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Luo L.-M.,Hefei University of Technology | Luo L.-M.,Laboratories of Nonferrous Metal Material and Processing Engineering of Anhui Province | Lu Z.-L.,Hefei University of Technology | Huang X.-M.,Hefei University of Technology | And 8 more authors.
Surface and Coatings Technology | Year: 2014

This paper proposes a new available palladium-free surface activation process on polycarbonate (PC) engineering plastic before electroless plating. Surface morphologies of the original plastic, activated plastic, surface and cross-sections after electroless plating were analyzed by field emission scanning electron microscopy (FE-SEM), energy dispersion spectrometry (EDS) and X-ray diffraction (XRD). The growth mechanism of copper layers was discussed. Results show that numerous folds, uneven steps, and other defects appear on the microscopic surface of activated plastic. After direct electroless plating, the plating layer on the plastic surface exhibits a closely bound granular distribution. Compared with the conventional pretreatment process, the plating layer possesses a similar morphology. The growth mechanisms are analyzed as follows: the reactant (Cu2+) in the electroless plating solution disperses and is adsorbed by the plastic surface in the process of Cu plating. The Cu particles that settled form the nucleus and grow. The growth process involves repeated gathering of nano-level Cu grains to form physically agglomerated Cu granules. The Cu grains finally merge to allow closely bound and evenly distributed copper plating. © 2014 Elsevier B.V. Source


Lu Z.-L.,Hefei University of Technology | Luo L.-M.,Hefei University of Technology | Luo L.-M.,Laboratories of Nonferrous Metal Material and Processing Engineering of Anhui Province | Huang X.-M.,Hefei University of Technology | And 7 more authors.
Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment | Year: 2014

After the laser irradiation pretreatment and the ultrasonic assisted chemical plating, copper electroless plating was successfully prepared on Al2O3 ceramic substrate. The surfaces of the Al2O3 ceramic substrate before and after laser irradiation pretreatment and the electroless plating with the cross and scratches were analyzed by field emission scanning electron microscope (FESEM) and energy dispersive spectrometer (EDS). The comparison experiments with traditional pretreatment process were also discussed. Result shows: combinations of a large number of microvoid and nano granular heaves appear on the surfaces of the Al2O3 ceramic substrate. Foreign particles are easily absorbed on this morphology of surface defects to complete the electroless plating. The plating and the substrate are combined well. Compared with the traditional process, the proposed one can avoid complicated procedures and the pollution from the noble metal 'Pd'. Moreover, the combination of the copper grains in the layer formed by the proposed process is considered to be better. Source


Luo L.-M.,Hefei University of Technology | Luo L.-M.,Laboratories of Nonferrous Metal Material and Processing Engineering of Anhui Province | Tan X.-Y.,Hefei University of Technology | Luo G.-N.,CAS Hefei Institutes of Physical Science | And 5 more authors.
Hejubian Yu Dengliziti Wuli/Nuclear Fusion and Plasma Physics | Year: 2014

This paper reviews the current method of solving the W/Cu interface connection and relieving the thermal stress by added adaptation layer. After analyzing the different adaptation layer, the best W/Cu adaptation layer is selected, and then the W/Cu layer structure optimization analysis is conducted. The results show that using W/Cu functionally graded materials as the combination of the adaptation layer has enough strength, and good thermal conductivity are more effective to alleviate thermal stress. In addition, this paper expounds the current method which utilizes the successfully prepared W/Cu functionally gradient materials as W/Cu adaptation layer used in the first wall materials. Finally, this paper has made the summary and prospect about that the functionally gradient materials of W/Cu used as the adaptation layer to solve the first wall material W/Cu interface connection. ©, 2014, Yuan Zi Neng Chuban She. All right reserved. Source


Ding X.-Y.,Hefei University of Technology | Luo L.-M.,Hefei University of Technology | Luo L.-M.,Laboratories of Nonferrous Metal Material and Processing Engineering of Anhui Province | Tan X.-Y.,Hefei University of Technology | And 9 more authors.
Fusion Engineering and Design | Year: 2014

W-1 wt% Sm2O3 powders doped with highly uniform Sm2O3 were successfully synthesized by a novel wet chemical method followed by hydrogen reduction. The powders were consolidated by spark plasma sintering (SPS) at 1800 °C to suppress grain growth during sintering. The FE-SEM and HRTEM analysis, tensile test and thermal conductivity measurements were used to characterize these samples. The grain size, relative density of the bulk samples fabricated by SPS sintering were 4 μm and 97.8%, respectively. The tensile strength values of Sm2O3/W samples were higher than those of pure W samples. As the temperature rises from 25 to 800 °C, the thermal conductivity of pure W and W-1 wt% Sm 2O3 composites decreased with the same trend and the thermal conductivity of both samples was above 160 W/m K at room temperature. © 2014 Elsevier B.V. Source


Zhang J.,Hefei University of Technology | Zhu X.-Y.,Hefei University of Technology | Luo L.-M.,Hefei University of Technology | Luo L.-M.,Laboratories of Nonferrous Metal Material and Processing Engineering of Anhui Province | And 5 more authors.
Hejubian Yu Dengliziti Wuli/Nuclear Fusion and Plasma Physics | Year: 2014

Addition of rare earth oxide to the tungsten can significantly refine the grain and improve high temperature stability of the tungsten alloys, which also have the dispersion strengthening effect and significant effect in the suppression of grain growth, controlling the re-crystallization grain shape and improving the mechanical properties of the materials. This paper expounds current situation of several techniques of preparing ODS-W from the perspective of preparation method of ODS-W particles and forecasts its development trend. ©, 2014, Yuan Zi Neng Chuban She. All right reserved. Source

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