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Qin S.,Lianyungang HHCK Electronic Materials Co. | Tao J.,Lianyungang HHCK Electronic Materials Co. | Han J.,Lianyungang HHCK Electronic Materials Co. | Yang Q.,Lianyungang HHCK Electronic Materials Co. | Xie L.,Lianyungang HHCK Electronic Materials Co.
ECS Transactions | Year: 2014

The trends of flip chip technology are lead free, reduced bump pitch design, low-k wafer, large die, etc. These technologies bring challenges to flip chip underfill. Lead free solder bumps also have less solder fatigue resistance compared to traditional solder. Low-k materials are mechanically weak and fragile which request underfill have higher modulus and Tg to lower stress on solder bump, and lower modulus and Tg to lower stress on Si die. Flip chip underfill need balances properties, such as Tg, modulus, and CTE. This study did research on hardener, filler and rubber. The new amine chemistry allows for leap in performance in large die, lead-free and low-k applications. The Features of the underfill are Low stress, tailored Tg and modulus, low CTE, High fracture resistance and large processing window. © 2014 The Electrochemical Society. Source

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