Manufacturing Technology Center Ltd

Anstey, United Kingdom

Manufacturing Technology Center Ltd

Anstey, United Kingdom

Time filter

Source Type

News Article | May 15, 2017
Site: globenewswire.com

FREMONT, Calif., May 15, 2017 (GLOBE NEWSWIRE) -- Lam Research Corp. (Nasdaq:LRCX), an advanced manufacturer of semiconductor equipment, today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017. Dr. Koh held many executive positions at Samsung Electronics Co., Ltd in South Korea.  Prior to his most recent position as Advisor until December 2016, he served from December 2011 to December 2013 as Executive Vice President, Head of the Mechatronics R&D Center; from January 2010 to July 2011 as Executive Vice President, Head of the Manufacturing Operation Center, LCD Business; and from January 2004 to June 2007 as Senior Vice President, Head of Manufacturing Technology Center, Memory Business.  Dr. Koh also served as Executive Vice President and President of Samsung Austin Semiconductor LLC located in Texas from August 2007 to December 2009.     "We are honored to welcome Dr. Koh as a Director of Lam Research," said Stephen G. Newberry, chairman of Lam Research. "Dr. Koh brings to the Lam Research board substantial high technology operations knowledge and expertise built over the course of his distinguished career. His intimate understanding of the semiconductor industry paired with his international leadership experience in research, development and manufacturing will be a tremendous asset in our boardroom.” Lam Research Corp. (Nasdaq:LRCX) is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's broad portfolio of market-leading deposition, etch, and clean solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand, resulting in smaller, faster, more powerful, and more power-efficient chips. Through collaboration, continuous innovation, and delivering on commitments, Lam is transforming atomic-scale engineering and enabling its customers to shape the future of technology. Based in Fremont, Calif., Lam Research is a Nasdaq-100 Index® and S&P 500® company whose common stock trades on the Nasdaq Global Select Market℠ under the symbol LRCX. For more information, please visit www.lamresearch.com. (LRCX-B)


News Article | May 15, 2017
Site: globenewswire.com

FREMONT, Calif., May 15, 2017 (GLOBE NEWSWIRE) -- Lam Research Corp. (Nasdaq:LRCX), an advanced manufacturer of semiconductor equipment, today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017. Dr. Koh held many executive positions at Samsung Electronics Co., Ltd in South Korea.  Prior to his most recent position as Advisor until December 2016, he served from December 2011 to December 2013 as Executive Vice President, Head of the Mechatronics R&D Center; from January 2010 to July 2011 as Executive Vice President, Head of the Manufacturing Operation Center, LCD Business; and from January 2004 to June 2007 as Senior Vice President, Head of Manufacturing Technology Center, Memory Business.  Dr. Koh also served as Executive Vice President and President of Samsung Austin Semiconductor LLC located in Texas from August 2007 to December 2009.     "We are honored to welcome Dr. Koh as a Director of Lam Research," said Stephen G. Newberry, chairman of Lam Research. "Dr. Koh brings to the Lam Research board substantial high technology operations knowledge and expertise built over the course of his distinguished career. His intimate understanding of the semiconductor industry paired with his international leadership experience in research, development and manufacturing will be a tremendous asset in our boardroom.” Lam Research Corp. (Nasdaq:LRCX) is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's broad portfolio of market-leading deposition, etch, and clean solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand, resulting in smaller, faster, more powerful, and more power-efficient chips. Through collaboration, continuous innovation, and delivering on commitments, Lam is transforming atomic-scale engineering and enabling its customers to shape the future of technology. Based in Fremont, Calif., Lam Research is a Nasdaq-100 Index® and S&P 500® company whose common stock trades on the Nasdaq Global Select Market℠ under the symbol LRCX. For more information, please visit www.lamresearch.com. (LRCX-B)


