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MEMSCAP (Paris:MEMS) (NYSE Euronext: MEMS), the leading provider of innovative solutions based on MEMS (micro-electro-mechanical systems) technology announces today the launch of a program of co-design for integrated circuits (ASIC) with the AXLR Technological Transfer Acceleration Company (SATT) and the Montpellier Laboratory of Computer Science, Robotics and Microelectronics (LIRMM) for piezoresistive pressure transducers mainly targeting the medical applications of dialysis and blood filtration. The collaboration between MEMSCAP, the SATT AXLR and the LIRMM aims at the implementation of research work carried out at LIRMM on intelligent signal conditioning of resistive sensors. Patents protecting this innovation filed by the CNRS and the University of Montpellier have been granted and have been licensed by MEMSCAP as part of this project. The total expected duration of the project is 18 months and includes the design, prototyping and validation of an integrated circuit specific to the needs of MEMSCAP's medical products and its integration into MEMSCAP products. The promising innovation of the LIRMM directly addresses the core technology of MEMSCAP aerospace and medical sensors which are based on piezoresistive effect. One of the functions of a hemodialysis machine is to measure and display arterial and venous pressures as well as to notify the operator when these pressures fluctuate outside of an established alarm limit. Arterial and venous pressure monitoring provides information regarding vascular access and the extracorporeal circuit in which a patient's blood is circulating. Correct interpretation of these pressures can: MEMSCAP transducers are currently designed in multiple hemodialysis equipments. Our transducers combine the required accuracy, long-term stability, and sustain most of the aggressive sterilization processes performed in these equipments and medical procedures. Implementation of the LIRMM technology would help provide sensors that significantly reduce the operational and recurring maintenance and calibration costs of dialysis and filtration machines. This project extends the partnership between LIRMM and MEMSCAP which, was initiated during the fourth quarter of 2016, within a 36-months EUROSTARS project funded by the French and Norwegian authorities to adapt this signal conditioning technology to the aerospace applications of Full Authority Digital Engine Control (FADEC) and Air Data, Attitude and Heading Reference Systems (ADHARS). Specifications and details for MEMSCAP avionics products can be obtained by contacting MEMSCAP at info@memscap.com or by contacting our office in Skoppum, Norway. About AXLR AxLR is a technology transfer acceleration company. Our specialty is helping innovative projects derived from academic research reach maturity and commercialization. We work with the main public-sector research laboratories in France's Mediterranean area in Occitanie, one of the most dynamic locations in Europe, with over 200 laboratories and some 12,000 researchers. For more information, please visit our web site www.axlr.com. About MEMSCAP MEMSCAP is the leading provider of innovative micro-electro-mechanical systems (MEMS)-based solutions. MEMSCAP standard and custom products and solutions include components, component designs (IP), manufacturing and related services. MEMSCAP customers include Fortune 500 businesses, major research institutes and universities. The company's shares are traded on the Eurolist of NYSE Euronext Paris S.A (ISIN: FR0010298620-MEMS). More information on the company's products and services can be obtained at www.memscap.com.


News Article | June 13, 2017
Site: www.businesswire.com

MEMSCAP (Paris:MEMS) (NYSE Euronext: MEMS), the leading provider of innovative solutions based on MEMS (micro-electro-mechanical systems) technology, today announces that Nord-Micro GmbH & Co. OHG (Nord-Micro) has selected MEMSCAP to provide pressure transducers for their cabin pressure control systems. Headquartered in Frankfurt, Germany, Nord-Micro is a well-established global player in the aerospace business and the world leader in Cabin Pressure Control Systems (CPCS) for large commercial aircraft. With more than 40 years of experience, continuous growth and improvement, Nord-Micro today is a well-known 1st Tier OEM supplier and the reliable partner of choice for major commercial customers all around the world. Cabin Pressure Control Systems from Nord-Micro provide safety, high reliability, low operating costs, low crew workload and high passenger comfort. Nord-Micro Cabin Pressure Control Systems incorporate intelligent software that provides optimum cabin pressure control based on numerous aircraft parameters. Individually controlled outflow valves can even optimize the ventilation of cabin air based on cabin layout and passenger load. The MEMSCAP product baseline relies on MEMSCAP SP82 sensor technology and on company’s proprietary transducers calibration methods. As an offspring of the recent Norwegian R&D funded project, MEMSCAP has developed a new version of its SP82 pressure sensors with important improvements in terms of stability and accuracy. In addition to its former and current collaboration with Nord-Micro with TPS3100 products, MEMSCAP will now supply Nord-Micro a version of its TPS1200 pressure transducer, as well as a new analog output transducer named TP400. These sensors have been designed and qualified to be fully integrated within Nord-Micro Cabin Pressure Control Systems and will be qualified for the use in a major commercial single-aisle aircraft program. “Nord-Micro is a famous 1st Tier Original Equipment Manufacturer supplier and the reliable partner of choice for major commercial aerospace customers all around the world”, states Roy Grelland, General Manager of MEMSCAP Standard Products Business Unit. “MEMSCAP has been supplying transducers and switches to Nord-Micro for several years now. We consider Nord-Micro as one of our most important customers. The fact that we have been selected to supply transducers for this new program confirms our ability to deliver high-end products at a consistent quality level to very demanding market segments. It is also important to thank the Norwegian government for its support in our R&D projects over the last years as it significantly helped us create a new generation of ultra-stable and accurate sensors in a timely fashion”. MEMSCAP modular aerospace products are designed for all the aeronautics control systems worldwide, and their applications range from engine control, altitude and cabin pressure control, air data, to altimeters, air speed indicators and space applications. Specifications and details for MEMSCAP avionics products can be obtained by contacting MEMSCAP at info@memscap.com or by contacting our office in Skoppum, Norway. About Nord-Micro Nord-Micro is a UTC Aerospace Systems Company. Please visit the following websites for more information: utcaerospacesystems.com ; www.utc.com ; www.nord-micro.com. About MEMSCAP MEMSCAP is the leading provider of innovative micro-electro-mechanical systems (MEMS)-based solutions. MEMSCAP standard and custom products and solutions include components, component designs (IP), manufacturing and related services. MEMSCAP customers include Fortune 500 businesses, major research institutes and universities. The company's shares are traded on the Eurolist of NYSE Euronext Paris S.A (ISIN: FR0010298620-MEMS). More information on the company's products and services can be obtained at www.memscap.com.


