Micron Machinery Co.

Yamagata-shi, Japan

Micron Machinery Co.

Yamagata-shi, Japan

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Kobayashi S.,Micron Machinery Co. | Shimada K.,Tohoku University | Murakoshi C.,Micron Machinery Co. | Koike K.,Micron Machinery Co. | And 3 more authors.
International Journal of Automation Technology | Year: 2013

Conventional methods of grinding tend to be less efficient and less accurate for circumferential surfaces of smaller inner diameter. To make such grinding highly accurate and highly efficient, we have developed an Ultrasonically-Assisted Grinding Unit (UAG-Unit) by providing ultrasonic assistance to conventional internal grinding. In addition, we have also developed an Ultrasonic and Electrolytic Grinding System (UEG-System), which incorporates the effects of both ultrasonic vibrations and electrolytic actions into the conventional grinding of parts with small internal diameters and high aspect ratios.


Hashimoto F.,Timken Co. | Gallego I.,University of Mondragon | Oliveira J.F.G.,IPT | Barrenetxea D.,Scoop Inc | And 5 more authors.
CIRP Annals - Manufacturing Technology | Year: 2012

This paper reviews the history of centerless grinding and its contribution to industry. It summarizes the evolution of centerless grinding theory including advanced modeling and simulation. Then, it discusses the design of main elements of a centerless grinding machine such as spindles, bed, guideways and positioning system, and provides design guidelines for future machines. The paper presents the state-of-the-art centerless grinding technologies: advanced machines, advanced process monitoring and the latest developments in grinding wheels. Finally, in conclusion, future trends and research work in centerless grinding technology are discussed. © 2012 CIRP.


Xu W.,University of New South Wales | Wu Y.,Akita Prefectural University | Fujimoto M.,Akita Prefectural University | Tachibana T.,Micron Machinery Co.
International Journal of Abrasive Technology | Year: 2012

This paper proposes a novel centreless grinding method for machining ceramic balls using a surface grinder. In this method, a compact unit consisting of an ultrasonic shoe, an ultrasonic regulator, a relay controller, a blade, a stopper and their respective holders is installed on the worktable of a surface grinder to conduct centreless grinding operations. The grinding unit was actually constructed and it was experimentally confirmed that the rotational speeds of the ball around its own two axes, one is parallel to the wheel axis and another parallel to the wheel radius, can be controlled well, respectively, by the elliptic motions occurring on the shoe and regulator end-faces. Then, the grinding experiments validated the proposed technique and revealed that the grinding accuracy is significantly affected by the relay switch 'on' and 'off' times, and the ball cross-section roundness was improved from the initial value of 10.13 μm to the final one of 0.88 μm under the optimal grinding conditions. Copyright © 2012 Inderscience Enterprises Ltd.


Wu Y.,Akita Prefectural University | Xu W.,Akita Prefectural University | Fujimoto M.,Akita Prefectural University | Tachibana T.,Micron Machinery Co.
Advanced Materials Research | Year: 2011

This paper proposes a novel method for machining ceramic balls by centerless grinding technique performed on a surface grinder. In this method, a compact unit consisting mainly of an ultrasonic shoe, an ultrasonic regulator, a relay controller, a blade, a stopper and their respective holders is installed on the worktable of a surface grinder to conduct centerless grinding operations of ceramic balls. The ultrasonic shoe and regulator are produced by bonding a piezoelectric ceramic device (PZT) onto a metal elastic body, and when two phases of AC voltage are applied to the PZT an elliptic motion occurs on their end-faces which can be used to control the ball rotational motion in the radial and axial direction of the wheel, respectively. The function of the relay controller is to regulate the alternating current "on" and "off" time which is applied on the regulator for achieving the whole spherical surface grinding process. A grinding unit was actually constructed and it was experimentally confirmed that the ball rotational speed can be controlled well by the shoe or regulator. Grinding tests were subsequently carried out and the obtained results indicated that the constructed grinding unit performed well on actual ball centerless grinding operations. © (2011) Trans Tech Publications, Switzerland.


To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm.


Patent
Micron Machinery Co. | Date: 2014-08-29

Some implementations of the described invention provide an improved centerless grinding apparatus in which grinding is efficiently operated by reducing the idle time of the grinding wheel. While the described apparatus can comprise any suitable feature, in some cases, it includes a first regulating wheel and a second regulating wheel are axially aligned side by side. In some cases, a first grinding area is provided between the first regulating wheel and a first blade. In some cases, a second grinding area is provided between the second regulating wheel and a second blade. Additionally, in some cases, a grinding wheel is mounted on a grinding wheel Z-slide to be moved reciprocatively between the first grinding area and the second grinding area. In this way, grinding is efficiently operated by reducing the idle time of the grinding wheel.

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