Hampton, VA, United States
Hampton, VA, United States

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Patent
Meas and Hella KGaA Hueck & CO. | Date: 2010-05-19

An improved method and assembly, wherein the method generally includes the steps of providing a coated or uncoated sensor element having an exposed sensing surface; attaching the sensor element to a platform so that the exposed sensing surface is spaced from the platform; and optionally applying a protective layer over the platform while maintaining the sensing surface as exposed. The assembly includes a resonator having a free portion with a sensing surface is incorporated onto a platform, components of the sensor are physically shielded from harsh operating conditions, the requisite space is maintained between the free portion of the resonator and the platform, and the sensing surface of the resonator remains exposed for sensing.


Magneto-resistive sensors based on the AMR or GMR effect exhibit substantially enlarged linear characteristic curve regions as a result of the fact that their resistances are composed of magneto-resistive layer strips of differing anisotropic forms. Differing anisotropic forms can be achieved by different strip widths, strip thicknesses, strip intervals or strip materials. The temperature compensation for the output voltage of the magneto-resistive sensors, at least at one point on the characteristic curve, is achieved by the series connection of an additional layer strip with a temperature coefficient that differs from that of the magneto-resistive material to at least one magneto-resistive resistance of the sensor.


A measuring device for measuring magnetic properties in a vicinity of the measuring device, in connection with a sensor line having sensor elements, includes a magnetization device for generating a magnetic field substantially homogeneous in a region of the sensor line, the field direction of the magnetic field, in the region of the sensor line, being at an angle of greater than 0 and less than 90 to the direction of the sensor line.


The invention relates to a device for generating a sensor signal, the profile thereof depending on the position of a magnetic field-generating element relative to the device, with at least two magnetically sensitive sensors disposed along a measurement path, wherein a support field device, which generates a magnetic support field in the magnetically sensitive sensors, has at least in the magnetically sensitive sensors an essentially identical direction and an essentially homogeneous field strength.


There is disclosed a capacitive sensor on a passivation layer of a semiconductor circuit such as an ASIC, and a method for manufacturing such sensor. The system and method may comprise: forming a bottom electrode layer and landing pad (520) on a portion of the passivation layer located over active circuitry of the ASIC; forming a gas sensitive layer (530) onto the bottom electrode layer and the landing pad; creating a via (540) through the gas sensitive layer to expose a portion of the landing pad; forming a top electrode layer (550) onto the gas sensitive layer, wherein the top electrode layer completely overlays a surface area of the bottom electrode layer, and wherein the forming process for the top electrode layer deposits a portion of the top electrode layer into the via hole, thereby forming an electrical connection between the top electrode layer and the landing pad.


Methods, systems, and devices are described for managing mainframe events. In the methods, systems, and devices of the present disclosure, at least one mainframe event is received at a mainframe event server module communicatively coupled with a mainframe. The received at least one mainframe event may be converted to an open format. A destination Security Information and Event Management (SIEM) application may be selected for the received at least one mainframe event based on a set of rules, and a format associated with the selected destination SIEM application may be identified. The at least one mainframe event may then be transmitted in the identified format from the mainframe event server module to the selected destination SIEM application.


Patent
Meas | Date: 2012-04-02

Methods, systems, and devices are described for monitoring and managing mainframe events. In the methods, systems, and devices of the present disclosure, a stream of messages at a mainframe management console may be monitored to detect mainframe events. The mainframe events may be filtered according to at least one predetermined filtering criterion to identify a plurality of selected mainframe events. The selected mainframe events may then be converted from a character encoding specific to the mainframe to a generic character encoding, and routed to at least one destination Security Information Event Manager (SIEM) application.


Patent
Meas | Date: 2012-04-02

Methods, systems, and devices are described for managing mainframe events based on identified correlation among related events. In the methods, systems, and devices of the present disclosure, a set of events including at least one mainframe event is stored at a data store associated with a mainframe event server module. The set of events is analyzed to identify a correlation among a subset of the stored events according to at least one predefined correlation criterion. A new event is generated based on the identified correlation among the subset of the stored events, and the new event is transmitted to at least one destination Security Information and Event Management (SIEM) application.


Patent
Meas | Date: 2012-06-01

An infrared (IR) sensor package includes a heat sink defining a first interior space and a radiation trap adjacent the first interior space. An IR sensor having a radiation-sensitive region which detects IR radiation is arranged within the first interior space of the heat sink. A first optical element and a second optical element are arranged at respective ends of the radiation trap. The radiation trap is configured to allow for the passage of a first portion of IR radiation incident the second optical element, through the first optical element, and into communication with the IR sensor element, and to absorb a second portion of IR radiation incident the second optical element.


There is disclosed a capacitive sensor on a passivation layer of a semiconductor circuit such as an ASIC, and a method for manufacturing such sensor. The system and method may comprise: forming a bottom electrode layer and landing pad on a portion of the passivation layer located over active circuitry of the ASIC; forming a gas sensitive layer onto the bottom electrode layer and the landing pad; creating a via through the gas sensitive layer to expose a portion of the landing pad; forming a top electrode layer onto the gas sensitive layer, wherein the top electrode layer completely overlays a surface area of the bottom electrode layer, and wherein the forming process for the top electrode layer deposits a portion of the top electrode layer into the via hole, thereby forming an electrical connection between the top electrode layer and the landing pad.

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