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Agency: Cordis | Branch: FP7 | Program: BSG-SME | Phase: SME-2011-1 | Award Amount: 1.47M | Year: 2012

Nutri-Stat addresses the need of SMEPs with a cost-effective and real-time soil nutrient sensing system using ISEs integrated in an LTCC based micro Total Analysis System. The technological device will be composed of a complex soil probe combined with a data-logger for the measurement and recording of the concentration of the macronutrients Nitrogen (N), Phosphorus (P) and Potassium (K) present in the soil. Nutri-Stat will also read electrical conductivity and pH levels in soil. The Nutri-Stat system shall also feature user-friendly software to assist in soil nutrient management. The positive impacts of this tool will contribute to environmental and financial sustainability, whilst significantly improving the quality standards of agricultural produce across the EU. Nutri-Stat will provide farmers with constant monitoring of fields, tailored crop analysis and disease management, making information on the nutrient status of arable land for the first time ever, easily accessible and available to the farmer anytime anywhere.

Agency: Cordis | Branch: FP7 | Program: CP-IP | Phase: HEALTH-2009-1.2-3 | Award Amount: 16.85M | Year: 2010

The SUBLIMA project aims at truly simultaneous, fully integrated, solid-state PET/MR technology for concurrent functional and anatomical imaging with unsurpassed image quality. It will combine the extremely sensitive functional imaging possibilities provided by PET with the excellent soft-tissue contrast and complementary functional imaging capabilities of MR. For the first time, time-of-flight (ToF) and depth-of-interaction (DoI) correction will be introduced together into a PET/MR system. SUBLIMA will also be the first to exploit the unique advantages of truly simultaneous PET/MR acquisition by enabling fully 4D MR-derived motion correction. Furthermore, artefacts seen in PET-CT will be eliminated by developing MR-based, motion-compensated PET attenuation correction. The SUBLIMA platform will thus realize a breakthrough in image quality and enable novel applications in oncology, cardio-vascular medicine, and neuro-degenerative diseases. SUBLIMA will not only introduce new methods and technologies in each important component of the imaging chain, but it will also analyse the system performance as a function of all relevant design parameters, in order to push the image quality to the physical limits by optimally merging these innovations into 7T preclinical and 3T whole-body human demonstrator systems. This integrated approach also warrants adaptation of the project results for optimum performance in stand-alone PET and SPECT applications. The consortium, lead by Philips, consists of universities, research institutes, industrial partners, and SMEs, spread over 7 different countries including the USA. While each partner has shown exceptional quality in its own field, the consortium brings together the wide and complementary range of expertise necessary to push the performance of ToF-PET/MR to the physical limits.

Agency: Cordis | Branch: FP7 | Program: CP-IP | Phase: NMP-2007-3.5-2 | Award Amount: 9.03M | Year: 2008

Various emerging markets in the field of non silicon multimaterial micro devices offer a huge potential for commercialisation in the near future. However, solutions for mass-production for most of them have still to be developed. The objective of the MULTILAYER project is to develop a set of solutions for the large-scale production of micro devices based on a technology we call Rolled multi material layered 3D shaping technology and using the concept of tape casting and advanced printing techniques. This technology will enable to manufacture complex multifunctional 3D-micro parts on a layer by layer manner and in a high-throughput context. Each layer can be given a specific structure. They will be printed and contain channels and cavities that are open or filled in a very high precision manner. The microsystems will have as basic building material ceramics, which is a clear advantage in applications that require high temperature, corrosive environments and long time reliability. Furthermore, it will allow spatial resolutions under 10 m and the ceramics tapes developed will be down to 10 m thin. The Rolled multi material layered 3D shaping technology will have several advantages: - it will be an efficient mass production method - the fabrication series can attain over a million units - it will offer a good flexibility for a wide variety possible component designs, - it will allow the integration of different materials as different layers enabling to manufacture multimaterial multilayered packages with a high degree of integration, - the process will be very reliable, indeed, every single layer can be advantageously inspected and controled

Dohle R.,Micro Systems Engineering GmbH | Petzold M.,Fraunhofer Institute for Mechanics of Materials | Klengel R.,Fraunhofer Institute for Mechanics of Materials | Schulze H.,Micro Systems Engineering GmbH | Rudolf F.,TU Dresden
Microelectronics Reliability | Year: 2011

The purpose of this work is to evaluate the feasibility of room temperature wedge-wedge bonding using commercially available copper wires, coated with aluminum. Bonding quality, reliability and aging resistance of the wire bonds have been investigated using standard wire pull tests immediately after bonding and after accelerated life tests, including temperature storage at 125 °C, 150 °C, and 200 °C for up to 2000 h. Using focused ion beam (FIB-) preparation and high resolution electron microscopy (SEM, TEM combined with EDX X-ray analysis), results of microstructure investigations of the Al-coating/Cu wire interface as well as of the bonding interconnect formed between the coated wire and the metallization on ceramic substrate will be presented. These investigations provide background information regarding the binding mechanisms and material interactions, and contribute to assess and to avoid potential reliability risks. Due to the found advantageous bond processing behavior and increased reliability properties, our results indicate that room temperature wedge-wedge bonding of coated copper wires has a remarkable application potential, for instance in medical and other high reliability as well as high power applications. It combines all known advantages of usual copper bonding like excellent contacting behavior, high reliability and favorable material price with the possibility of processing temperature damageable components and considerable improved storage capability. Therefore, room temperature bonding using coated copper wire can also reduce cycle time, manufacturing and material costs. © 2010 Elsevier Ltd. All rights reserved.

