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Morrisville, NC, United States

Lenovo Group Ltd. /lɛnˈoʊvoʊ/ is a Chinese multinational computer technology company with headquarters in Beijing, China, and Morrisville, North Carolina, United States. It designs, develops, manufactures and sells personal computers, tablet computers, smartphones, workstations, servers, electronic storage devices, IT management software and smart televisions. In 2013, Lenovo was the world's largest personal computer vendor by unit sales. It markets the ThinkPad line of notebook computers and the ThinkCentre line of desktops.Lenovo has operations in more than 60 countries and sells its products in around 160 countries. Lenovo's principal facilities are in Beijing, Morrisville and Singapore, with research centers in those locations, as well as Shanghai, Shenzhen, Xiamen, and Chengdu in China, and Yamato in Kanagawa Prefecture, Japan. It operates a joint venture with EMC, LenovoEMC, which sells network-attached storage solutions. It also has a joint venture with NEC, Lenovo NEC Holdings, which produces personal computers for the Japanese market.Lenovo was founded in Beijing in 1984 as Legend and was incorporated in Hong Kong in 1988. Lenovo acquired IBM's personal computer business in 2005 and agreed to acquire its Intel-based server business in 2014. Lenovo entered the smartphone market in 2012 and as of 2014 is the largest vendor of smartphones in Mainland China. In January 2014, Lenovo agreed to acquire the mobile phone handset maker Motorola Mobility from Google, and in October 2014 the deal was finalized.Lenovo is listed on the Hong Kong Stock Exchange and is a constituent of the Hang Seng China-Affiliated Corporations Index, often referred to as "Red Chips." Wikipedia.


Patent
Lenovo | Date: 2016-01-07

An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.


In one aspect, an apparatus includes a housing, a touch-enabled pad coupled to the housing, a processor, and a memory accessible to the processor. The memory bears instructions executable by the processor to receive input to the touch-enabled pad and to present an indication of the input on the touch-enabled pad.


Patent
Lenovo | Date: 2015-03-06

Disclosed are an electronic apparatus and a connecting device. The electronic apparatus includes a body; a supporting frame located at a back face of the body; a connecting device through which the supporting frame is rotatably connected with the body so that the supporting frame is unfolded by a predefined angle relative to the back face of the body and that the body is supported on the support surface through the supporting frame; the connecting device including: a first connecting part connected with the supporting frame; a second connecting part connected with the body; a rotary shaft; a first damping element; a second damping element; wherein in the case that the supporting frame is rotated, relative to the back face of the body, by the predefined angle around the rotary shaft in a first direction through the connecting device, the first damping element of the connecting device provides a first damping force against rotation in the first direction; in the case that the supporting frame is rotated, relative to the back face of the body, by the predefined angle around the rotary shaft in a second direction through the connecting device, the second damping element of the connecting device provides a second damping force against rotation in the second direction, the first direction is opposite to the second direction, and the first damping force is different from the second damping force.


The present disclosure provides an electronic apparatus and a method for producing a housing, which relate to a technical field of electronics. The electronic apparatus comprises: a housing comprising a side wall forming an accommodating space and having an outer surface which is divided into K appearance layers, where K is a positive integer greater than or equal to 3, and wherein borderlines between adjacent layers in the K appearance layers are parallel to each other.

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