News Article | May 15, 2017
Site: globenewswire.com

FREMONT, Calif., May 15, 2017 (GLOBE NEWSWIRE) -- Lam Research Corp. (Nasdaq:LRCX), an advanced manufacturer of semiconductor equipment, today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017. Dr. Koh held many executive positions at Samsung Electronics Co., Ltd in South Korea.  Prior to his most recent position as Advisor until December 2016, he served from December 2011 to December 2013 as Executive Vice President, Head of the Mechatronics R&D Center; from January 2010 to July 2011 as Executive Vice President, Head of the Manufacturing Operation Center, LCD Business; and from January 2004 to June 2007 as Senior Vice President, Head of Manufacturing Technology Center, Memory Business.  Dr. Koh also served as Executive Vice President and President of Samsung Austin Semiconductor LLC located in Texas from August 2007 to December 2009.     "We are honored to welcome Dr. Koh as a Director of Lam Research," said Stephen G. Newberry, chairman of Lam Research. "Dr. Koh brings to the Lam Research board substantial high technology operations knowledge and expertise built over the course of his distinguished career. His intimate understanding of the semiconductor industry paired with his international leadership experience in research, development and manufacturing will be a tremendous asset in our boardroom.” Lam Research Corp. (Nasdaq:LRCX) is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's broad portfolio of market-leading deposition, etch, and clean solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand, resulting in smaller, faster, more powerful, and more power-efficient chips. Through collaboration, continuous innovation, and delivering on commitments, Lam is transforming atomic-scale engineering and enabling its customers to shape the future of technology. Based in Fremont, Calif., Lam Research is a Nasdaq-100 Index® and S&P 500® company whose common stock trades on the Nasdaq Global Select Market℠ under the symbol LRCX. For more information, please visit www.lamresearch.com. (LRCX-B)


News Article | May 15, 2017
Site: globenewswire.com

FREMONT, Calif., May 15, 2017 (GLOBE NEWSWIRE) -- Lam Research Corp. (Nasdaq:LRCX), an advanced manufacturer of semiconductor equipment, today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017. Dr. Koh held many executive positions at Samsung Electronics Co., Ltd in South Korea.  Prior to his most recent position as Advisor until December 2016, he served from December 2011 to December 2013 as Executive Vice President, Head of the Mechatronics R&D Center; from January 2010 to July 2011 as Executive Vice President, Head of the Manufacturing Operation Center, LCD Business; and from January 2004 to June 2007 as Senior Vice President, Head of Manufacturing Technology Center, Memory Business.  Dr. Koh also served as Executive Vice President and President of Samsung Austin Semiconductor LLC located in Texas from August 2007 to December 2009.     "We are honored to welcome Dr. Koh as a Director of Lam Research," said Stephen G. Newberry, chairman of Lam Research. "Dr. Koh brings to the Lam Research board substantial high technology operations knowledge and expertise built over the course of his distinguished career. His intimate understanding of the semiconductor industry paired with his international leadership experience in research, development and manufacturing will be a tremendous asset in our boardroom.” Lam Research Corp. (Nasdaq:LRCX) is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's broad portfolio of market-leading deposition, etch, and clean solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand, resulting in smaller, faster, more powerful, and more power-efficient chips. Through collaboration, continuous innovation, and delivering on commitments, Lam is transforming atomic-scale engineering and enabling its customers to shape the future of technology. Based in Fremont, Calif., Lam Research is a Nasdaq-100 Index® and S&P 500® company whose common stock trades on the Nasdaq Global Select Market℠ under the symbol LRCX. For more information, please visit www.lamresearch.com. (LRCX-B)


