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Waterbury, CT, United States

Berriaud C.,CEA Saclay Nuclear Research Center | Bermond S.,CEA Saclay Nuclear Research Center | Dechambre T.,CEA Saclay Nuclear Research Center | Gheller J.M.,CEA Saclay Nuclear Research Center | And 7 more authors.
IEEE Transactions on Applied Superconductivity | Year: 2012

The Iseult/INUMAC 11.7 T MRI magnet uses NbTi conductors larger than those typically used in conventional MRI magnets. The principal conductors are the main coil one, producing the magnetic field of 11.7 T and the conductor of the shielding coil that limits the fringe field. Both conductors are being produced by Luvata Waterbury Inc. The main coil conductor is a Rutherford cable in a copper channel (160 km) and carries 1500 A at 12 T and 2.8 K (2727 A at 9.5 T and 4.2 K). The shielding coil conductor is a wire in channel (60 km) and carries 2100 A at 5 T and 4.2 K. The conductor shape must be very precise with reproducible dimensions (tolerances below 15 microns) to enable good magnetic field homogeneity. They must also simultaneously exhibit a low electrical resistance (20 Ω/m at 10 K and 12 T) and a high mechanical strength (σ0.2% > 250 MPa). Conductors of this industrial production are characterized by mechanical, electrical and geometrical measurements. © 2011 IEEE. Source


Kanithi H.,Luvata Waterbury Inc. | Blasiak D.,Luvata Waterbury Inc. | Lajewski J.,Luvata Waterbury Inc. | Berriaud C.,CEA Saclay Nuclear Research Center | And 3 more authors.
IEEE Transactions on Applied Superconductivity | Year: 2014

Large quantities of NbTi-based superconductors have been produced for the 11.75 Tesla whole body magnetic resonance imaging project called the Iseult/INUMAC managed by CEA Saclay. The magnet is designed to operate at 1.8 K. Production consisted of nearly 65 t (170 km) of a large 9.2 mm \times 4.9 mm Rutherford cable-in-channel for the main coil and 22 t (58 km) of a 9.1 mm \times 4.2 mm wire-in-channel for the shield. These have been successfully manufactured, inspected, and delivered. The key technical requirements were dimensional precision, superconducting properties, RRR, and tensile strength. An extensive quality assurance program was instituted to guarantee the final conductor performance. Measured degradation in superconducting characteristics due to cabling and solder integration were negligible ( < 3%). Results show that we have achieved state-of-the-art critical current density and n values for this very high field NbTi application. We will report test data including statistical summaries. © 2013 IEEE. Source


Kanithi H.,Luvata Waterbury Inc. | Pyon T.,Luvata Waterbury Inc. | Lajewski J.,Luvata Waterbury Inc. | Berglund D.,Summit Corporation | And 3 more authors.
IEEE Transactions on Applied Superconductivity | Year: 2012

ITER conductors for Toroidal Field (TF) and Central Solenoid (CS) coils require many strands of Nb 3Sn and copper with a 1 to 2 micron thin coating of chromium. The purpose of the Cr is two-fold: to keep the strands from sintering during a prolonged high temperature reaction treatment and to offer inter-strand resistance. Up until recently Cr plating is applied using a hexavalent chrome (Cr-VI) electrolytic process. This process is highly toxic and requires expensive and strict environmental and safety controls. No reel-to-reel plating lines are available in the US suitable for plating wire since there has been no need for such plating of commercial wires. Therefore Summit Corp. of America and Luvata Waterbury, Inc. have developed an efficient and economical plating process based on environmentally friendly and less toxic trivalent chrome (Cr-III). We have studied adhesion of Cr to the base copper, its ductility, texture, thermal stability and residual resistivity ratio (RRR) of base copper following the high temperature heat treatment. After detailed evaluation and side-by-side comparison of Cr-III and Cr-VI plating we have successfully qualified the later for the ITER TF strands. The new process has coated over 15 tons of superconductor and Cu strand with stable and predictable performance. Process and performance details will be presented in this paper. © 2011 IEEE. Source

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