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Patent
Lextar Electronics Corporation and Lextar Electronics Suzhou Corporation | Date: 2013-03-14

A light emitting diode component, a light emitting diode package and the manufacturing method thereof are provided. The LED component includes a semiconductor epitaxial stack structure, a first electrode and a second electrode. The semiconductor epitaxial stack structure has a bottom surface, a top surface, a first lateral surface, and a second lateral surface. The first electrode is disposed on the first lateral surface. The second electrode is disposed on the bottom surface.


Patent
Lextar Electronics Corporation and Lextar Electronics SuZhou Corporation | Date: 2013-07-31

A light-emitting diode tube, comprising a base, a fixing cover, an LED, a lampshade, a driver and a sliding cover is provided. The base has a first carrying surface and a second carrying surface, and a pair of first guiding rail and second guiding rail parallel to each other. The second carrying surface comprises a first area and a second area. The fixing cover is fixedly disposed on the guiding rail located in the first area of the second carrying surface, and covers the first area of the second carrying surface. The LED is disposed on the first carrying surface. The lampshade is located over the first carrying surface and fixed to the base and covers the LED. The driver is disposed in the second area of the second carrying surface. The sliding cover movably covers the second area of the second carrying surface or the fixing cover.


Patent
LEXTAR ELECTRONICS Corporation and Lextar Electronics Suzhou Corporation | Date: 2013-01-04

An exemplary embodiment of the present disclosure provides a solid-state light emitting device. The solid-state light emitting device includes a stair-type bowl, a plurality of light emitting chips, and an encapsulation glue. The stair-type bowl includes a base and a ring stair structure. The ring stair structure includes a plurality of ring tread surfaces and a plurality of ring riser surfaces connected to the ring tread surfaces. The ring stair structure is connected to the base. The base has a bottom surface. The ring stair structure surrounds the bottom surface and protrudes from the bottom surface. The light emitting chips are respectively disposed above the ring tread surfaces and the bottom surfaces. The stair-type bowl is filled with the encapsulation glue. The encapsulation glue covers the light-emitting chips.

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