Aliso Viejo, CA, United States
Aliso Viejo, CA, United States

Microsemi Corporation is a manufacturer of defense, security, aerospace, enterprise, communications, medical, alternative energy, and industrial products for power-related applications. Major products offered by Microsemi are analog devices, mixed-signal and RF integrated circuits, customizable system-on-chips , FPGAs, and complete subsystems. It has been based in Aliso Viejo, California since 2011, when it relocated its headquarters from Irvine, California. Microsemi has plants in California, Arizona, Massachusetts, Texas, Florida, Ireland, China and Canada. Wikipedia.


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A method for detecting failure of speed measurement of a multi-phase AC motor includes (1) sensing current drawn by the motor, (2) sensing voltage magnitude supplied to the motor, (3) measuring motor speed, (4) calculating motor speed, (5) determining whether the difference between the measured motor speed and the calculated motor speed is greater than a predetermined threshold, if the difference between the measured motor speed and the calculated motor speed is not greater than a predetermined threshold, repeating (1) through (5), if the difference between the measured motor speed and the calculated motor speed is greater than a predetermined threshold, indicating a fault, if a fault is indicated, performing a predetermined number of restart attempts, if the motor is successfully restarted, repeating (1) through (5), if the motor is not successfully restarted, indicating a restart failure.


Patent
Microsemi | Date: 2016-08-09

The present disclosure provides a method and system for dynamically migrating a port in a PCIe switch. The PCIe switch comprises emulated P2P bridges stored in a memory and a processor to load the emulated P2P bridge address range values from the memory to a routing table. The processor can configure the routing table so that the P2P bridges can be remapped to various physical ports of the switch. Therefore, a device connected to a physical port may be migrated from one host to another, via the operations of the processor.


Patent
Microsemi | Date: 2016-08-09

Various high voltage systems may benefit from a suitable relay system. For example, a relay box may be provided with a shock and vibration resistant arrangement including a sealed coil box within the sealed relay box. For example, an apparatus can include a coil box containing coils, inside pole pieces, and permanent magnets, wherein the coils, inside pole pieces, and permanent magnets can be configured to actuate an armature assembly external to the coil box. The apparatus can also include outside pole pieces configured to move a relay armature of the armature assembly responsive to energizing of the coils. Moving the relay armature can include overcoming a latching of at least one of the permanent magnets.


Patent
Microsemi | Date: 2016-08-09

Various high voltage systems may benefit from a suitable relay system. For example, a relay box may be provided with a shock and vibration resistant arrangement including a sealed coil box within the sealed relay box. For example, an apparatus can include a coil box containing coils, inside pole pieces, and permanent magnets, wherein the coils, inside pole pieces, and permanent magnets can be configured to actuate an armature assembly external to the coil box. The apparatus can also include outside pole pieces configured to move a relay armature of the armature assembly responsive to energizing of the coils. Moving the relay armature can include overcoming a latching of at least one of the permanent magnets.


The present disclosure provides methods and apparatus for dynamically adjusting the common mode voltage at the LC tank node and/or the power supply voltage of a VCO with an LC resonator in order to force oscillation start-up by temporarily increasing gain. Methods according to certain preferred embodiments may reduce power consumption and/or overcome threshold voltage limitations and/or increase frequency and frequency tuning range during normal (steady-state) operation.


Grant
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: FETPROACT-01-2016 | Award Amount: 4.94M | Year: 2017

This consortium will pioneer disruptive technology for bio-electronic medicine to provide much needed therapies for cardiorespiratory and functional neurological disease. The technology implements small neural networks known as central pattern generators (CPG) to deliver fit-and-forget bio-electronic implants that respond to physiological feedback in real time, are safer, simpler, non-invasive, and have autonomy exceeding the patient lifespan. Multichannel neurons will be made to compete on analogue chips to obtain flexible motor sequences underpinned by a wide parameter space. By building large scale nonlinear optimization tools and using them to assimilate electrophysiological data, we will develop a method for automatically finding the network parameters that accurately reproduce biological motor sequences and their adaptation to multiple physiological inputs. In this way, we will have resolved the issue of programming analogue CPGs which has long been the obstacle to using neural chips in medicine. An adaptive pacemaker will be constructed, tested, validated and trialled on animal models of atrio-ventricular block and left bundle branch block to demonstrate the benefits of heart rate adaptation, beat-to-beat cardiac resynchronization and respiratory sinus arrhythmia. By providing novel therapy for arrhythmias, heart failure and their comorbidities such as sleep apnoea and hypertension, CResPace will extend patients life and increase quality of life.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: FoF-12-2015 | Award Amount: 6.34M | Year: 2015

