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Patent
Lextar Electronics Corporation | Date: 2016-05-23

An LED chip package includes a substrate having a metal terminal (gold finger structure). A LED chip set is composed of a plurality of LED chips formed in one piece, and has a plurality of light-emitting areas which are separated from each other. The LED chip set is disposed on the substrate and electrically connected to the metal terminal.


Patent
Lextar Electronics Corporation | Date: 2016-05-31

A semiconductor light emitting structure includes a first type semiconductor layer, an active layer, a second type semiconductor layer, an electrode, a transparent conductive layer, a Bragg reflective layer and a metal layer. The first type semiconductor layer, the active layer and the second type semiconductor layer are stacked sequentially to form an epitaxy layer. The electrode is formed on the first type semiconductor layer. The transparent conductive layer is formed on the second type semiconductor layer. The Bragg reflective layer is formed on the transparent conductive layer. The Bragg reflective layer and electrode are disposed on opposite sides of the epitaxy layer. The metal layer is formed on the Bragg reflective layer. The Bragg reflective layer has a concave portion into which the metal layer is put. The metal layer has a current conducting portion embedded into the concave portion and electrically connected to the transparent conductive layer.


Patent
Lextar Electronics Corporation | Date: 2016-08-03

A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a silver-free material. The reflective cup has the cavity. The die is disposed on the lead-frame in a face-down orientation, and is further electrically connected to the lead-frame and located within the cavity.


Patent
Lextar Electronics Corporation | Date: 2017-04-26

A compound semiconductor film structure includes a substrate, a first compound semiconductor epitaxial layer and a second compound semiconductor epitaxial layer. The substrate has a top surface. The first compound semiconductor epitaxial layer is formed on the top surface and has an epitaxial interface and at least one recess, wherein the epitaxial interface is disposed on one side of the first compound semiconductor epitaxial layer opposite to the side of the first compound semiconductor epitaxial layer facing the top surface, and the at least one recess is formed in the first compound semiconductor epitaxial layer. The second compound semiconductor epitaxial layer formed on the epitaxial interface. The top surface and the bottom of recess are separated by a distance substantially ranging between 0.8m and 1.3m.


Patent
Lextar Electronics Corporation | Date: 2016-09-12

A compound semiconductor film structure includes a substrate, a first compound semiconductor epitaxial layer and a second compound semiconductor epitaxial layer. The substrate has a top surface. The first compound semiconductor epitaxial layer is formed on the top surface and has an epitaxial interface and at least one recess, wherein the epitaxial interface is disposed on one side of the first compound semiconductor epitaxial layer opposite to the side of the first compound semiconductor epitaxial layer facing the top surface, and the at least one recess is formed in the first compound semiconductor epitaxial layer. The second compound semiconductor epitaxial layer formed on the epitaxial interface. The top surface and the bottom of recess are separated by a distance substantially ranging between 0.8 m and 1.3 m.


The present invention provides a method for fabricating a fluoride phosphor. A first solution is formed by dissolving potassium fluoride (KF) and either K_(2)MnF_(6 )or KMnO_(4 )in a hydrofluoric acid solution. A second solution is formed by mixing a surfactant and a silane. The first solution and the second solution are mixed to form a precipitate. The precipitate is collected after the first solution and the second solution are mixed. The present invention also provides a fluoride phosphor represented by the following formula: K_(2)[SiF_(6)]:Mn^(4+). The fluoride phosphor has a particle size in a range of about 1 m to about 10 m. The present invention further provides a light-emitting apparatus and backlight module employing the same.


Patent
Lextar Electronics Corporation | Date: 2016-11-09

The present invention relates to an ultraviolet light-emitting diode (LED), which includes a gradual superlattice layer. The gradual superlattice layer comprises a first superlattice layer and a second superlattice layer. The first superlattice layer includes a multi-layer structure having repetitive stacks of a unit formed by a first layer and a second layer. The second superlattice layer includes a multi-layer structure having repetitive stacks of a unit formed by a third layer and a fourth layer. The concentrations of aluminum in the first, second, third, and fourth layers decrease sequentially. By disposing the gradual superlattice layer, the quality of the epitaxial structure may be improved apparently.


An epitaxial structure includes a substrate, a first epitaxial layer and a second epitaxial layer. The substrate has a surface, and the first epitaxial layer is disposed over the substrate and defines a plurality of stepped air voids and an opening over each of the stepped air voids. The second epitaxial layer is disposed on the first epitaxial layer and collectively defines the stepped air voids with the first epitaxial layer.


Patent
Lextar Electronics Corporation | Date: 2016-11-06

A light emitting diode (LED) package includes a light element, a light transferring layer disposed on the light element, a packaging layer enclosing the light transferring layer, a white wall surrounding the packaging layer and a diffusion film disposed on the packaging layer. The light transferring layer has a light outlet face, a light inlet face opposite to the light outlet face and a peripheral side. The light inlet face faces the light element. The white wall surrounds the peripheral side that is enclosed by the packaging layer.


An epitaxial structure includes a substrate, a first epitaxial layer and a second epitaxial layer. The substrate has a surface, and the first epitaxial layer is disposed over the substrate and defines a plurality of slanting air voids tapering away from the substrate and an opening over each of the slanting air voids. The second epitaxial layer is disposed on the first epitaxial layer and collectively defines the slanting air voids in a shape of trapezoid with the first epitaxial layer.

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