Kaneko H.,Metal Research Center |
Hirose K.,Metal Research Center |
Sato K.,Metal Research Center |
Tanaka N.,The Innovation Company |
And 3 more authors.
Furukawa Review | Year: 2010
Connectors for boards and modules are becoming narrower in pitch due to multipolarization and smaller because electronic devices are becoming compact and multifunctional. A copper alloy strip used for electric contact materials in these small-sized connectors requires high strength and good performance to bending. Furukawa Electric improved these two conflicting features under the control of the metal structures: we have developed a new Cu-Ni-Si alloy (Colson alloy) EFTEC-820 (C64775: Cu-2.3Ni-0.65Si-0.5Zn-0.15Sn-0.1Mg-0.15Cr). This paper reports the improved features of this alloy and our grainrefining technology that contributes to achieving these features.
Yoshida K.,Metal Research Center |
Kitagawa S.,Metal Research Center |
Mitose K.,Metal Research Center |
Susai K.,Metal Research Center
Furukawa Review | Year: 2011
As a matter of consideration of plating materials for automobile terminals, we made a sample in which a Cu-Sn diffusion layer was exposed to the surface. We evaluated its anti-fretting characteristics, its corrosion resistance, its coefficient of friction, its solder wettability. As a result, when compared to the conventional plating materials with Sn on its surfaces, the material with the Cu-Sn diffusion layer (Cu-Sn alloy plating) showed much superior anti-fretting characteristics. Also, it met or exceeded its capabilities of coefficient of friction and corrosion resistance has sufficient performance for practical use. Its solder wettability was a little inferior to the conventional ones, though.