Meiko Electronics Corporation

Kawasaki, Japan

Meiko Electronics Corporation

Kawasaki, Japan

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A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component (14) with reference to a mark (12) formed on a copper layer (4), the mark (12) consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component (14) on the copper layer (4) with an adhesive layer (18) interposed therebetween, embedding the electronic component (14) and the mark (12) in an insulating substrate (34), thereafter, etching and removing a part of the copper layer (4) to form a window (W1) for exposing the mark (12), forming an LVH (46) reaching a terminal (20) of the electronic component (14) with reference to the exposed mark (12), electrically connecting the terminal (20) and the copper layer (4) via a conduction via (47) formed by applying copper plating to the LVH (46), and, thereafter, forming the copper layer (4) into a wiring pattern (50).


Patent
Meiko Electronics Co. | Date: 2016-03-30

A device embedded substrate (1) includes: an insulating layer (3); a first metal layer (4) and a second metal layer (5) that are formed such that the insulating layer (3) is sandwiched therebetween; a device (2) that is embedded in the insulating layer (3), and in which a connection terminal non-formation surface (2c) where a connection terminal (2a) is not formed is located on a side close to the first metal layer (4); an adhesive layer (6) that is located on the connection terminal non-formation surface (2c) of the device (2); and a conductive via (7) that electrically connects the second metal layer (5) and the connection terminal (2a) of the device (2), wherein an area of the adhesive layer (6) on a surface side in contact with the device (2) is smaller than an area of the connection terminal non-formation surface (2c) of the device (2).


Patent
Meiko Electronics Co. | Date: 2015-09-09

A printed wiring board (10) includes: an inner layer structure body (20) containing at least an inner layer insulative base material (31) composed of a glass cloth (31a) and resin (31b) which covers the glass cloth (31a) and not containing a resin insulative base material composed only of resin; outer layer wiring (21) formed on a first face (20a) of the inner layer structure body (20); and a solder resist layer (23) formed on a surface of the outer layer wiring (21), wherein in the inner layer structure body (20), an opening part (11) is formed, and the solder resist layer (23) is composed of a first ink part (23a) covering at least the outer layer wiring (21) that is formed on a partial region of the first face (20a) which corresponds to the opening part (11) and a second ink part (23b) interposing both ends of the first ink part (23a) and being lower in flexibility than the first ink part (23a).


Patent
Meiko Electronics Co. | Date: 2015-11-25

The suction device (1) includes: an suction part (2) formed with a plurality of suction holes (8) and adapted to abut against an suction object (9); side walls (3) and a top wall (4) for forming a negative pressure chamber (10) in cooperation with the suction part (2); a pin-shaped valve body (13) extending from the negative pressure chamber (10) into a suction hole (8); and a closing part (16) adapted to close the suction hole (8) in such a way that the valve body (13) slides in the suction hole (8) causing a portion of the valve body (13) and a portion of the inner wall of the suction hole (8) to come into close contact, wherein the valve body (13) has a root part (13a), which is one end thereof located in the negative pressure chamber (10), the root part (13a) is fixed to a plate-shaped flexible body (17) having flexibility and being bridged between and fixed to the side walls (3) in the negative pressure chamber (10), and the flexible body (17) has a plurality of through-holes (19).


The present invention provides a manufacturing method of a device embedded substrate, including: a bonding layer forming step of forming a bonding layer (10) constituted of an insulation material on a metal layer (12) formed on a support plate (11); and a device mounting step of mounting an electric or electronic device (3) on the bonding layer (10), wherein the device (3) is formed of a device main body (3a) and a terminal (3b) protruding from the device main body (3a); the bonding layer (10) is constituted of a first bonding body (10a) to be bonded with the metal layer (12) and a second bonding body (10b) to be bonded with the device (3); the first bonding body (10a) is formed substantially along the outer edge of the device (3) in planar view; the second bonding body (10b) is formed in an area equal to or smaller than the area defined by the outer edge of the terminal (3b) in planar view; and, in the bonding layer forming step, the second bonding body (10b) is formed on the first bonding body (10a) after the first bonding body (10a) is cured.


In a method for manufacturing a device embedded substrate (20), a conductive via (16) that penetrates a first insulating layer (5) and a second insulating layer (11) from an outer metal layer (14) to reach a second terminal (4b) of an IC device (4) is formed after forming the outer metal layer (14).


Patent
Meiko Electronics Co. | Date: 2015-02-11

A method of fabricating a heat dissipating board according to the present invention, includes: a substrate intermediate forming step of forming a substrate intermediate with an insulating layer made of an insulating resin material and a conducting layer made of a conductive material formed on the insulating layer; a through hole forming step of forming a through hole having an approximately cylindrical shape, the through hole penetrating through the substrate intermediate; an inserting step of inserting a heat conducting member to be disposed in the through hole, the heat conducting member being made of a metal and having an approximately cylindrical shape; and a plastically deforming step of plastically deforming the heat conducting member to be secured in the through hole. Prior to the inserting step, an annealing step of annealing the heat conducting member is performed.


In the present invention, in a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component (14) is positioned with reference to a mark (12) formed in a copper layer (4), when an imaginary line extending from a search center (74), which is a center of a search range (72) of a sensor, to an edge side (78) of the search range (72) is represented as a search reference line (80) and an imaginary line extending, in a state in which a mark center (76), which is the center of the mark (12), is matched with the search center (74), from the mark center (76) in the same direction as the search reference line (80) and to an outer ridgeline (25) of the mark (12) is represented as a mark reference line (82), the mark (12) is formed in a shape in which the outer ridgeline (25) of the mark (12) is present in a position where a length of the mark reference line (82) is in a range of 30% or more of the search reference line (80).


Patent
Meiko Electronics Co. | Date: 2015-07-15

The present invention provides a component-embedded substrate (1) formed by dividing a laminate which is formed by bonding a component (12) onto a conductive material (10) placed on a support (8); sequentially laminating an insulation material (18, 28) and a core substrate (20) each having a component avoiding hole (32) which avoids the component; and hot-pressing the laminate to allow the melted insulation material to flow into the component avoiding hole to thereby form an integrated laminate (2, 36), wherein the component-embedded substrate includes regulation means (16, 34, 32, 38) which limits the displacement of the core substrate slipping on the insulation material melted during the hot pressing.


Patent
Meiko Electronics Co. | Date: 2015-12-23

A device embedded substrate (15) includes an insulating layer (12) including an insulating resin material, an electric or electronic device (4) embedded in the insulating layer (12), a metal film (9) coating at least one face of the device (4), and a roughened portion (10) formed by roughening at least part of the surface of the metal film (9). Preferably, the device embedded substrate (15) further includes: a conductive layer (6) pattern-formed at least on a bottom face (7), the bottom face (7) being one face of the insulating layer (12); and a bonding agent (3) made of a material different from the insulating layer (12) and joining the conductive layer (6) and a mounting face (8), the mounting face (8) being one face of the device (4). The metal film (9) is formed only on a face opposite to the mounting face (8), and the bonding agent (3) has a thickness smaller than a thickness from the metal film (9) to a top face (11), the top face (11) being the other face of the insulating layer (12).

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