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Patent
Measurement Specialties | Date: 2017-01-04

A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.


Patent
Measurement Specialties | Date: 2017-07-05

A pressure sensor assembly for measuring the pressure of a first fluid. The assembly having a first housing including a pressure sensing device arranged therein. A diaphragm is arranged on a surface of the first housing and is configured to transmit a force exerted on a first side thereof to the pressure sensing device. A second housing is provided and attached to the first housing. The second housing may be arranged generally circumferentially around the diaphragm. A compressible element is provided and arranged within a compressible element space defined within the second housing. The compressible element is configured to transmit a force exerted thereon by the fluid to the first side of the diaphragm.


Patent
Measurement Specialties | Date: 2017-01-04

A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is similarly bonded to the opposite side of the semiconductor die. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.


Patent
Measurement Specialties | Date: 2017-01-04

A differential pressure sensor includes a pressure sensing die including a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is similarly bonded to the opposite side of the semiconductor die. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.


Patent
Measurement Specialties | Date: 2017-01-11

A system and method for ultrasonic touch switch combined with piezoelectric touch mode is described. The sensor structure may be embodied as a substrate with a piezoelectric element at the back surface of the substrate, with the front surface being a touch sensitive surface. Both operational modes are possible by use of the same sensor element with filtering of the signals so that different advantages of two modes are combined, while disadvantages of either mode are mitigated. The tolerance of substrate thickness of ultrasonic touch mode is improved by use of a wide range of frequency deviation of drive signal by filtering out the fundamental modulation frequency from the output signal and wherein only sharp pulses corresponding to abrupt impedance changes of the piezoelectric element are extracted.


An ultrasonic transducer comprising a piezoelectric element, an acoustic matching layer arranged on a surface of the piezoelectric element and having a thickness of at least one-quarter of a wavelength of a center resonant frequency of the transducer, and a front metal layer arranged on a surface of the acoustic matching layer opposite that of the piezoelectric element and having a thickness equal to one-half of the wavelength of the center resonant frequency.


Patent
Measurement Specialties | Date: 2015-07-02

A miniature pressure scanning system may comprise: a plurality of miniature pressure sensors including a plurality of sensor outputs, each of the miniature pressure sensors including at least one sensor output for providing an analog output signal and each at least one sensor output having an associated output impedance; a plurality of buffers, each buffer of said plurality of buffers being electrically coupled to one sensor output of the plurality of sensor outputs, and each said buffer being operative to reduce a settling time constant associated with multiplexer voltage spikes and reduce the associated output impedance of the one sensor output coupled to it; and at least one multiplexer electrically coupled to the plurality of sensor outputs, said at least one multiplexer being operative to be switched between each of the plurality of sensor outputs.


Patent
Measurement Specialties | Date: 2014-08-25

A pressure sensor assembly for measuring the pressure of a first fluid. The assembly having a first housing including a pressure sensing device arranged therein. A diaphragm is arranged on a surface of the first housing and is configured to transmit a force exerted on a first side thereof to the pressure sensing device. A second housing is provided and attached to the first housing. The second housing may be arranged generally circumferentially around the diaphragm. A compressible element is provided and arranged within a compressible element space defined within the second housing. The compressible element is configured to transmit a force exerted thereon by the fluid to the first side of the diaphragm.


Patent
Measurement Specialties | Date: 2015-03-05

A system and method for ultrasonic touch switch combined with piezoelectric touch mode is described. The sensor structure may be embodied as a substrate with a piezoelectric element at the back surface of the substrate, with the front surface being a touch sensitive surface. Both operational modes are possible by use of the same sensor element with filtering of the signals so that different advantages of two modes are combined, while disadvantages of either mode are mitigated. The tolerance of substrate thickness of ultrasonic touch mode is improved by use of a wide range of frequency deviation of drive signal by filtering out the fundamental modulation frequency from the output signal and wherein only sharp pulses corresponding to abrupt impedance changes of the piezoelectric element are extracted. The amplitude of the sharp pulses decreases with touching the front surface of substrate. At the same time pressure force applied to the front surface causes the substrate to undergo bending displacement and causes piezoelectric element expansion strain to generate voltage. These two modes are combined and used to control switch of appliance or equipment.


An impedance conversion layer useful for medical imaging ultrasonic transducers comprises a low impedance polymer layer and a high impedance metal layer. These layers are combined with corresponding thicknesses adapted to provide a function of converting from a specific high impedance to specific low impedance, wherein the polymer layer is at the high impedance side and the metal layer is at the low impedance side. The effective acoustic impedance of the polymer and metal layer combination may be adapted to configure an impedance converter in the same way as a quarter wavelength impedance converter, converting from low impedance to high impedance (metal to polymer) or from a high impedance to low impedance (polymer to metal). This structure may be used for front matching with the propagation medium and back matching with an absorber for ultrasonic transducers.

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