Daejeon, South Korea
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The present specification provides a hetero-cyclic compound and an organic light emitting device comprising the same.


— Semiconductor Packaging Material Global Market Synopsis & Scenario Semiconductor packaging material global market is growing with the up surged Sales of Smartphones and Smart Devices, however the growth may get restricted by the high Dependency on Performance of Semiconductor Equipment Industry Redistributed Chip Packaging is is very popular in the market; this has ultimately become a trend followed by almost every manufacturer of the global market of Semiconductor Packaging Material. Semiconductor Packaging Material Global Market Key Players Semiconductor packaging material manufacturers and subcontractors are experiencing a severe pricing pressure from their customers. Thus, manufacturers are pushing cost reduction at a faster pace to offset erosion in semiconductor average selling prices (ASP). Identified by MRFR Analysts, as the leading market players operating in the global semiconductor packaging material market primarily include • Henkel AG • Hitachi Chemical • Sumitomo Chemical • Kyocera Chemical • Mitsui High-Tec • Toray Industries Corporation • Alent PLC • LG Chemical Semiconductor Packaging Material Global Market Segmentation Semiconductor packaging material global market has been segmented in to 2 key dynamics for an enhanced understanding and convenience of the report. By Types: Organic substrates, bonding wires, encapsulation resins, ceramic packages, solder balls, wafer level packaging dielectrics and others. By Technology: Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package and others. The World of consumer electronics shapes (Changes) depending upon the changes taking place in semiconductor devices world ie the thickness of the semiconductor device, die (diodes) attached and bonding wire and encapsulated with materials playing a major role enabling the development of newer packaging technologies. Semiconductor Packaging Material Market Regional Analysis Geographically, Asia-Pacific is one of the crucial markets due to the presence of vast electronic industry in China, Japan and South Korea. This factor has placed Asia-Pacific the leading market in near future followed by North America and Europe. Semiconductor Packaging Material Global Market – Overview A semiconductor package refers to a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components. Individual discrete components are typically etched in silicon wafer before being cut and assembled in a package. The package provides protection against impact and corrosion holds the contact pins or leads which are used to connect from external circuits to the device, and dissipates heat produced in the device. Thousands of standard package types are made, with some made to industry-wide standards and some particular to an individual manufacturer. Semiconductor Packaging Material Market has witnessed a remarkable growth over the past few years, globally, owing to the rising demand for mobile phones, tablets and other communication devices and as per the MRFR estimation the market will keep on growing during the forecast year. The global semiconductor packaging material market had valued in billions in 2015, the market is expected to grow further surpassing its previous growth records by 2027 with a remarkable CAGR during the forecasted period (2017-2027), predicts the Market Research Future in the recent study report - Global Semiconductor Packaging Material Market. The semiconductor packaging materials is a major platform to the success of the semiconductor business across the globe and the changes in consumer electronics is driving the changes in packaging materials market. The major factor driving the global market of SPM is constantly growing mobile industry and technological advancements. The global market of semiconductor packaging material has augmented exceptionally well owing to the increased demand for mobile and other communication devices, enlightens us the MRFR Team Research Analyst while commenting upon this deep diving study report, presented through more than 100 market data tables and figures, widely spread over 115 pages Table of Content 1 Executive Summary 2 Scope Of The Report 2.1 Market Definition 2.2 Scope Of The Study 2.2.1 Research Objectives 2.2.2 Assumptions & Limitations 2.3 Markets Structure 3 Market Research Methodologies 3.1 Research Process 3.2 Secondary Research 3.3 Primary Research 3.4 Forecast Model 4 Market Landscape 4.1 Five Forces Analysis 4.1.1 Threat Of New Entrants 4.1.2 Bargaining power of buyers 4.1.3 Threat of substitutes 4.1.4 Segment rivalry 4.2 Value Chain of Global Semiconductor Packaging Material Market 5 Industry Overview of Global Semiconductor Packaging Material Market 5.1 Introduction 5.2 Growth Drivers 5.3 Impact analysis 5.4 Market Challenges 5.5 Impact analysis 6 Market Trends 6.1 Introduction 6.2 Growth Trends 6.3 Impact analysis Continue…… Related Report Global Glass Packaging Market Information by Application (Alcoholic beverages, food & beverages, pharmaceuticals and others) and by Region - Forecast to 2021 https://www.marketresearchfuture.com/reports/glass-packaging-market About Market Research Future: At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services. For more information, please visit https://www.marketresearchfuture.com/reports/semiconductor-packaging-material-market


Park M.-H.,Ulsan National Institute of Science and Technology | Kim K.,LG Chemical Ltd | Kim J.,LG Chemical Ltd | Cho J.,Ulsan National Institute of Science and Technology
Advanced Materials | Year: 2010

Simple physical blending of SiO2 and ethylcapped Ce gels leads to flexible dimensional control of Ge nanoparticles, and an increasing weight fraction of the latter leads to ordered 3D porous nanoparticle assemblies (see figure). The long-range ordering of the 3D porous Ge nanoparticles and their very thin pore wall thicknesses (<20nm) induce excellent cycling performance, showing only a 2% capacity decrease after 100 cycles. (Figure Presented) © 2010 WILEY-VCH Verlag GmbH & Co. KGaA.


