Leybold Optics GmbH

Alzenau in Unterfranken, Germany

Leybold Optics GmbH

Alzenau in Unterfranken, Germany
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Grant
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ENERGY.2011.2.1-3 | Award Amount: 12.61M | Year: 2012

CPV4ALL propose an innovative solution for concentration-based photovoltaic electricity beyond grid parity kWh prices and is oriented on short term results. CPV4ALL aims towards large scale replication in 2015 so that the demonstrated technologies will quickly lead to market deployment and thus significantly contribute to the EU energy and climate change policy (20-20-20 targets by 2020). CPV4ALL focuses on demonstrating and validating, at industrial scale, the production technology for the components and the assembly technology for the CPV modules and system. The developed CPV systems itself will undergo extensive evaluation programmes at test sites and real situations by CEA-INES. In order to realize the concepts and objectives described in the previous sections, a structure of six work packages has been defined. WP1 is focused on RTD activities and deals with the development and optimisation of the system components. In WP2-3-4 the necessary demonstration activities will be defined and developed. WP2 is dedicated to the demonstration of pilot line for the manufacturing of components and module assembly for volume > 100.000 modules/yr, while WP3 focuses on the demonstration of high-throughput manufacturing processes of critical system components for volume > 1 million units/yr. During WP4 will take place the demonstration and evaluation of CPV systems in various location (France, Austria, The Netherlands) and for various system configuration (Agricultural, Transport, Real estate, etc..). Dissemination activities under WP5 include also the preparation of a market deployment plan and the identification and selection of third parties. WP6 is dedicated to the project and risk management .


Patent
Saint - Gobain and Leybold Optics GmbH | Date: 2011-02-14

The invention relates to a heat treatment inner chamber (3) for thermally processing a substrate (20), having walls (10) which enclose an inner space (24) of the heat treatment inner chamber (3), having a mounting apparatus (8) for mounting the substrate (20) during the thermal processing and having an energy source (11) for introducing energy into the inner space (24) of the heat treatment inner chamber (3), at least one part of the inner sides of the walls (10) being formed in order to reflect power introduced by the energy source (11), wherein the at least one part of the inner sides of the walls (10) consists of a material which is highly reflective at least for infrared radiation. The invention furthermore relates to a heat treatment inner chamber (3) for thermally processing a substrate (20), having walls (10) which enclose an inner space (24) of the heat treatment inner chamber (3), having a mounting apparatus (8) for mounting the substrate (20) during the thermal processing and having an energy source (11) for introducing energy into the inner space (24) of the heat treatment inner chamber, wherein a cooling device (14) is provided for cooling the walls (10).


Patent
Leybold Optics GmbH | Date: 2014-03-26

The invention relates to an apparatus for the vacuum treatment of substrates (130), comprising a vacuum chamber (1) having a plasma device (160) of a process chamber (110) and a holding device (135) for substrates (130), which is arranged in the process chamber (110), underneath the plasma device, wherein the process chamber (110) comprises an upper subsection (105a) having a side wall (106a) and a lower subsection (105b) having a side wall (106b), and the upper subsection (105a) and the lower subsection (105b) can be moved vertically relative to each other. According to the invention between the side wall (106a) of the upper subsection (105a) and the side wall (106b) of the lower subsection (105b), a lower flow path (105c) extends between the inner region (140) of the process chamber (110) and the inner region (1a) of the vacuum chamber (1) that is arranged outside the upper subsection (105a). Furthermore, between an upper edge region (107) of the upper subsection (105a) and a sealing element (109) arranged in an upper part of the inner region (1a) of the vacuum chamber (1), an upper flow path (190) is provided between the inner region (140) of the process chamber (110) and the inner region (1a) of the vacuum chamber (1) that is arranged outside the upper subsection (105a), wherein the upper subsection (105a) can be moved relative to the vacuum chamber (1) into a lower position, in which the upper flow path (190) is opened, the upper subsection (105a) can be moved relative to the vacuum chamber (1) into an upper position, in which the upper flow path (190) is closed.


The invention relates to an apparatus (1) for producing a reflection-reducing layer on a surface (21) of a plastics substrate (20). The apparatus comprises a first sputtering device (3) for applying a base layer (22) to the surface (21) of the plastics substrate (20), a plasma source (4) for plasma-etching the coated substrate surface (21), and a second sputtering device (5) for applying a protective layer (24) to the substrate surface (21). These processing devices (3, 4, 5) are arranged jointly in a vacuum chamber (2), which has inlets (8) for processing gases. In order to move the substrate (20) between the processing devices (3, 4, 5) in the interior of the vacuum chamber (2), a conveying apparatus (10) is provided which is preferably in the form of a rotary table (11).Furthermore, the invention relates to a method for producing such a reflection-reducing layer on the surface (21) of the plastics substrate (20).


