San Jose, CA, United States
San Jose, CA, United States

Maxim Integrated is an American, publicly traded company that designs, manufactures, and sells analog and mixed-signal integrated circuits.Maxim Integrated develops integrated circuits for the industrial, communications, consumer, and computing markets. Headquartered in San Jose, California, the company has design centers, manufacturing facilities, and sales offices throughout the world. In fiscal 2014 Maxim had US$2.45 billion in sales, 8,800 employees, and 35,000 customers worldwide. The company celebrated its 30th anniversary in 2013. Wikipedia.


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Research and Markets has announced the addition of the "Global Microcontroller Market Size, Share, Development, Growth and Demand Forecast to 2022" report to their offering. The growing automotive industry and increasing smartphone proliferation are the key growth drivers for the global microcontroller market. Globally, the automotive industry has been witnessing a period of moderately strong growth as well as profitability. The annual sales have surpassed prerecession levels in some of the economies. The ongoing technological advancements including vehicle connectivity, interactive safety systems, self-driving cars will change the global scenario in the near future. The automobiles though mechanical to its soul, will go digital world over the forecast period, thus leveraging the characteristics of microcontroller. This will drive the demand for microcontrollers over the forecast period. The growing awareness among tech savy consumers are leading to smartphone proliferation across the globe. The sales of smartphone are driven by the demand for low cost smartphones in the developing economies and inexpensive 4G smartphones in emerging markets worldwide. The global smartphone market is increasing at a significant rate, with numbers varying from market-to-market basis. This will propel the demand for microcontrollers in the coming years. The global microcontroller market is exhibiting consistent slashing of average selling prices of microcontroller. This trend is quite dominant in the 32-bit segment, because the suppliers are competing with each other and attempting their best to hit low price points as required for upcoming IoT applications. There is tremendous pressure on the suppliers to considerably lower the average selling prices on 32-bit microcontroller for IoT applications. Some of the key companies operating in the global microcontroller market include Texas Instruments Incorporated, Microchip Technology Inc., Silicon Laboratories, Intel Corporation, Renesas Electronics Corporation, Maxim Integrated, Fairchild Semiconductor, STMicroelectronics, Analog Devices Inc. and Samsung Semiconductor. 3.5 Factors Driving Growth Of The Market And Its Impact On Market Forecast 3.6 Factors Hindering Growth Of The Market And Its Impact On Market Forecast For more information about this report visit http://www.researchandmarkets.com/research/w95vqb/global Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.


PHOENIX--(BUSINESS WIRE)--Avnet (NYSE: AVT), a leading global technology distributor, continues to demonstrate industry-leading commitment to facilitating customers’ introduction of differentiated embedded systems with the release today of the UltraZed™ PCIe Carrier Card and associated reference designs. The UltraZed PCIe Carrier Card is a high-performance platform that speeds prototyping and development of next-generation embedded system-on-module (SOM) applications utilizing the UltraZed-EG™ SOM, Avnet’s first platform to fully support power modes on the scalable and flexible Xilinx® Zynq® UltraScale+™ MPSoC. The UltraZed PCIe Carrier Card provides easy access to the full 180 user I/O, 26 PS MIO and four PS GTR transceivers available on the UltraZed-EG SOM. Two 140-pin Micro Headers on the carrier card mate with the UltraZed-EG SOM, connecting 180 of the UltraZed-EG Programmable Logic (PL) I/O to FMC LPC slot, LVDS Touch Panel interface and Xilinx System Monitor (SYSMON). The UltraZed PCIe Carrier Card costs $499 and is available for order at http://zedboard.org/product/ultrazed-pcie-carrier-card. The UltraZed PCIe Carrier Card also uses a 100-pin Micro Header to gain access to the UltraZed-EG SOM PS MIO and GTR transceiver pins as well as USB 2.0 and Gigabit Ethernet interfaces. UltraZed PCIe Carrier Card is an excellent starting point for users to create their own custom UltraZed-EG carrier card. Video demonstrations of the UltraZed-EG Starter Kit and SOM can be viewed at http://www.ultrazed.org/product/ultrazed-EG. “Adding a PCIe Carrier Card to the UltraScale product family gives customers even greater flexibility to leverage the UltraZed-EG SOM for the development of high-performance systems in applications including wired and 5G wireless infrastructure, cloud computing and the Industrial IoT,” said Nasser Poureh, director of technology and technical marketing for Avnet. To help customers in a wide variety of applications and industries quickly and cost-effectively capture maximum performance and value from the UltraZed technology, Avnet also offers a host of scalable reference designs including software and hardware platform, boot files, Linux kernel and RAMdisk. Available reference designs for the UltraZed platform include: PetaLinux BSP and In System QSPI and EMMC Programming Reference Design provides Linux designers with an excellent starting point for launching a Linux software application development using Xilinx SDK, while the EMMC reference design demonstrates programming of the QSPI and eMMC Flash memory boot devices without the need for external programming cables. Ethernet Performance Testing Reference Design enables systems engineers to launch their own Ethernet performance tuning and testing efforts to ensure products meet the throughput demands of a particular network configuration. Bare-Metal-Sensor Reference Design demonstrates the use of the MAX31855PMB1 thermocouple temperature sensing module and MAX44000PMB1 proximity sensing module from Maxim Integrated. For information on additional related parts and technical resources, please visit the UltraZed product page at www.ultrazed.org. All brands and trade names are trademarks or registered trademarks, and are the properties of their respective owners. Avnet disclaims any proprietary interest in marks other than its own. Click to Tweet: .@Avnet adds #PCIe carrier card to #UltraZed-EG SOM portfolio based on #Xilinx #Zynq UltraScale+ #MPSoC http://bit.ly/1ll33LR Follow Avnet on Twitter: @Avnet Connect with Avnet on LinkedIn: http://www.linkedin.com/company/avnet Connect with Avnet on Facebook: http://www.facebook.com/AvnetInc From components to cloud and design to disposal, Avnet (NYSE:AVT) accelerates the success of customers who build, sell and use technology globally by providing them with a comprehensive portfolio of innovative products, services and solutions. For more information, visit www.avnet.com.


