Lite-On Technology | Date: 2016-03-03
A manufacturing method of filling a resin into a housing includes the steps of: providing a housing that has at least one recess, with the recess having first and second spaces, and the first space being disposed above the second space; inverting the housing; injecting a fluid into the recess to fill the first space, with the fluid having a viscosity coefficient and a surface tension less than those of water; and injecting a first resin into the recess, with the first resin having a specific gravity greater than that of the fluid, such that the first resin fills the first space and the fluid fills the second space.
Lite-On Technology | Date: 2016-08-03
A signal light (1, 1a, 1b) includes a case (10), a light emitting unit (20), a light distribution cover (30), and a curved lens (40, 40a, 40b). The case (10) includes a bottom case (11). The light emitting unit (20) is located on the bottom case (11). The light distribution cover (30) is connected to the case (10). The light distribution cover (30) includes an inclined curved surface (31). The curved lens (40, 40a, 40b) is located between the bottom case (11) and the inclined curved surface (31).
LITE ON ELECTRONICS GUANGZHOU Ltd and Lite-On Technology | Date: 2016-06-16
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages.
LITE ON ELECTRONICS GUANGZHOU Ltd and Lite-On Technology | Date: 2016-10-06
The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs and binding each other by a wing portion. A separating process is proceeding to form a plurality of flip-chip LED structures without the carrier. A bonding process is proceeding to attach at least one flip-chip LED structure on the circuit board.
Lite-On Technology | Date: 2016-05-04
A wireless charging transmitter is provided for charging an electronic device having a receiver coil. The wireless charging transmitter includes a charging module, including a transmitter coil electromagnetically coupled to the receiver coil, and a comb-shaped combination of shielding and planar dipole antenna array. The comb-shaped combination of shielding and planar dipole antenna array includes a plurality of dipole antennas; each of the dipole antennas includes a plurality of comb-like antenna portions.
Lite-On Technology | Date: 2016-03-29
An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.
LITE ON ELECTRONICS GUANGZHOU Ltd and Lite-On Technology | Date: 2016-08-09
A key structure includes a supporting board, a base board, a pre-stressing force applying assembly, a key cap, a pivot assembly, an attractable element and a magnetic element. The pre-stressing force applying assembly is connected to the supporting board or the base board. When the magnetic element is under the first attractive position, the first end of the attractable element is attracted by the magnetic force and moved to the first attractive position, and the pre-stressing force applying assembly generates a first pre-stressing force; when the magnetic element is under the second attractive position, the second end of the attractable element is attracted by the magnetic force and moved to the second attractive position, and the pre-stressing force applying assembly generates a second pre-stressing force. The first pre-stressing force or the second pre-stressing force reduces the resistance during the sliding of the base board or the supporting board.
Lite on Electronics Guangzhou Ltd and Lite-On Technology | Date: 2016-09-14
An external power supply (1, 1a, 1b) and a system connection detection unit (12, 12a, 12b) applied thereto are provided. For providing DC power, the external power supply (1, 1a, 1b) separably connects with a positive input terminal (Tc) and a negative input terminal (Td) of a system (2) through a positive output terminal (Ta) and a negative output terminal (Tb) respectively. When the positive output terminal (Ta) and the negative output terminal (Tb) are respectively connected to the positive input terminal (Tc) and the negative input terminal (Td), a system detection terminal (DETa) connects with a system connection terminal (DETb) of the system (2), and a connection status signal (CS) generated by the system connection detection unit (12, 12a, 12b) switches the operation of the external power supply (1, 1a, 1b) from deep sleeping mode to normal operation mode. The system connection terminal (DETb) is electrically connected to one of the positive input terminal (Tc) and the negative input terminal (Td) through at least a first resistive element (Rs).
Lite-On Technology | Date: 2016-03-17
A detection circuit for an AC-to-AC power converter includes a voltage divider circuit that has three AC input terminal coupled respectively to three input ends of a power converter which are to receive respectively three AC input power signals with different phases, and that receives a predetermined first reference voltage. Upon receiving one AC input power signal, the voltage divider circuit outputs a divided voltage, which during an active period of the one AC input power signal, is greater than a predetermined second reference voltage, to a comparator, which also receives the predetermined second reference voltage, such that the comparator outputs a detection signal that is in an active state when the one AC input power signal is.
Lite-On Technology | Date: 2016-02-10
The disclosure provides a testing module including a carrier, a block member, and a sampling assembly. A flow path connects a storage chamber to a mixing chamber to guide the flow of a fluid. The block member is formed in the flow path to block the fluid from flowing from the storage chamber to the mixing chamber before the connection of the sampling assembly. When the sampling assembly which contains a test sample is connected to the carrier, the fluid mixes with the test sample and flows to the mixing chamber.