Warabi, Japan
Warabi, Japan

Time filter

Source Type

Patent
LINTEC Corporation | Date: 2017-04-26

A base film (2) for dicing sheets that is used in a dicing sheet (1) comprising the base film (2) and a pressure sensitive adhesive layer (3) laminated on one surface of the base film (2) . The base film (2) comprises at least a first resin layer (A) that is in contact with the pressure sensitive adhesive layer (3) of the dicing sheet (1) and a second resin layer (B) that comes into contact with the first resin layer (A) when the base film (2) for dicing sheets is wound up. The second resin layer (B) has a crystallinity of 28% to 45% The ratio of a tensile elastic modulus of the first resin layer (A) to a tensile elastic modulus of the second resin layer (B) is 1.2 to 3.0. The ratio of a thickness of the first resin layer (A) to a thickness of the base film (2) for dicing sheets is 25% to 80%. According to the base film (2) for dicing sheets, the occurrence of blocking can be suppressed, the chipping resistance is excellent during the dicing of a cut object, and the dicing debris generated during the dicing can be reduced.


The present invention is a curable composition comprising a component (A) and a component (B),the curable composition producing a cured product that has a solid-state Si nuclear magnetic resonance spectrum in which a peak is observed within a range from -80 ppm or more to less than -40 ppm, and a half-width of the peak is 500 to 900 Hz,the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1),R^(1)SiO_(3/2)(a-1)the component (B) being at least one silane coupling agent selected from a group consisting of a silane coupling agent that comprises a nitrogen atom in its molecule, and a silane coupling agent that comprises an acid anhydride structure in its molecule, anda method for producing the curable composition, anda cured product, anda method for using the curable composition, andan optical device.


The present invention is : a curable composition comprising a component (A), a component (B), and a component (C), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:50, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1),R^(1)SiO_(3/2)(a-1)wherein R^(1) is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group, the component (B) being fine particles having an average primary particle size of 5 to 40 nm, and the component (C) being a silane coupling agent that comprises an acid anhydride structure in its molecule. This invention provides: a curable composition that produces a cured product that exhibits excellent adhesion, excellent delamination resistance, and excellent heat resistance, and exhibits excellent workability during the application step, a method for producing the same, a cured product obtained by curing the curable composition, a method for using the curable composition as an optical element-securing adhesive or an optical element sealing material, and an optical device.


The present invention is a curable composition comprising a component (A), a component (B), a component (C), and a component (D), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:20,the component (A) being a silane compound (co)polymer that is represented by a formula (a-1) or a formula (a-2),(CHR^(1)X^(0)-D-SiO_(3/2))_(m)(R^(2)SiO_(3/2))_(n)(CHR^(1)X^(0)-D-SiZ^(1)O_(2/2))_(o)(R^(2)SiZ^(2)O_(2/2))_(p)(CHR^(1)X^(0)-D-SiZ^(3)_(2)O_(1/2))_(q)(R^(2)SiZ^(4)_(2)O_(1/2))r (a-1)(R^(3)SiO_(3/2))_(s)(R^(3)SiZ^(5)O_(2/2))_(t)(R^(3)SiZ^(5)_(2)O_(1/2))_(u) (a-2)the component (B) being fine particles having an average primary particle size of more than 0.04 m and 8 m or less,the component (C) being a silane coupling agent that comprises a nitrogen atom in its molecule, andthe component (D) being a silane coupling agent that comprises an acid anhydride structure in its molecule, andan optical element-securing composition, anda cured product, andan optical element-securing material, anda method for using the curable composition, andan optical device.


The present invention is : a curable composition comprising a component (A), a component (B), and a component (C), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:50, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1),R ^(1) S i O _(3/2)(a-1)wherein R^(1) is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group, the component (B) being fine particles having an average primary particle size of 5 to 40 nm, and the component (C) being a silane coupling agent that comprises a nitrogen atom in its molecule. This invention provides: a curable composition that produces a cured product that exhibits excellent adhesion, excellent delamination resistance, and excellent heat resistance, and exhibits excellent workability during the application step, a method for producing the same, a cured product obtained by curing the curable composition, a method for using the curable composition as an optical element-securing adhesive or an optical element sealing material, and an optical device.


Patent
Lintec Corporation and Kyushu Institute of Technology | Date: 2016-01-06

The invention provides a thermoelectric conversion material having a low thermal conductivity and an improved figure of merit and a production method for the material, and also provides a thermoelectric conversion module. The thermoelectric conversion material has, on a porous substrate having microscopic pores, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the porous substrate has a polymer layer (B) on a plastic film (A) and the microscopic pores are formed in the polymer layer (B) and in a part of the plastic film (A). The production method for the thermoelectric conversion material comprises a substrate formation step of forming a porous substrate including a step 1, a step 2 and a step 3, and comprises a film formation step of forming a thermoelectric semiconductor layer through film formation of a thermoelectric semiconductor material on the porous substrate. The thermoelectric conversion module uses the thermoelectric conversion material.


Patent
Lintec Corporation | Date: 2016-04-13

[Problems] There is provided a pressure sensitive adhesive tape which can reduce the amount of migrated components from the pressure sensitive adhesive tape to an adherend while appropriately ensuring the attaching property to the adherend. [Solution] A pressure sensitive adhesive tape comprising a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer is formed of a pressure sensitive adhesive composition that contains a block copolymer of an acrylic-based monomer as the base polymer, wherein the total amount of an unreacted monomer raw material contained in the pressure sensitive adhesive layer is 100 ppm or less.


Patent
Lintec Corporation | Date: 2016-03-23

An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.


Patent
LINTEC Corporation | Date: 2016-02-03

A protective film-forming composite sheet 10 comprises a pressure sensitive adhesive sheet 16 in which a pressure sensitive adhesive layer 12 is provided on a base material 11, a protective film-forming film 13, and a release film 14. When (mN/25 mm) represents the maximum peel force between the protective film-forming film 13 and the release film 14; (mN/25 mm) represents the minimum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13; and (mN/25 mm) represents the maximum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13, the following relationships (1) to (3) hold for , , and :


Patent
Lintec Corporation | Date: 2016-09-28

A base film is provided which can suppress the occurrence of cutting fragments in the dicing step and is excellent in the expandability and recoverability. The base film (2) includes an expandable layer (B) laminated on a cutting-fragment suppression layer (A) and having a laminate structure of a plurality of resin-based sublayers. The resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R1) after 5 minutes of 10%-stretching. The resin-based sublayer (B2) other than the resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R2) after 5 minutes of 10%-stretching. The stress-relaxation rate R1 and the stress-relaxation rate R2 satisfy the conditions represented by Expressions (i) to (iii) below. The cutting-fragment suppression layer (A) contains a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).

Loading Lintec Corporation collaborators
Loading Lintec Corporation collaborators