tool radial direction, is inclined with respect to a predetermined tool radial direction, which passes through the tool distal end edge, is in a range of -30 degrees to -75 degrees.


Patent
Mitsubishi Materials Corporation | Date: 2017-05-10

In a power-module substrate unit 51, a circuit layer 12 is structured by a plurality of small circuit layers 12S; a ceramic substrate layer 11 is structured by at least one plate; the small circuit layers 12S are formed to have a layered structure having a first aluminum layer 15 bonded on one surface of the ceramic substrate layer 11 and a first copper layer 16 bonded on the first aluminum layer 15 by solid diffusion; a radiation plate 30 is made of copper or copper alloy; the metal layer 13 and the radiation plate 30 are bonded by solid diffusion, and a ratio (t1 A1 1) / (t2 A2 2) is not smaller than 0.80 and not larger than 1.20 where a thickness is t1 (mm), a bonding area is A1 (mm^(2)), and an yield stress is 1 (N/mm^(2)) of the first copper layer 16; a thickness at a bonding position to the metal layer is t2 (mm), a bonding area is A2 (mm^(2)), and an yield stress of the radiation plate 30 is 2 (N/mm^(2)).


A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400 C. or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.


A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.


Patent
Mitsubishi Materials Corporation and Mitsubishi Materials Electronic Chemicals Co. | Date: 2015-03-31

A novel fluorine-containing silane compound is provided. The fluorine-containing silane compound is capable of providing excellent water repellency and oil repellency, and is useful as a fluorine-containing silane coupling agent with applicability to a wide variety of applications, even if it has a chemical structure, which is free of a perfluoroalkyl group of 8 or more of carbon atoms; and has no risk of formation of PFOS or PFOA causing bioaccumulation potential and environment adaptability problems. A fluorine-containing silane compound containing at least one of each of a nitrogen-containing perfluoroalkyl group and an alkoxysilyl group in the molecule is selected.

Loading Mitsubishi Materials Corporation collaborators
Loading Mitsubishi Materials Corporation collaborators