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Binh D.V.,Military Information Technology Institute | Minh N.H.,Le Qui Don Technical University | Moldovyan N.A.,Russian Academy of Sciences
International Conference on Advanced Technologies for Communications | Year: 2015

The article describes a collective digital signature protocol based on the difficulty of the discrete logarithm problem modulo a composite number that is a product of two strong primes having the 2 1 size ratio. The usage of difficult problems provide signature protocol with security improvement, because the probability to break the protocol has been reduced significant. This can be achieved due to the appearance of breakthrough solutions in the area of the factoring problem and the discrete logarithm modulo a prime problem. One of the features of the protocol is using the non-cyclic finite group. After selecting appropriate parameters which provide 80-bit security, the size of the proposed collectively signature is 240 bits and is not dependent on the number of signers. © 2014 IEEE. Source


Park D.E.,Inha University | Choi H.J.,Inha University | Manh Vu C.,Le Qui Don Technical University
Smart Materials and Structures | Year: 2016

Silica/polyaniline (PANI) core-shell structured microspheres were synthesized by coating the surface of silica micro-beads with PANI and applied as a candidate inorganic/polymer composite electrorheological (ER) material. The silica micro-beads were initially modified using N-[(3-trimethoxysilyl)-propyl] aniline to activate an aniline functional group on the silica surface for a better PANI coating. The morphology of the PANI coating on the silica surface was examined by scanning electron microscopy and the silica/PANI core-shell structure was confirmed by transmission electron microscopy. The chemical structure of the particles was confirmed by Fourier transform infrared spectroscopy. Rotational rheometry was performed to confirm the difference in the ER properties between pure silica and silica/PANI microsphere-based ER fluids when dispersed in silicone oil. © 2016 IOP Publishing Ltd. Source


Tan T.D.,University of Engineering and Technology | Anh N.T.,Le Qui Don Technical University
Proceedings - 2011 2nd International Conference on Intelligent Systems, Modelling and Simulation, ISMS 2011 | Year: 2011

A three-axis piezoresistive accelerometer which has uniform sensitivities to three axes was developed using MicroElectroMechanical Systems (MEMS) technology. This sensor which is made of a heavy proof mass and four long beams allow us to obtain high sensitivities by reducing the resonant frequencies. Uniform axial sensitivities with small cross axis sensitivity could be obtained by a three-dimensional sensor structure. © 2011 IEEE. Source


Vu C.M.,Le Qui Don Technical University | Choi H.J.,Inha University
Polymer Science - Series A | Year: 2016

Two kinds of micro/nano sized fibrils based on cellulose (MFC) and polyvinyl alcohol (PVA) were used as reinforcer for epoxy resin (EP) with different contents in the range from 0 to 0.3 wt %. PVA nanofibers with diameter about 40–80 nm were fabricated by electrospinning technique. The analysis of mechanical properties showed that by both adding MFC and PVA to EP the fracture toughness was increased. The SEM results showed that micro/nano sized fibers dispersed throughout epoxy resin, prevented and changed the path of crack growth. © 2016 Pleiades Publishing, Ltd. Source


Thi B.D.,Thai Nguyen University | Hieu M.N.,Le Qui Don Technical University
International Journal of Security and its Applications | Year: 2013

The Block cipher BM-128 which is proved to be suitable to the applications in the wireless communication systems are proposed in this paper. It is developed based on SDDO which is constructed from CSPN. BM-128 also eliminates the weak keys without the complex round key proceduce and meet the requirements of NESSIE. Design shall meet all the security requirements to protect applications against the well-known threats. In addition, BM-128 evaluated to have higher performance than the other algorithms when they are used in cheap hardware. © 2013 SERSC. Source

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