Entity

Time filter

Source Type

Raleigh, NC, United States

Malta D.,Rti International | Gregory C.,Rti International | Temple D.,Rti International | Knutson T.,Memscap Inc. | And 4 more authors.
Proceedings - Electronic Components and Technology Conference | Year: 2010

The fabrication of through-silicon vias (TSVs) is a major component in the development of three-dimensional (3D) integration technology and advanced 3D packaging approaches. The large diameter and length of TSVs, as compared to traditional interconnects, create some unique process challenges. Via plating and chemical-mechanical polishing (CMP) processes used in standard copper interconnect technology are generally not suitable for TSV fabrication. Therefore, efforts are being made to develop such processes specifically for TSV technology. This paper will describe the development of a void-free Cu electroplating process for TSV filling, along with CMP processing to remove the overburden layer and expose the Cu-filled vias for subsequent metallization. The focus of the paper will be the integration of the TSV plating and CMP processes, with discussion regarding observed integration challenges and their solutions. First, a Cu electroplating process was developed for defect-free, bottom-up filling of silicon vias from 20-200μm in diameter and 150-375μm deep, with aspect ratios from 1:1 to 8:1. Next, CMP tests were conducted using Cu-filled silicon vias of 50μm diameter and 150μm depth, designed for use in a MEMS wafer-level packaging application. These tests indicated that plating nonuniformity and Cu mound defects over filled vias caused significant CMP process issues. The plating process was then modified to eliminate these problems in the Cu films, resulting in improved CMP uniformity and reduced polishing time. ©2010 IEEE. Source


Santana J.,Holst Center | Van Den Hoven R.,Holst Center | Van Liempd C.,Holst Center | Colin M.,Memscap Inc. | And 6 more authors.
Sensors and Actuators, A: Physical | Year: 2012

An Ultra-Low-Power readout architecture for capacitive MEMS-based accelerometers and strain sensors is presented. The system can read both accelerometers and strain sensors in a half-bridge configuration. An accurate VerilogA model of the sensor was made to improve simulations. The gain of the system is controlled by integrating pulses from the excitation circuit allowing accurate control of the Signal-to-Noise ratio. A Figure-of-Merit of 4.41 × 10-20 F√(W/Hz) was achieved for a sensor range of ±2.0 g and ±20,000 με over a 100 Hz bandwidth. A minimum of 440 nW power consumption was recorded. Residual motion artifacts are also cancelled by the system. © 2011 Elsevier B.V. All rights reserved. Source


Courtois B.,CMP | Karam J.-M.,Memscap Inc.
DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS | Year: 2012

This Symposium is a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 and in 2007 in Stresa, Italy, in 2008 in Nice, France, in 2009 in Rome, Italy, in 2010 in Sé ville, Spain and Aix-en-Provence, France in 2011. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We hope you enjoy the technical presentations of two conferences - CAD, Design and Test / Microfabrication, Integration and Packaging -, of three joint invited talks, and of four special sessions, on Point of Care Diagnostic Devices, on Bio-MEMS/NEMS, on Wireless Networked Green Sensor Systems and on Low Temperature Cofired Ceramic for MEMS. © 2012 CMP. Source


Trademark
Memscap Inc. | Date: 2009-02-24

Computer software for the analysis of data collected by probes analyzing the characteristics of the skin; electronic and microelectronic components, namely, microchips; optical, measuring, checking instruments, namely, physiological sensors for hydration, trans-epidermal water loss, temperature, pigmentation depth and roughness, pressure modulus, pressure regulators, all these goods for scientific and industrial use; electric switchers, electric transformers, electric accumulators, electric regulators, electric flow controllers; analysis apparatus for non medical use composed of pressure sensors and/or picture sensors; electronic data processors; computers; computer screens. Optical, measuring, checking instruments, namely, physiological sensors for hydration, trans-epidermal water loss, temperature, pigmentation depth and roughness, pressure modulus, pressure regulators, all these goods for medical use; analysis apparatus for medical and dermatological use, namely, dermatological probe, apparatus analyzing the characteristics of the skin. Providing training in the electronic, microelectronic and nanotechnological fields. Technical research services in the field of electronic, microelectronic and nanotechnology, medical and dermatological research; engineering services; research and development of new products for others, methods for data acquisition and methods for computer data analysis in the field of electronic, microelectronic and nanotechnology; technical consultation in the electronic, microelectronic and nanotechnological fields; computer programming.


Trademark
Memscap Inc. | Date: 2009-08-25

Computer software for analysis of data collected by probes analyzing the characteristics of the skin; electronic and microelectronic components, namely, microchips; optical, measuring, checking instruments, namely, physiological sensors for hydration, trans-epidermal water loss, temperature, pigmentation depth and roughness, pressure modulus, pressure regulators, all these goods for scientific and industrial use; electric switchers, electric transformers, electric accumulators, electric regulators, electric flow controllers; analysis apparatus for non medical use composed of pressure sensors and/or picture sensors; electronic data processors; computers; computer screens. Optical, measuring, checking instruments, namely, physiological sensors for hydration, trans-epidermal water loss, temperature, pigmentation depth and roughness, pressure modulus, pressure regulators, all these goods for medical use; analysis apparatus for medical and dermatological use, namely, dermatological probe, apparatus analyzing the characteristics of the skin.

Discover hidden collaborations