Patent
Leybold Optics GmbH | Date: 2011-10-21

The invention relates to an apparatus (1) for coating a surface (21) of a substrate (20). The apparatus comprises a processing chamber (2) with a particle source (3) for producing coating particles (19), which are also deposited on the inner wall (5) of the processing chamber (2) and on shielding apparatuses (4) arranged therein during operation, in addition to the desired coating of the substrate surface. As the operating time increases, the layer thickness of these deposits (6) grows until the latter undergo spalling, which can lead to contamination of the substrate surfaces to be coated. In order to prevent this, shielding screens (10, 10) are arranged on the inner wall (5) of the processing chamber (2) and/or on the shielding apparatuses (4) and prevent deposits (6, 7) which undergo spalling from passing into the interior (17) of the processing chamber (2). The shielding screens (10, 10) consist preferably of an expanded metal. The invention also relates to a process for coating a surface (21) of a substrate (20), including


Patent
Leybold Optics GmbH | Date: 2015-06-19

The invention concerns an optical coating (3, 3), having a high refractive index and good optical properties (i.e., low absorption and scatter) and limited internal stresses in a spectral range extending from the visible to the near UV range (i.e., up to a wavelength of 220 nm). The coating (3, 3) according to the invention consists of a hafnium- or zirconium-containing oxide Hf_(x)Si_(y)O_(z )or Zr_(x)Si_(y)O_(z )containing an silicon fraction (y) between 1 at. % and 10 at. %, especially between 1.5 at. % and 3 at. %.


Patent
Leybold Optics GmbH | Date: 2010-08-12

A treatment chamber for thermal processing of an areal substrate including a transport arrangement for conveying and supporting the substrate during the thermal processing and a gas-guiding arrangement for convective heating or cooling of the substrate, where the gas-guiding arrangement has outlet openings, by means of which the temperature-controlled gas is guided onto the substrate, and where a removal arrangement is provided, by means of which the gases introduced into the treatment chamber via the gas-guiding arrangement can be removed in a targeted fashion, such that the treatment chamber can be embodied as a heat-treatment chamber or as a cooling chamber.


Patent
Leybold Optics GmbH | Date: 2010-05-28

A method for cleaning at least one component arranged in the inner region of a plasma process chamber using a cleaning gas including fluorine gas, where the process chamber has at least one electrode and counter-electrode for generating a plasma for plasma treatment, where the inner region is exposed to gaseous fluorine compounds with a partial pressure of greater than 5 mbar, where the process chamber has at least one electrode and counter-electrode for generating a plasma, and the fluorine gas is thermally activated by means of a temperature-regulating means, where the component to be cleaned has a temperature of<350 C.


A method for reducing the optical loss of the multilayer coating below a predetermined value in a zone by producing coating on a displaceable substrate in a vacuum chamber with the aid of a residual gas using a sputtering device. Reactive depositing a coating on the substrate by adding a reactive component with a predetermined stoichiometric deficit in a zone of the sputtering device. Displacing the substrate with the deposited coating into the vicinity of a plasma source, which is located in the vacuum chamber at a predetermined distance from the sputtering device. The plasma action of the plasma source modifying the structure and/or stoichiometry of the coating, preferably by adding a predetermined quantity of the reactive component to reduce the optical loss of the coating.


Patent
Leybold Optics GmbH | Date: 2010-04-22

A method for generating a plasma beam and a plasma source for carrying out the method, where the plasma beam is extracted from a plasma generated by electric and magnetic fields by means of a radiofrequency voltage being applied to an extraction electrode and an RF electrode device having an excitation electrode having an excitation area, where a plasma space is arranged between extraction electrode and excitation area and the plasma, relative to the extraction electrode, on average over time, is at a higher potential which accelerates positive plasma ions, and the plasma and the extracted plasma beam are influenced by a magnetic field, it is provided that at least one magnet north pole and one magnetic south pole are used for generating the magnetic field, which in each case are arranged on a side facing away from the plasma behind the excitation electrode and are directed into the interior of the plasma space, such that a curved magnetic field projecting into the interior of the plasma space is formed, and where at least one of the north or south poles is embodied in elongate fashion, such that a tunnel-like region is formed in the plasma, in which charged particles are held and along which the latter can propagate.

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