News Article | May 15, 2017
Site: www.prlog.org

-- Tens of thousands of users from London to St. Petersburg logged onto their computers this past weekend to find ominous threats to delete their suddenly encrypted computer files, unless they cough up $300 or more in Bitcoin payments to the unknown perpetrators.   "This is one of the most serious events in the rapidly growing phenomena of cyber-attacks,"said Elliot Forsyth, VP of Business Operations at the Michigan Manufacturing Technology Center.Employees booting up computers at work this Monday could see red as they discover they're victims of a global "ransomware"cyberattack that has created chaos in 150 countries and could wreak even greater havoc as more malicious variations appear.As a loose global network of cybersecurity experts fought the ransomware hackers, officials and experts on Sunday urged organizations and companies to update older Microsoft operating systems immediately to ensure they aren't vulnerable to a more powerful version of the software — or to future versions that can't be stopped.New variants of the rapidly replicating worm were discovered Sunday and one did not include the so-called kill switch that allowed researchers to interrupt its spread Friday by diverting it to a dead end on the internet.The attack held users hostage by freezing their computers, popping up a red screen with the words, "Oops, your files have been encrypted!" and demanding money through online bitcoin payment — $300 at first, rising to $600 before it destroys files hours later.The ransomware attack was particularly malicious, because if just one person in an organization clicked on an infected attachment or bad link, all the computers in a network would be infected.The effects were felt around the globe, disrupting computers that run factories, banks, government agencies and transport systems in nations as diverse as the United States, Russia, Ukraine, Brazil, Spain and India. Britain's National Health Service was hit hard, while Russia's Interior Ministry and companies including Spain's Telefonica, FedEx Corp. in the U.S. and French carmaker Renault all reported disruptions.The full extent of the attack won't become fully clear until people return to their workplaces Monday, for the first time after the attacks. Many may click infected email attachments or bad links and spread the virus further.Businesses, government agencies and other organizations were urged to quickly implement a patch released by Microsoft Corp. The ransomware exploits older versions of Microsoft's operating system software, such as Windows XP.Installing the patch is one way to secure computers against the virus as well as secure back-up systems. The other is to disable a type of software that connects computers to printers and faxes, which the virus exploits, said Forsyth.Microsoft distributed a patch two months ago that could have forestalled much of the attack, but in many organizations it was likely lost among the blizzard of updates and patches that large corporations and governments strain to manage.Celebrating its 25anniversary, the Michigan Manufacturing Technology Center (The Center) is an organization dedicated to supporting Michigan manufacturers to work smarter, to compete and to prosper. The Center offers personalized consulting services to meet the needs of clients in virtually every aspect of their businesses. The Center is affiliated with the National Institute of Standards and Technology (NIST) and is part of the Hollings Manufacturing Extension Partnership (MEP Program). The Center also is closely affiliated with the Michigan Economic Development Corporation (MEDC) with the shared goal of making Michigan businesses vibrant, driving GDP growth, and creating new and lasting jobs. For more information, visit www.the-center.org.


Antar M.,Manufacturing Technology Center Ltd | Antar M.,University of Birmingham | Chantzis D.,Manufacturing Technology Center Ltd | Marimuthu S.,Manufacturing Technology Center Ltd | And 2 more authors.
Procedia CIRP | Year: 2016

EDM and laser processing are extensively used for drilling cooling holes in various aero and land based turbine components, including combustion casing, vanes and blades. However, as it is envisaged that future generation of aero engines will typically have in excess of 150,000 cooling holes, which will result in enormous pressure on technology providers to meet some very challenging targets in relations to productivity and hole quality. This represents a significant R&D opportunity to improve the performance of current hole drilling process to keep up with the ever increasing customer demands. This paper investigates high speed hole drilling (0.8 mm diameter) of nickel based aerospace alloy (5-10 mm thick) with the state-of-the-art EDM and laser drilling machines. EDM trials were performed using GF Agie Charmilles, 7-axis Drill 300 unit and laser trials were performed using a DMG LT50 PowerDrill unit equipped with an IPG 20 kW QCW fibre laser sources. A 2-level 3-factor full factorial design was used to identify the preferred operating parameters for each process. The main investigation concentrates on identifying suitable hole drilling regimes for EDM and laser drilling process on basis of drilling speed, recast layer thickness and hole taper. Results showed a step change in drilling speed (4-5 folds) compared to previous generations of EDM and laser machines (ND:YAG laser and standard EDM drill), with significant enhancement in hole quality and integrity. EDM showed significantly better results with regards to recast layer (10-15 μm compared to -80 μm for laser) and geometric accuracy / taper particularly for thicker samples. Laser drilling, however, was far superior in terms of speed with <3s drilling time for 10 mm thick samples compared to 48s best recorded EDM drilling time.


