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Yokneam, Israel

A method for protecting an optical MEMS device, including providing an optical MEMS device defining a field of view and including layers which define a main plane; and forming a protective element, constructed and operative for at least partly covering the optical MEMS device, from an optical structural material and wherein the protective element includes a planar portion tilted with respect to said main plane via which a majority of light energy directed toward said main plane must pass.


Patent
Maradin Technologies Ltd. | Date: 2010-12-02

Provided is a Micro-Electro-Mechanical Systems (MEMS) device for actuating a gimbaled element, the device including a symmetric electromagnetic actuator for actuating one degree of freedom (DOF) and a symmetric electrostatic actuator for actuating the second degree of freedom.


Patent
Maradin Technologies Ltd. | Date: 2012-03-16

A method for manufacturing a conductive coil, the method comprising using a semiconductor fabrication process (e.g. TSV) to manufacture a coil, typically a planar spiral conductive coil.


Patent
Maradin Technologies Ltd | Date: 2014-07-11

A Micro-Electro-Mechanical Systems (MEMS) device for actuating a gimbaled element, the device comprising a symmetric electromagnetic actuator for actuating one degree of freedom (DOF) and a symmetric electrostatic actuator for actuating the second degree of freedom.


Li H.Y.,Institute of Microelectronics, Singapore | Xie L.,Institute of Microelectronics, Singapore | Ong L.G.,Institute of Microelectronics, Singapore | Baram A.,Maradin Technologies Ltd. | And 4 more authors.
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 | Year: 2011

For MEMs application, we developed dense TSV coils and stacking technology. The dense TSV coils (20um width, 10um space, 90um depth) were void-free filling by Cu. 8 chips stacking with dense coils are demonstrated by conductive adhesive. The resistance, inductance and magnetic field of 8 stacked dense coils are characterized and reported in this paper. © 2011 IEEE. Source

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