SOLON, Ohio, Feb. 20, 2017 (GLOBE NEWSWIRE) -- Energy Focus, Inc. (NASDAQ:EFOI), a leader in LED lighting technologies, announced that, effective as of February 19, 2017, Dr. Ted Tewksbury, the Company’s Executive Chairman, will now serve as the Company’s Chairman of the Board, Chief Executive Officer and President.  James Tu has stepped down as Chief Executive Officer and President and both Mr. Tu and Simon Cheng resigned from the Board of Directors effective February 19, 2017. The leadership change was part of an initiative that is being implemented during the first quarter of 2017 to achieve higher operating efficiencies and reduce the Company’s annual operating costs by approximately $10 million from 2016 levels. The plan includes a workforce reduction of approximately 15%, consolidation of the Company’s office facilities, reorganization of the commercial sales force, integration of engineering and research and development teams, reconfiguration of certain manufacturing lines, and reduction in administrative expenses and professional fees. The Company expects to record a one-time restructuring charge of approximately $1.1 million in its first quarter 2017 associated with these actions. “James joined the Company as Chairman in 2012 and, through his role on the Board and then as our Chief Executive Officer and President, he has played a pivotal role in our evolution as a leader in LED lighting. During his tenure, the Company was restructured to focus on the sale of our LED lighting products, in particular our military and commercial tubular LED lines of products, into targeted markets. I sincerely thank him for his leadership in executing on this vision for the Company and for setting the stage for future growth,” said Dr. Ron Black, the Company’s lead independent director and former Chairman. “I also thank Simon Cheng for his contributions to the Board and continuing role as an employee. I wish James the best in his future endeavors,” Dr. Black continued. “Ted’s wealth of experience has allowed him to quickly integrate into the Energy Focus team and identify opportunities to return to profitability and growth. Expanding his role allows him to have a more hands-on approach to drive change, including his recent business restructuring, and we look forward to his leadership of the Company into its next chapter,” commented Dr. Black. “Serving in a combined role as Chairman, Chief Executive Officer and President and with a smaller Board will further our strategic efforts to evolve as a more efficient and streamlined organization. Together with other restructuring actions, these first steps will serve as the foundation to return the company to profitable growth in 2017 and beyond.  I look forward to discussing these matters with our investors on the Company’s fourth quarter and year-end earnings call,” said Dr. Tewksbury. As previously announced, the Company is hosting a public teleconference call to discuss financial results for its quarter and year ended December 31, 2016 at 11:00 a.m. Eastern Time on February 23, 2017. To participate in the call, please dial 888-690-2876 if calling within the United States or 913-312-0971 if calling internationally. A replay will be available until March 2, 2017, which can be accessed by dialing 844-512-2921 if calling within the United States or 412-317-6671 if calling internationally. Please use passcode 5192928 to access the replay. The call will additionally be broadcast live and archived for 90 days over the internet accessible in the Investors portion of the Company’s corporate website, under “Events and Presentations” at http://investors.energyfocus.com/events.cfm. Dr. Tewksbury is a well-known semiconductor industry executive with a distinguished track record of transforming and building visionary businesses. As the former CEO of Integrated Device Technology, Dr. Tewksbury architected the company's turnaround from 2008 to 2013, putting it in new businesses such as analog, wireless charging and radio frequency (RF) products. Dr. Tewksbury served on the Board of Directors of Entropic Communications from 2010 to 2015 and, as CEO from 2014 to 2015, led the company's return to profitability and sale to MaxLinear, where he currently serves on the Board of Directors. Dr. Tewksbury was President and COO of AMI Semiconductor from 2006 to 2008, Managing Director at Maxim Integrated from 2000 to 2006 and held a variety of engineering and management positions at IBM Microelectronics and Analog Devices. Dr. Tewksbury served on the Board of Directors of the Global Semiconductor Alliance (GSA) from 2011 to 2013 and has been a Board Director at Jariet Technologies since its spinoff from Semtech in 2015. Dr. Tewksbury received the B.S. degree in Architecture, as well as M.S. and Ph.D. degrees in Electrical Engineering from MIT. Forward-looking statements in this report are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Generally, these statements can be identified by the use of words such as “believes,” “estimates,” “anticipates,” “expects,” “seeks,” “projects,” “intends,” “plans,” “may,” “will,” “should,” “could,” “would” and similar expressions intended to identify forward-looking statements, although not all forward-looking statements contain these identifying words.  These forward-looking statements include all matters that are not historical facts and include statements regarding our current expectations concerning, among other things, our results of operations, financial condition, strategies, capital expenditures and the industry in which we operate. By their nature, forward-looking statements involve risks and uncertainties because they relate to events and depend on circumstances that may or may not occur in the future. Although we base these forward-looking statements on assumptions that we believe are reasonable when made, we caution you that forward-looking statements are not guarantees of future performance and that our actual results of operations, financial condition and liquidity, and industry developments may differ materially from statements made in or suggested by the forward-looking statements contained in this report. We believe that important factors that could cause our actual results to differ materially from forward-looking statements include, but are not limited to: the Company’s expectations regarding the amount and timing of the Restructuring charges, including costs subject to future negotiations with third parties; estimates of the amount of savings that will be realized; the effectiveness of the Restructuring in achieving intended cost reductions and operational efficiencies; our history of operating losses and our ability to effectively implement cost-cutting measures and generate sufficient cash from operations or receive sufficient financing, on acceptable terms, to continue our operations; our reliance on a limited number of customers, in particular our sales of products for the U.S. Navy, for a significant portion of our revenue, and our ability to maintain or grow such sales levels; the entrance of competitors in the market for the U.S. Navy products; general economic conditions in the United States and in other markets in which we sell our products; our ability to utilize our resulting operational structure to implement and manage our growth plans to increase demand, diversify our customer base, increase sales, control expenses and respond to new technologies and market trends; our ability to compete effectively against companies with greater resources, lower cost structures, or more rapid development efforts; our ability to protect our intellectual property rights and other confidential information, manage infringement claims by others, and the impact of any type of legal claim or dispute; our ability to attract and retain qualified personnel, and to do so in a timely manner; and our ability to maintain effective internal controls and otherwise comply with our obligations as a publicly traded company.  In light of the foregoing, we caution you not to place undue reliance on our forward-looking statements. Any forward-looking statement that we make in this report speaks only as of the date of such statement, and we undertake no obligation to update any forward-looking statement or to publicly announce the results of any revision to any of those statements to reflect future events or developments. Energy Focus is an industry-leading innovator of energy-efficient LED lighting technology. As the creator of the so far first and only UL-verified low-flicker LED products on the U.S. market, Energy Focus products provide extensive energy and maintenance savings, and aesthetics, safety, health and sustainability benefits over conventional lighting. Our customers include U.S. and foreign navies, U.S. federal, state and local government, healthcare and educational institutions, as well as Fortune 500 companies. Energy Focus is headquartered in Solon, Ohio, with additional offices in New York, NY and Taipei, Taiwan.