Faddoul R.,CNRS Structural Engineering | Reverdy-Bruas N.,CNRS Structural Engineering | Blayo A.,CNRS Structural Engineering | Haas T.,Micro Systems Engineering GmbH | Zeilmann C.,Micro Systems Engineering GmbH
Microelectronics Reliability | Year: 2012

The originality of this work consists in printing on ceramic tapes conductive silver tracks that reach a low resistivity by flexography process. Flexography is a solution for the mass production of multimaterial microdevices offering a huge potential of commercialisation in the near future. In order to test the flexography printing process for microelectronic application on Low Temperature Cofired Ceramic (LTCC) tapes, a screen printing paste was optimised to reach flexography printing requirements. Ink with 30% silver per weight was prepared and printed by flexography, roll to roll (R2R) process, on LTCC substrates. Three to five print passes were performed. Printed lines were sintered during 10 min at a peak temperature of 850°C under normal air atmosphere. Conductive lines, with a mean width of 190 μm, a mean thickness of 1.50 μm and a resistivity of 2.8 × 10 -8 Ω m close to bulk silver resistivity, were achieved after sintering. © 2012 Elsevier Ltd. All rights reserved.

Harter S.,Friedrich - Alexander - University, Erlangen - Nuremberg | Dohle R.,Micro Systems Engineering GmbH | Reinhardt A.,Friedrich - Alexander - University, Erlangen - Nuremberg | Gossler J.,Micro Systems Engineering GmbH | Franke J.,Friedrich - Alexander - University, Erlangen - Nuremberg
Proceedings - Electronic Components and Technology Conference | Year: 2012

The ongoing trend to miniaturized electronics has induced many developments towards size reduction and increasing performance in electronic products. To meet these requirements the involved processes, materials and components in electronics production have to be enhanced for high performance and high reliability. Flip-chip technology is one technology of choice with potential for highest integration. In previous investigations technologies for cost-efficient solder bumping and automated assembly in an industrial environment were evaluated. Wafer level solder sphere transfer and solder sphere jetting were adapted to provide flipchips with solder bump diameters down to 30 μm for flip-chip assembly onto printed circuit boards as well as onto thin film ceramic substrates. The reliability tests done so far showed excellent achievable reliability performance of these ultrafine-pitch assemblies under various test conditions. Since electromigration of flip-chip interconnects is a very important reliability concern, characterization of new interconnect developments needs to be done regarding the electromigration performance in accelerated life tests. For all experiments, specially designed flip-chips with 10 mm by 10 mm by 0.8 mm in size have been used. The silicon die layout provides a pitch of 100 μm with solder bump sizes between 60 μm and 30 μm in diameter. The solder spheres consist of lead-free SnAgCu alloy and are placed on a Ni-P under bump metallization which has been realized in an electroless nickel process. For the electromigration tests within this study, multiple combinations of individual current densities and temperatures were adapted to the respective solder sphere diameters. Online measurements with separate daisy chain connections for each test coupon provide exact lifetime data during the electromigration tests, which are in some cases still in progress. Cross sectioning has been employed for the analysis of thermal diffusion as well as of the impact of electromigration influence on the failure mechanism using optical, SEM and EDX analysis, respectively. Reliability plots will be discussed regarding the electromigration performance for different test conditions applied to the respective test specimen for lifetime estimations. © 2012 IEEE.

An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.

A method for producing an array formed from a multiplicity of electric integrated circuits, said array being intended for separation and having a conductive connection to a central contact path for bond monitoring, said method comprising the following steps:

Vienna University of Technology and Micro Systems Engineering GmbH | Date: 2012-07-06

A unique and cost-effective method for producing a multilayer ceramic structure by using a first green film that contains a ceramic material, and the multilayer ceramic structure produced thereby. The method including the steps of: (a) producing at least one porous region in the first green film, the at least one porous region extending from the surface of the first green film; (b) applying a first layer, in sections, to the surface of the first green film, wherein one section of the first layer is located above the at least one porous region produced in step (a); (c) positioning at least one additional green film on the surface of the first green film, to which the first layer has been applied; (d) laminating the first green film and the at least one additional green film to form a green film composite; and (e) sintering the green film composite.

The invention relates to an array (1) formed from a multiplicity of electric integrated circuits (1a), comprising a conductive connection, extending over all integrated circuits of the array, to a central contact path for bond monitoring, wherein a separation region (2) is provided in each case between adjacent integrated circuits (1a) and a separation from the array (1) is implemented along the separation region in order to separate the integrated circuits (1a). In order to avoid corrosion of electric circuits (1a) produced from the array (1), at least one conductive connection portion (3) is provided and extends between two contact paths (4), which enclose the separation region (2) and are arranged adjacent thereto, wherein the conductive connection portion (3) is formed by inert material. The invention also relates to a corresponding electric integrated circuit (1a) and also to production methods for producing an array (1) of this type and for producing an electric integrated circuit (1a) of this type.

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