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Patent
Lextar Electronics Corporation | Date: 2016-01-28

A light-emitting diode (LED) device including an LED module and a driver is provided. The LED module includes a voltage sensing module and an LED. The voltage sensing module generates a reference voltage. The driver includes a power converting module, a current processing module, a feedback module and a controller module. The power converting module converts an alternating current (AC) into a driving current for driving the LED to emit a light. The current processing module converts the driving current into a sensing voltage. The feedback module compares the sensing voltage with a reference voltage and outputs a level signal according to a magnitude relationship of the sensing voltage and the reference voltage. The controller module outputs a pulse width modulation (PWM) signal to the power converting module according to the level signal. The power converting module controls the magnitude of the driving current according to the PWM signal.


Patent
Lextar Electronics Corporation | Date: 2016-05-23

An LED chip package includes a substrate having a metal terminal (gold finger structure). A LED chip set is composed of a plurality of LED chips formed in one piece, and has a plurality of light-emitting areas which are separated from each other. The LED chip set is disposed on the substrate and electrically connected to the metal terminal.


Patent
Lextar Electronics Corporation | Date: 2016-05-31

A semiconductor light emitting structure includes a first type semiconductor layer, an active layer, a second type semiconductor layer, an electrode, a transparent conductive layer, a Bragg reflective layer and a metal layer. The first type semiconductor layer, the active layer and the second type semiconductor layer are stacked sequentially to form an epitaxy layer. The electrode is formed on the first type semiconductor layer. The transparent conductive layer is formed on the second type semiconductor layer. The Bragg reflective layer is formed on the transparent conductive layer. The Bragg reflective layer and electrode are disposed on opposite sides of the epitaxy layer. The metal layer is formed on the Bragg reflective layer. The Bragg reflective layer has a concave portion into which the metal layer is put. The metal layer has a current conducting portion embedded into the concave portion and electrically connected to the transparent conductive layer.


Patent
Lextar Electronics Corporation | Date: 2016-08-03

A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a silver-free material. The reflective cup has the cavity. The die is disposed on the lead-frame in a face-down orientation, and is further electrically connected to the lead-frame and located within the cavity.


Patent
Lextar Electronics Corporation | Date: 2017-03-15

A lamp tube (100) and an end cap structure (101) thereof are provided. The end cap structure (101) includes a first cover (110), a rotatable body (120), at least one electrode pin (130) and a circuit board (150). The rotatable body (120) is disposed on the first cover (110). The at least one electrode pin (130) is disposed on the first cover (110) for receiving an external power (200). The circuit board (150) is disposed within the first cover (110). The circuit board (150) has at least one contact point (151). The at least one contact point (151) and the at least one electrode pin (130) are electrically connected or insulated via the rotation of the rotatable body (120).


Patent
Lextar Electronics Corporation | Date: 2017-03-22

An LED chip package includes a substrate having a metal terminal (gold finger structure). A LED chip set is composed of a plurality of LED chips formed in one piece, and has a plurality of light-emitting areas which are separated from each other. The LED chip set is disposed on the substrate and electrically connected to the metal terminal.


Patent
Lextar Electronics Corporation | Date: 2017-04-05

A connecting rod is provided. The connecting rod includes an elongate body and an electric connecting element. The elongate body has a first end portion, a second end portion, a hiding surface and at least one supporting surface. The hiding surface and the at least one supporting surface surround an extending axis of the elongate body and are disposed between the first end portion and the second end portion. An area of the hiding surface is smaller than or equal to an area of any of the at least one supporting surface. The electric connecting element is disposed at the hiding surface and extends from the first end portion to the second end portion.


Patent
Lextar Electronics Corporation | Date: 2017-01-11

A light-guiding pillar used in a vehicle lamp includes a major structure and a light-guiding structure. The major structure has a light incident surface, a light outgoing surface, an upper surface, and a bottom surface. The upper surface and the bottom surface are disposed between the light incident surface and the light outgoing surface, in which the upper surface and the bottom surface are opposite to each other. The major structure is configured to guide a portion of a light beam entering the major structure through the light incident surface to the light outgoing surface. The light-guiding structure is disposed on the upper surface and configured to guide another portion of the light beam entering the major structure through the light incident surface from the upper surface to the bottom surface with passing through the bottom surface.


Patent
Lextar Electronics Corporation | Date: 2017-02-15

A semiconductor light emitting structure (100A;100B;100C;100D) includes a first type semiconductor layer (104), an active layer (105), a second type semiconductor layer (106), an electrode, a transparent conductive layer (107), a Bragg reflective layer (108) and a metal layer (109). The second type semiconductor layer (106), the active layer (105) and the first type semiconductor layer (104) are stacked sequentially to form an epitaxial layer (103). The electrode is formed on the first type semiconductor layer (104). The transparent conductive layer (107) is formed on the second type semiconductor layer (106). The Bragg reflective layer (108) is formed on the transparent conductive layer (107). The Bragg reflective layer (108) and electrode are disposed on opposite sides of the epitaxial layer (103). The metal layer (109) is formed on the Bragg reflective layer (108). The Bragg reflective layer (108) has a concave portion into which the metal layer (109) is put. The metal layer (109) has a current conducting portion embedded into the concave portion and electrically connected to the transparent conductive layer (107).


The present invention provides a phosphor with a preferred orientation represented by the following formula: A_(2)[MF_(6)]:Mn^(4+), wherein A is selected from a group consisting of Li, Na, K, Rb, Cs, and NH_(4), M is selected from a group consisting of Ge, Si, Sn, Ti, and Zr. The preferred orientation is a (001)/(011) preferred orientation. The present invention also provides a method for fabricating the above phosphor. The present invention further provides a light-emitting element package structure employing the same.

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