Annicchiarico D.,Saint - Gobain | Attia U.M.,Manufacturing Technology Center Ltd. | Alcock J.R.,Cranfield University
Industrial and Engineering Chemistry Research | Year: 2014

The purpose of this paper was to evaluate the shrinkage behavior of a 316L molding feedstock. The methodology adopted a statistical approach (design of experiment) and a standard microshrinkage measurement approach. The statistical approach identified the mold temperature-parallel to the flow direction-and the combined effect of the holding and injection pressure-normal to the flow direction-as critical factors. In comparison with the polymer on which the feedstock was based, lower shrinkage values and fewer critical factors were observed. In conclusion, the lower shrinkage values were a consequence of the powder loading. The critical factors identified in the present work have found confirmation in the literature, except the absence of melt temperature between feedstock critical factors. © 2014 American Chemical Society.


Sun W.,University of Nottingham | Mohammed M.B.,Dunlop Oil and Marine Ltd | Xu L.,Manufacturing Technology Center Ltd | Hyde T.H.,University of Nottingham | And 2 more authors.
Journal of Strain Analysis for Engineering Design | Year: 2014

This article presents a comprehensive piece of research work focused on the development, validation and application of finite element modelling capability for the prediction and optimization of robotic keyhole plasma arc welding of Ti-6Al-4V thin structures. Experimental and computational investigations were carried out to characterize, develop, optimize and validate various aspects of the finite element modelling. The experimental investigations cover the determination of welding parameter envelopes using a robotic welding cell and the measurements of thermal history, distortion, residual stress and weld pool profile. The computational investigations include the development and validation of finite element models as well as the development and validation of a fully automated welding sequence optimization tool using a genetic algorithm approach. The work provides useful guidance and generic methodologies for optimum design of thin and complex lightweight structures and has formed a basis for the development of a framework on structural integrity assessment and component lifing of thin structures fabricated by welding. The optimization tool has significant potential to be conveniently modified to suit other optimization objectives and/or welding processes. © IMechE 2014.


Annicchiarico D.,Cranfield University | Attia U.M.,Manufacturing Technology Center Ltd. | Alcock J.R.,Cranfield University
Polymer Testing | Year: 2013

Purpose The aim of this paper is to optimise process conditions in micro injection moulding (μ-IM) to minimise shrinkage whilst maximising part mass. Method A Design of Experiment (DoE) approach was implemented for studying the effect of five processing parameters on shrinkage and part mass. A multiple quality criteria based analysis was used to optimise the process. Results Significant factors were found for shrinkage and part mass. Conclusions The multiple quality criteria could be optimized, and this optimization validated experimentally. © 2013 Elsevier Ltd. All rights reserved.


Scrimieri D.,University of Nottingham | Afazov S.M.,Manufacturing Technology Center Ltd | Ratchev S.M.,University of Nottingham
Advances in Engineering Software | Year: 2015

The simulation of a manufacturing process chain with the finite element method requires the selection of an appropriate finite element solver, element type and mesh density for each process of the chain. When the simulation results of one step are needed in a subsequent one, they have to be interpolated and transferred to another model. This paper presents an in-core grid index that can be created on a mesh represented by a list of nodes/elements. Finite element data can thus be transferred across different models in a process chain by mapping nodes or elements in indexed meshes. For each nodal or integration point of the target mesh, the index on the source mesh is searched for a specific node or element satisfying certain conditions, based on the mapping method. The underlying space of an indexed mesh is decomposed into a grid of variable-sized cells. The index allows local searches to be performed in a small subset of the cells, instead of linear searches in the entire mesh which are computationally expensive. This work focuses on the implementation and computational efficiency of indexing, searching and mapping. An experimental evaluation on medium-sized meshes suggests that the combination of index creation and mapping using the index is much faster than mapping through sequential searches. © 2015 Elsevier Ltd. All rights reserved.

Loading Manufacturing Technology Center Ltd collaborators
Loading Manufacturing Technology Center Ltd collaborators