Luxtera Inc., founded in 2001, is based in Carlsbad, California. Luxtera is a fabless semiconductor company that is using silicon photonics technology to build complex electro-optical systems in a production silicon CMOS process. It is the first company on the market with a product that monolithically incorporates active optics for data communications manufactured with low-cost silicon-based chip processing.This class of technology is widely predicted to displace large portions of the existing photonics industry that rely on discrete assemblies of electronic and photonic devices. Luxtera's partners include Freescale Semiconductor . Luxtera is a Caltech spin-out with funding from venture capital, its business partners, and DARPA. It was founded by a number of members of Prof. Axel Scherer's lab group, including Cary Gunn, Michael Hochberg, Tom Baehr-Jones, and also Axel Scherer. Other co-founders include Prof. Eli Yablonovitch and John Oxaal.In 2010, Luxtera was selected as one of MIT Technology Review's 50 Most Innovative Companies. Wikipedia.
Luxtera | Date: 2015-09-04
Methods and systems for a multi-level encoded data path with decoder are disclosed and may include, in a receiver on a chip: receiving a multi-level encoded signal, generating a plurality of copy signals offset from the multi-level encoded signal by a configurable offset voltage, comparing each copy signal against a different threshold level, and generating binary data based on the comparison. At least one of the plurality of copy signals may be compared using a clock data recovery module and/or using a retimer, which may comprise at least one D flip-flop. The multi-level encoded signal may comprise a pulse amplitude modulated-4 (PAM-4) signal. The multi-level encoded signal may be received from a photodiode on the chip. An optical signal may be communicated to the photodiode from a grating coupler on the chip.
Luxtera | Date: 2015-01-27
Methods and systems for coupling a light source assembly to an optical integrated circuit are disclosed and may include a system comprising a laser source assembly having a laser, a rotator, and a mirror, where the laser source assembly is coupled to a die including an angled grating coupler and a waveguide. The system may generate an optical signal utilizing the laser, rotate the polarization of the optical signal utilizing the rotator, reflect the rotated optical signal onto the grating coupler on the die, and couple the optical signal to the waveguide, where an angle between a grating coupler axis that is parallel to the waveguide and a plane of incidence of the optical signal reflected to the angled grating coupler is non-zero. The angle between the grating coupler axis and the plane of incidence of the optical signal reflected to the angled grating coupler may be 45 degrees.
Luxtera | Date: 2015-12-02
Methods and systems for a narrowband, non-linear optoelectronic receiver are disclosed and may include amplifying a received signal, limiting a bandwidth of the received signal, and restoring the signal utilizing a level restorer, which may include a non-return to zero (NRZ) level restorer comprising two parallel inverters, with one being a feedback path for the other. The inverters may be single-ended or differential. A photogenerated signal may be amplified in the receiver utilizing a transimpedance amplifier and programmable gain amplifiers (PGAs). A received electrical signal may be amplified via PGAs. The bandwidth of the received signal may be limited utilizing one or more of: a low pass filter, a bandpass filter, a high pass filter, a differentiator, or a series capacitance on the chip. The signal may be received from a photodiode integrated on the chip, where the photodiode may be AC coupled to an amplifier for the amplifying.
Luxtera | Date: 2015-06-03
Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include in an optoelectronic transceiver comprising photonic and electronic devices from two complementary metal-oxide semiconductor (CMOS) die with different silicon layer thicknesses for the photonic and electronic devices, the CMOS die bonded together by metal contacts: communicating optical signals and electronic signals to and from said optoelectronic transceiver utilizing a received continuous wave optical signal as a source signal. A first of the CMOS die includes the photonic devices and a second includes the electronic devices. Electrical signals may be communicated between electrical devices to the optical devices utilizing through-silicon vias coupled to the metal contacts. The metal contacts may include back-end metals from a CMOS process. The electronic and photonic devices may be fabricated on SOI wafers, with the SOI wafers being diced to form the CMOS die.
Luxtera | Date: 2015-02-03
Methods and systems for optical power monitoring of a light source assembly coupled to a silicon photonically-enabled integrated circuit (chip) are disclosed and may include, in a system comprising an optical source assembly coupled to the chip: emitting a primary beam from a front facet of a laser in the optical source assembly and a secondary beam from a back facet of the laser, directing the primary beam to an optical coupler in the chip, directing the secondary beam to a surface-illuminated photodiode in the chip, and monitoring an output power of the laser utilizing an output signal from the photodiode. The primary beam may comprise an optical source for a photonics transceiver in the chip. The focused primary beam and the secondary beam may be directed to the chip using reflectors in a lid of the optical source assembly.