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Sacco I.,University of Heidelberg | Dohle R.,Micro Systems Engineering GmbH | Fischer P.,University of Heidelberg | Piemonte C.,Fondazione Bruno Kessler | Ritzert M.,University of Heidelberg
Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | Year: 2016

We present a very compact γ-detection module primarily designed for PET applications. On a total area of about 30×30mm2, 144 SiPM photodetectors coupled to scintillator crystals are read out individually with fast timing ASICs. The core of the module is a LTCC ceramic substrate with internal water channels for efficient and stable liquid cooling. The top side of the LTCC is covered by 12×12 SiPMs in a regular pitch of 2.5 mm. The SiPMs are designed in the RGB-HD technology from FBK with a single cell size of 25×25μm2, very low dark-count rate and stable performance over a wide temperature range from 0 to 20 °C. The readout of the SiPMs is done with 4 specialized PETA5 ASICs flip-chip mounted to the bottom side of the substrate. Each chip has 36 readout channels (available in single or differential ended configuration) with self-triggered hit detection, a very low noise discriminator, signal amplitude integration and digitization, a TDC with 50 ps binwidth, neighbor logic and fast veto mechanisms. The full height of the assembly, including the connector to the main readout board, is less than 1 cm. In a 1:1 coupling configuration with 10 mm high LYSO scintillator arrays for detection of 511 keV gammas, the module has already reached 205 ps CRT time resolution (FWHM in coincidence between channels on two different modules), sufficient for ToF operation in PET. The module design, details on chip operation and latest results with LYSO arrays are described. © 2015 Elsevier B.V. Source

Agency: Cordis | Branch: FP7 | Program: CP-IP | Phase: NMP-2007-3.5-2 | Award Amount: 9.03M | Year: 2008

Various emerging markets in the field of non silicon multimaterial micro devices offer a huge potential for commercialisation in the near future. However, solutions for mass-production for most of them have still to be developed. The objective of the MULTILAYER project is to develop a set of solutions for the large-scale production of micro devices based on a technology we call Rolled multi material layered 3D shaping technology and using the concept of tape casting and advanced printing techniques. This technology will enable to manufacture complex multifunctional 3D-micro parts on a layer by layer manner and in a high-throughput context. Each layer can be given a specific structure. They will be printed and contain channels and cavities that are open or filled in a very high precision manner. The microsystems will have as basic building material ceramics, which is a clear advantage in applications that require high temperature, corrosive environments and long time reliability. Furthermore, it will allow spatial resolutions under 10 m and the ceramics tapes developed will be down to 10 m thin. The Rolled multi material layered 3D shaping technology will have several advantages: - it will be an efficient mass production method - the fabrication series can attain over a million units - it will offer a good flexibility for a wide variety possible component designs, - it will allow the integration of different materials as different layers enabling to manufacture multimaterial multilayered packages with a high degree of integration, - the process will be very reliable, indeed, every single layer can be advantageously inspected and controled

Agency: Cordis | Branch: FP7 | Program: BSG-SME | Phase: SME-2011-1 | Award Amount: 1.47M | Year: 2012

Nutri-Stat addresses the need of SMEPs with a cost-effective and real-time soil nutrient sensing system using ISEs integrated in an LTCC based micro Total Analysis System. The technological device will be composed of a complex soil probe combined with a data-logger for the measurement and recording of the concentration of the macronutrients Nitrogen (N), Phosphorus (P) and Potassium (K) present in the soil. Nutri-Stat will also read electrical conductivity and pH levels in soil. The Nutri-Stat system shall also feature user-friendly software to assist in soil nutrient management. The positive impacts of this tool will contribute to environmental and financial sustainability, whilst significantly improving the quality standards of agricultural produce across the EU. Nutri-Stat will provide farmers with constant monitoring of fields, tailored crop analysis and disease management, making information on the nutrient status of arable land for the first time ever, easily accessible and available to the farmer anytime anywhere.

An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.

Dohle R.,Micro Systems Engineering GmbH | Petzold M.,Fraunhofer Institute for Mechanics of Materials | Klengel R.,Fraunhofer Institute for Mechanics of Materials | Schulze H.,Micro Systems Engineering GmbH | Rudolf F.,TU Dresden
Microelectronics Reliability | Year: 2011

The purpose of this work is to evaluate the feasibility of room temperature wedge-wedge bonding using commercially available copper wires, coated with aluminum. Bonding quality, reliability and aging resistance of the wire bonds have been investigated using standard wire pull tests immediately after bonding and after accelerated life tests, including temperature storage at 125 °C, 150 °C, and 200 °C for up to 2000 h. Using focused ion beam (FIB-) preparation and high resolution electron microscopy (SEM, TEM combined with EDX X-ray analysis), results of microstructure investigations of the Al-coating/Cu wire interface as well as of the bonding interconnect formed between the coated wire and the metallization on ceramic substrate will be presented. These investigations provide background information regarding the binding mechanisms and material interactions, and contribute to assess and to avoid potential reliability risks. Due to the found advantageous bond processing behavior and increased reliability properties, our results indicate that room temperature wedge-wedge bonding of coated copper wires has a remarkable application potential, for instance in medical and other high reliability as well as high power applications. It combines all known advantages of usual copper bonding like excellent contacting behavior, high reliability and favorable material price with the possibility of processing temperature damageable components and considerable improved storage capability. Therefore, room temperature bonding using coated copper wire can also reduce cycle time, manufacturing and material costs. © 2010 Elsevier Ltd. All rights reserved. Source

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