Mec Company Ltd | Date: 2013-03-04
Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.
MEC Co. | Date: 2012-10-02
Chemicals, namely, chemicals for use in the manufacturing processes of electronic circuit boards; industrial chemicals; surface treatment chemicals for use in the treatment of metals; surface modification chemicals for use in the modification of metals; etching chemicals, namely, etching solutions for metals for use in the manufacturing processes of electronic circuit boards; chemicals for etching metals; photo resist remover; degreasing agents for use in manufacture; chemicals for metal surface cleaning; soldering fluxes; brazing fluxes; metal degreasing chemicals, namely, degreasing solutions for metals for use in the manufacturing processes of electronic circuit boards; plating fluxes; surface treatment chemicals for use in the treatment of plastics; surface modification chemicals for use in the modification of plastics; chemicals for use in manufacturing electronic circuit boards; chemicals used for anti- tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic components and electronic equipment; chemicals used for anti-tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic circuit boards. Anti-rust preparations, namely, anti-rust solutions in the nature of coatings for metals for use in the manufacturing processes of electronic circuit boards; anti-rust preparations in the nature of coatings for preservation of metal surface. Foils of non-ferrous metals and their alloys; non-ferrous metals and their alloys; foils of non-ferrous metals for storage batteries.
MEC Co. | Date: 2010-02-19
The method for forming a laminate of the present invention is a method for forming a laminate, comprising a silane coupling agent treatment step of applying an aqueous solution of a silane coupling agent onto a surface of a metal layer, and drying the resultant applied film to form a silane coupling agent coating, and a lamination step of laminating a resin layer on the silane coupling agent coating, these steps being continuously performed, wherein when the formed silane coupling agent coating is analyzed in the silane coupling agent treatment step by FT-IR with a reflection absorption spectrometry and then the peak area of SiO is turned to a value less than a predetermined threshold value, at least one part of the aqueous solution of the silane coupling agent is renewed, thereby conducting the silane coupling agent treatment while the peak area is controlled into a predetermined range.
MEC Co. | Date: 2013-10-01
Chemicals used for etching and other chemical preparations for use in manufacturing processes of circuit board.
Mec Co. | Date: 2010-12-03
A wheel stop is disclosed which is engaged by a wheel of a vehicle in an attempt to be parked in a parking lot, to limit movement of the vehicle. The wheel stop includes a middle extending portion, first and second leg portions, all of which are integrally formed with a metal pipe. The wheel stop further includes first and second anchor plates affixed to the first and second leg portions, respectively, the anchor plates being anchored to the parking lot; an electric cable disposed within the metal pipe; and an electric outlet disposed on an outer surface of the metal pipe, and connected with the electric cable, to thereby allow, when the vehicle parked in the parking lot is an electric car, a power supply cable extending from the electric car to be plugged into the electric outlet.