Charvet G.,CEA Grenoble | Rousseau L.,School of Engineering in Information and Communication Science and Technology | Billoint O.,CEA Grenoble | Gharbi S.,CEA Grenoble | And 18 more authors.
Biosensors and Bioelectronics | Year: 2010

Microelectrode arrays (MEAs) offer a powerful tool to both record activity and deliver electrical microstimulations to neural networks either in vitro or in vivo. Microelectronics microfabrication technologies now allow building high-density MEAs containing several hundreds of microelectrodes. However, dense arrays of 3D micro-needle electrodes, providing closer contact with the neural tissue than planar electrodes, are not achievable using conventional isotropic etching processes. Moreover, increasing the number of electrodes using conventional electronics is difficult to achieve into compact devices addressing all channels independently for simultaneous recording and stimulation. Here, we present a full modular and versatile 256-channel MEA system based on integrated electronics. First, transparent high-density arrays of 3D-shaped microelectrodes were realized by deep reactive ion etching techniques of a silicon substrate reported on glass. This approach allowed achieving high electrode aspect ratios, and different shapes of tip electrodes. Next, we developed a dedicated analog 64-channel Application Specific Integrated Circuit (ASIC) including one amplification stage and one current generator per channel, and analog output multiplexing. A full modular system, called BIOMEA™, has been designed, allowing connecting different types of MEAs (64, 128, or 256 electrodes) to different numbers of ASICs for simultaneous recording and/or stimulation on all channels. Finally, this system has been validated experimentally by recording and electrically eliciting low-amplitude spontaneous rhythmic activity (both LFPs and spikes) in the developing mouse CNS. The availability of high-density MEA systems with integrated electronics will offer new possibilities for both in vitro and in vivo studies of large neural networks. © 2010 Elsevier B.V. All rights reserved.


Li C.,DRS Network and Imaging Systems | Han C.J.,DRS Network and Imaging Systems | George D.S.,DRS Network and Imaging Systems | Cook G.,DRS Network and Imaging Systems | And 7 more authors.
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2013

The DRS Tamarisk® 320 camera, introduced in 2011, is a low cost commercial camera based on the 17 μm pixel pitch 320x240 VOx microbolometer technology. A higher resolution 17 μm pixel pitch 640x480 Tamarisk® 640 has also been developed and is now in production serving the commercial markets. Recently, under the DARPA sponsored Low Cost Thermal Imager-Manufacturing (LCTI-M) program and internal project, DRS is leading a team of industrial experts from FiveFocal, RTI International and MEMSCAP to develop a small form factor uncooled infrared camera for the military and commercial markets. The objective of the DARPA LCTI-M program is to develop a low SWaP camera (<3.5 cm3 in volume and <500 mW in power consumption) that costs less than US $500 based on a 10,000 units per month production rate. To meet this challenge, DRS is developing several innovative technologies including a small pixel pitch 640x512 VOx uncooled detector, an advanced digital ROIC and low power miniature camera electronics. In addition, DRS and its partners are developing innovative manufacturing processes to reduce production cycle time and costs including wafer scale optic and vacuum packaging manufacturing and a 3-dimensional integrated camera assembly. This paper provides an overview of the DRS Tamarisk® project and LCTI-M related uncooled technology development activities. Highlights of recent progress and challenges will also be discussed. It should be noted that BAE Systems and Raytheon Vision Systems are also participants of the DARPA LCTI-M program. © 2013 SPIE.