The total EU electronics industry employs 20.5 million people, sales exceeding 1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 m and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double component density will be achieved. Consequently, this would effectively enable more than a doubling of the functions available on electronic devices such as cell phones, satellite navigation systems, health devices etc. The successful completion of the FineSol project would lift the ultra-miniaturisation/functionality road block and also enable reduction in raw material usage, reduction in WEEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: FOF-03-2016 | Award Amount: 6.04M | Year: 2016

Manufacturing represents approximately 21 % of the EUs GDP and 20 % of its employment, providing more than 30 million jobs in 230 000 enterprises, mostly SMEs. Moreover, each job in industry is considered to be linked to two more in related services. European manufacturing is also a dominant element in international trade, leading the world in areas such as automotive, machinery and agricultural engineering. Already threatened by both the lower-wage economies and other high-tech rivals, the situation of EU companies was even made more difficult by the downturn. The Z-Fact0r consortium has conducted an extensive state-of-the-art research (see section 1.4) and realised that although a number of activities (see section 1.3) have been trying to address the need for zero-defect manufacturing, still there is a vast business opportunity for innovative, high-ROI (Return on Investment) solutions to ensure, better quality and higher productivity in the European manufacturing industries. The Z-Fact0r solution comprises the introduction of five (5) multi-stage production-based strategies targeting (i) the early detection of the defect (Z-DETECT), (ii) the prediction of the defect generation (Z-PREDICT), (iii) the prevention of defect generation by recalibrating the production line (multi-stage), as well as defect propagation in later stages of the production (Z-PREVENT), (iv) the reworking/remanufacturing of the product, if this is possible, using additive and subtractive manufacturing techniques (Z-REPAIR) and (v) the management of the aforementioned strategies through event modelling, KPI (key performance indicators) monitoring and real-time decision support (Z-MANAGE). To do that we have brought together a total of thirteen (13) EU-based partners, representing both industry and academia, having ample experience in cutting-edge technologies and active presence in the EU manufacturing.


Grant
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: ICT-02-2014 | Award Amount: 2.99M | Year: 2015

Chronic wounds represent a significant burden to patients, health care professionals, and health care systems, affecting over 40 million patients and creating costs of approximately 40 billion annually. Goal of the project is the fabrication of a medical device for professional wound care. The device will use recently proven therapeutic effects of visible light to enhance the self-healing process and monitor the status and history of the wound during therapy. Light exposure in the red part of the spectrum (620-750nm) induces growth of keratinocytes and fibroblasts in deeper layers of the skin. The blue part of the spectrum (450495nm) is known to have antibacterial effects predominantly at the surface layers of the skin. In order to be compliant with hygiene requirements the system will consist of two parts: 1. a disposable wound dressing with embedded optical waveguides and integrated sensors for the delivery of light and monitoring (temperature and blood oxygen) of the wound. 2. a soft and compliant electronic module for multiple use containing LEDs, a photodiode, a controller, analog data acquisition, a rechargeable battery, and a data transmission unit. Both parts of the device will be interconnected by a mechanically robust plug, enabling a low loss coupling of light into the waveguide structures and electrical interconnection to the sensors. The status of the wound will be monitored with temporal and low level spatial resolution. The electronic module will be optimized for functionality and user comfort, combining leading edge heterogeneous integration technologies (PCB embedding) and stretchable electronics approaches. The detailed effects of light-exposure schemes will be explored and backed by in-vitro and in-vivo animal studies. Results will be used to develop smart algorithms and implement it into respective programs and feedback loops of the device.


Grant
Agency: GTR | Branch: Innovate UK | Program: | Phase: Collaborative Research & Development | Award Amount: 793.57K | Year: 2016

NEMICA is a UK collaborative research and development project between Microsemi, Moog and the Universities of Bristol and Southampton. The project aims to develop reprogrammable memories and gate arrays based on Nano-Relay technology that are capable of withstanding long term exposure to 225oC and/or 100Mrads. The primarily target application will be avionic actuator systems but the technology has markets in space, transportation and down hole drilling.

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