Park M.-H.,Ulsan National Institute of Science and Technology | Cho Y.,Ulsan National Institute of Science and Technology | Kim K.,LG Chemical Ltd. | Kim J.,LG Chemical Ltd. | And 2 more authors.
Angewandte Chemie - International Edition | Year: 2011

Ultralong germanium nanotubes (Ge NTs; see picture) are synthesized in high yield from core-shell Ge-Sb nanowires by utilizing the Kirkendall effect at 700 °C. The Ge NTs have an exceptionally high rate capability (40 Ag -1) while maintaining a reversible capacity of more than 1000 mAhg-1 over 400 cycles, with minimal capacity fading when paired with a LiCoO2 cathode in a lithium-ion cell. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.


Jung J.,LG Chemical Ltd. | Kim H.,LG Chemical Ltd. | Han Y.-K.,Korea Basic Science Institute
Journal of the American Chemical Society | Year: 2011

We investigated the structure and stability of several aluminum hydride complexes to understand the essence of "superatom chemistry" and to gain a right perspective on the ligand (L)-stabilized metal (M) clusters. We successfully interpret the structure and stability using molecular orbital analysis, which clearly shows the failure of an electron-shell closing model (or a superatom model) to explain it. The structure and stability of Al mHn are closely associated with the molecular orbital stabilization owing to the effective orbital overlap between Alm (Mm) and nH (nL). The importance of retaining the electronic structural integrity of Mm in MmLn-within an electron-shell closing model-has been underestimated or even disregarded, and this has created the current controversies in the scientific community. © 2011 American Chemical Society.


Lee J.S.,Korea Advanced Institute of Science and Technology | Lee S.H.,Korea Advanced Institute of Science and Technology | Kim J.,LG Chemical Ltd | Park C.B.,Korea Advanced Institute of Science and Technology
Journal of Materials Chemistry A | Year: 2013

We report the synthesis of a 3D-structured graphene-Rh-complex hydrogel that works as a robust catalyst for electroenzymatic reactions. When α-ketoglutarate was electroenzymatically converted to l-glutamate in the presence of graphene-Rh-complex hydrogel, the l-glutamate yield increased more than 10 times than that of a free Rh complex. © The Royal Society of Chemistry 2013.


The present invention relates to a radical-curable adhesive composition including a (A) radical-polymerizable compound having at least one hydrophilic functional group in the molecule; a (B) phosphate-based compound having three (meth)acrylic groups in the molecule; and a (C) radical initiator, and a polarizing plate and an optical member including the radical-curable adhesive composition.


A device for preparing a lithium composite transition metal oxide includes first and second mixers continuously arranged in a direction in which a fluid proceeds, wherein the first mixer has a closed structure including a hollow fixed cylinder, a rotating cylinder having the same axis as that of the hollow fixed cylinder and having an outer diameter that is smaller than an inner diameter of the fixed cylinder, an electric motor to generate power for rotation of the rotating cylinder, a rotation reaction space, as a separation space between the hollow fixed cylinder and the rotating cylinder, in which ring-shaped vortex pairs periodically arranged along a rotating shaft and rotating in opposite directions are formed, first inlets through which raw materials are introduced into the rotation reaction space, and a first outlet to discharge a reaction fluid formed from the rotation reaction space.


Disclosed is an apparatus for estimating a voltage of a secondary battery which includes a cathode comprising a first cathode material and a second cathode material with different operating voltage ranges, an anode comprising an anode material and a separator for separating the cathode from the anode. The apparatus comprises a control unit configured to estimate a voltage of a secondary battery based on a circuit model including a first cathode material circuit, a second cathode material circuit and an anode material circuit, each circuit modeled to change its voltage according to State Of Charge (SOC) of the electrode material corresponding the circuit and a current flowing through the circuit.


Patent
L G Chemical LTD. | Date: 2015-11-16

The present invention relates to a copolycarbonate and a composition comprising the same. The copolycarbonates according to the present invention has a structure in which a specific siloxane compound is introduced in a main chain of the polycarbonate, and thus exhibits improved chemical resistance and impact strength simultaneously.

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