A micro gyroscope for determining rotational movements about three spatial axes x, y and z, which are perpendicular to one another has a substrate (I) on which a plurality of masses (2, 3) oscillating tangentially about the z axis, which is perpendicular to the substrate (I), are arranged. The oscillating masses (2, 3) are fastened on the substrate (I) by means of springs (5, 6, 8) and tie bolts (7, 9). Driving elements (II) serve to maintain oscillating, tangential vibrations of the masses (2, 3) about the z axis, as a result of which, upon rotation of the substrate (I) about any spatial axis, the masses (2, 3) are subjected to Corolis forces and deflections caused as a result. Sensor elements detect the deflections of the masses (2, 3) on the basis of the Corolis forces generated. Some of the masses (2, 3) oscillating about the z axis are mounted in a tiltable manner substantially about the x axis which runs parallel to the substrate (I). Others of the masses (2, 3) oscillating about the z axis are mountable in a tiltable manner substantially about the y axis, which likewise runs parallel to the substrate (I). At least one other of the oscillating masses (2, 3) can be additionally at least partially deflected substantially radially to the z axis in the x-y plane parallel to the plane of the substrate (I). Said additionally radially deflectable z mass (3) is assigned a sensor element (12) which can likewise be deflected radially with respect to the z axis but does not oscillate about the z axis.