Torfs T.,IMEC | Sterken T.,Ghent University | Brebels S.,IMEC | Santana J.,Holst Center | And 5 more authors.
IEEE Sensors Journal | Year: 2013

A wireless sensor network is proposed for monitoring buildings to assess earthquake damage. The sensor nodes use custom-developed capacitive microelectromechanical systems strain and 3-D acceleration sensors and a low power readout application-specified integrated circuit for a battery life of up to 12 years. The strain sensors are mounted at the base of the building to measure the settlement and plastic hinge activation of the building after an earthquake. They measure periodically or on-demand from the base station. The accelerometers are mounted at every floor of the building to measure the seismic response of the building during an earthquake. They record during an earthquake event using a combination of the local acceleration data and remote triggering from the base station based on the acceleration data from multiple sensors across the building. A low power network architecture was implemented over an 802.15.4 MAC in the 900-MHz band. A custom patch antenna was designed in this frequency band to obtain robust links in real-world conditions. The modules have been validated in a full-scale laboratory setup with simulated earthquakes. © 2012 IEEE.


Courtois B.,CMP | Karam J.-M.,Memscap Inc.
DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS | Year: 2012

This Symposium is a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 and in 2007 in Stresa, Italy, in 2008 in Nice, France, in 2009 in Rome, Italy, in 2010 in Sé ville, Spain and Aix-en-Provence, France in 2011. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We hope you enjoy the technical presentations of two conferences - CAD, Design and Test / Microfabrication, Integration and Packaging -, of three joint invited talks, and of four special sessions, on Point of Care Diagnostic Devices, on Bio-MEMS/NEMS, on Wireless Networked Green Sensor Systems and on Low Temperature Cofired Ceramic for MEMS. © 2012 CMP.


Santana J.,Holst Center | Van Den Hoven R.,Holst Center | Van Liempd C.,Holst Center | Colin M.,Memscap Inc. | And 3 more authors.
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 | Year: 2011

An Ultra-Low-Power readout architecture for capacitive MEMS-based accelerometers and strain sensors is presented. The system can read both accelerometers and strain sensors in a half-bridge configuration. The gain is controlled by integrating pulses from the excitation voltage allowing accurate control of the Signal-to-Noise ratio. A Figure-of-Merit of 4.41×10 20 F√(W/Hz) was achieved for a sensor range of ±2.0g and ±20,000 με over a 100Hz bandwidth. Residual motion artifacts are also cancelled by the system. © 2011 IEEE.


Malta D.,Rti International | Gregory C.,Rti International | Temple D.,Rti International | Knutson T.,Memscap Inc. | And 4 more authors.
Proceedings - Electronic Components and Technology Conference | Year: 2010

The fabrication of through-silicon vias (TSVs) is a major component in the development of three-dimensional (3D) integration technology and advanced 3D packaging approaches. The large diameter and length of TSVs, as compared to traditional interconnects, create some unique process challenges. Via plating and chemical-mechanical polishing (CMP) processes used in standard copper interconnect technology are generally not suitable for TSV fabrication. Therefore, efforts are being made to develop such processes specifically for TSV technology. This paper will describe the development of a void-free Cu electroplating process for TSV filling, along with CMP processing to remove the overburden layer and expose the Cu-filled vias for subsequent metallization. The focus of the paper will be the integration of the TSV plating and CMP processes, with discussion regarding observed integration challenges and their solutions. First, a Cu electroplating process was developed for defect-free, bottom-up filling of silicon vias from 20-200μm in diameter and 150-375μm deep, with aspect ratios from 1:1 to 8:1. Next, CMP tests were conducted using Cu-filled silicon vias of 50μm diameter and 150μm depth, designed for use in a MEMS wafer-level packaging application. These tests indicated that plating nonuniformity and Cu mound defects over filled vias caused significant CMP process issues. The plating process was then modified to eliminate these problems in the Cu films, resulting in improved CMP uniformity and reduced polishing time. ©2010 IEEE.


An apparatus for an atomic clock includes first and second distinctive substrates, each having at least a planar surface substantially parallel therebetween. The apparatus also includes a medium having particles capable of undergoing energetic transition between at least two energy levels, said medium being located in the space defined between the planar surfaces. It further includes a magnetic device arranged to the first substrate and generating at least in the volume of the medium a predetermined static magnetic field B the direction of which is substantially parallel or perpendicular to the planar surfaces and an excitation device arranged to the second substrate and generating an excitation magnetic field H at, at least an excitation frequency, the direction of said excitation magnetic field H in the volume of the medium being substantially orthogonal to said direction of the static magnetic field B.

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