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Freiburg, Germany

Patent
Micronas GmbH | Date: 2015-04-10

A sensor device is provided for suppressing a magnetic stray field, having a semiconductor body with a surface formed in an x-y plane, the x-direction and the y-direction are formed orthogonal to one another, and the sensor device has a first pixel cell and a second pixel cell integrated into the surface of the semiconductor body. A first magnetic field sensor detects a magnetic field in the x-direction and a second magnetic field sensor detects a magnetic field in the y-direction. The two pixel cells in a projection along an imaginary lengthening of the axis are arranged at an edge or next to an extension of the magnet in the x-y plane.


Patent
Micronas Gmbh | Date: 2015-07-29

An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.


Patent
Micronas Gmbh | Date: 2015-03-31

A sensor device for suppressing a magnetic stray field, having a semiconductor body, a first pixel cell and a second pixel cell integrated into a surface of the semiconductor body together with a circuit arrangement. Each pixel cell has a first magnetic field sensor and a second magnetic field sensor to detect a magnetic field in the x-direction and a magnetic field in the y-direction. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the substrate and the semiconductor body are disposed in the same IC package. A magnet is provided that has a planar main extension surface in the direction of an x-y plane and has a magnetization with four magnetic poles in the direction of the x-y plane. The IC package is spaced apart from the main extension surface of the magnet in the z-direction and at least partially within a ring magnet.


Patent
Micronas GmbH | Date: 2015-06-22

An arrangement for testing integrated circuits includes an integrated test circuit and a cluster which has at least one integrated circuit and a second integrated circuit. The first integrated circuit is provided in a first component region of a wafer, and the second integrated circuit in a second component region. The first component region and the second component region are spaced a distance apart by a scribe line of the wafer. The integrated test circuit is connected to the first integrated circuit via a first test line section, and the second integrated circuit is connected to the first test line section via a first connecting line that has a first well in the semiconductor material, the first well extending continuously in the wafer from the first component region over the scribe line to the second component region, the first well being electrically insulated from a substrate of the wafer.


A method and an apparatus for determining a rotation angle of a rotor in a motor with the aid of angle sensors by measurement of reference values and correction of the effected computations. The method is used, for example, in a synchronous motor.

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