Patent
Maxim Integrated | Date: 2014-08-20

A micromechanical sensor comprising a substrate (5) and at least one mass (6) which is situated on the substrate (5) and which moves relative to the substrate (5) is used to detect motions of the sensor due to an acceleration force and/or Coriolis force which occur(s). The mass (6) and the substrate (5) and/or two masses (5, 7) which move toward one another are connected by at least one bending spring device (6). The bending spring device (6) has a spring bar (9) and a meander (10), provided thereon, having a circle of curvature (K1; K6; K8; K9; K11) whose midpoint (MP1; MP6; MP8; MP9; MP11) and radius of curvature (r1; r6; r8; r9; r11) are inside the meander (10). For reducing stresses that occur, in addition to the radius of curvature (r1; r6; r8; r9; r11) having the inner midpoint (MP1; MP6; MP8; MP9; MP11), the meander (10) has at least one further radius of curvature (r2; r3; r4; r5; r7; r10) having a midpoint (MP2; MP3; MP4; MP5; MP7; MP10) outside the meander (10). The at least one further radius of curvature (r2; r3; r4; r5; r7; r10) is situated between the meander (10) and the spring bar (9).


The invention relates to methods of interleaving payload data and integrity control data in an external memory interfaced with a microcontroller to improve data integrity check, enhance data confidentiality and save internal memory. Data words and are received for storing in the external memory. Each data word is used to generate a respective integrity word, while an associated logic address is translated to two physical addresses in the external memory, one for the data word and the other for the integrity word. The two physical addresses for the data and integrity words are interleaved in the external memory, and sometimes, in a periodic scheme. In particular, each data word may be associated to an integrity sub-word included in an integrity word having the same length with that of a data word. The external memory may have dedicated regions for the data words and the integrity words, respectively.


Patent
Maxim Integrated | Date: 2011-04-19

The invention relates to a micro-gyroscope for detecting motions relative to an X and/or Y and Z axis, particularly as a 3D, 5D, or 6D sensor. Sample masses are disposed uniformly about an anchor and can be driven radially relative to the central anchor. Anchor springs are disposed to attach the sample masses to a substrate, and these sample masses can be deflected both radially within and out of the X-Y plane. A sensor mass is disposed on one of the sample masses by means of sensor springs, and the sensor springs allow deflection of the sensor mass within the plane of the sample mass, and orthogonal to the radial drive direction of the sample masses. Drive elements oscillate these sample masses in the X-Y plane, and sensor elements captures the defection of the sample masses due to the Coriolis forces generated when the substrate is rotated.


Method and device for contactless sensing rotation and angular position using orientation tracking. 2.1 To improve the accuracy and possible resolution of a magnetic positioning system, a method and a device using a special tracking technique is proposed. 2.2 The method and the device are using multiple magnetic field sensing elements at different positions below a magnetic target. The sensed signals are used to select or combine the sensing elements for a best approach to the actual orientation of the magnet. This allows putting out the related orientation of the approach as a coarse value and the remaining displacement as a fine value. 2.3 A device using this method allows highly accurate measurement of angular positions controlling or tolerating the placement of a magnet as the input source.


Patent
Maxim Integrated | Date: 2015-10-13

The invention relates to a micro-gyroscope for detecting motions relative to an X and/or Y and Z axis, particularly as a 3D, 5D, or 6D sensor. Sample masses are disposed uniformly about an anchor and can be driven radially relative to the central anchor. Anchor springs are disposed to attach the sample masses to a substrate, and these sample masses can be deflected both radially within and out of the X-Y plane. A sensor mass is disposed on one-of the sample masses by means of sensor springs, and the sensor springs allow deflection of the sensor mass within the plane of the sample mass, and orthogonal to the radial drive direction of the sample masses. Drive elements oscillate these sample masses in the X-Y plane, and sensor elements captures the defection of the sample masses due to the Coriolis forces generated when the substrate is rotated.


An electronic circuit arrangement for receiving low-frequency electromagnetic waves is proposed, having an inductor (L) acting as an antenna for generating a received signal, having a first receiver (2), connected to the inductor (L), for decoding a first component of the received signal and having a second receiver (3), connected to the inductor (L), for decoding a second component of the received signal, wherein at least the second receiver (3) is connected to the inductor (L) via an attenuator element (4) having adjustable attenuation, wherein at least one adjustment signal generation circuit (5, 6) is provided for generating an adjustment signal corresponding to a voltage of the received signal which is fed to the attenuator element (4) for adjusting the attenuation.

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