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Kulicke and Soffa

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SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment, today announced a conference call is scheduled to discuss the Company's third quarter 2017 financial results, and its business outlook on Wednesday, August 2, 2017 at 8:00am EDT. The Company will issue its third quarter 2017 results prior to the conference call. To access the conference call, interested parties may call +1-877-407-8037 or internationally +1-201-689-8037. A live webcast will also be available at investor.kns.com. A replay will be available from approximately one hour after the completion of the call through August 9, 2017 by calling toll-free +1-877-660-6853 or internationally +1-201-612-7415 and using the replay ID number of 13666382. A webcast replay will also be available at investor.kns.com. Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing, and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.


News Article | July 10, 2017
Site: www.businesswire.com

SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today that it will be exhibiting at the SEMICON West trade show in San Francisco, California, from July 11 through July 13, 2017. Kulicke & Soffa will be introducing, a video illustration of its first lithography solution developed specifically for Advanced Packaging. Additionally, K&S will be featuring several of its leading packaging solutions at booth number 5862 of the SEMICON West trade show. “We are excited to share with customers our first step-and-repeat lithography solution serving the broad-ranging requirements of the Advanced Packaging market. The high-throughput, modular i-line steppers uniquely utilize a laser-light source, driving best-in-class cost-of-ownership,” said Gerrit van der Beek, Kulicke & Soffa’s Vice President of Lithography Business Lines. Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)


News Article | August 2, 2017
Site: www.businesswire.com

SINGAPORE--(BUSINESS WIRE)--Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”) today announced results for its third fiscal quarter ended July 1, 2017. The Company reported third quarter net revenue of $243.9 million and a diluted EPS of $0.43. The adjusted non-GAAP diluted EPS was $0.62 after exclusion of a unique charge and favorable tax credit as detailed below. Dr. Fusen Chen, Kulicke & Soffa's President and Chief Executive Officer, stated, “We continue to benefit from the strong industry environment, improved market dynamics and new opportunities in our core business and expanding portfolio. In parallel, we remain focused on further enhancing exposure and alignment to several other meaningful near and long-term opportunities." During the June quarter the Company incurred a one-time, non-cash impairment charge of $35.2 million as well as a favorable foreign tax credit of $20.9 million. Excluding this unique charge and credit resulted in an adjusted non-GAAP net income of $45.1 million and diluted EPS of $0.62. The Company currently expects net revenue in the fourth fiscal quarter of 2017 ending September 30, 2017 to be approximately $200 million to $215 million, a 42% improvement over the same period in the prior year. Looking forward, Dr. Fusen Chen commented, "As we aggressively work toward optimizing our existing businesses, accomplishing our development goals and executing on existing and new growth initiatives, such as the recent Liteq acquisition, we anticipate fundamental enhancements to our value proposition." K&S anticipates revenue for its full fiscal year 2017 to fall between $793 million and $808 million, an approximately 28% improvement over the prior fiscal year. A conference call to discuss these results will be held today, August 2, 2017, beginning at 8:00 am (EDT). To access the conference call, interested parties may call +1-877-407-8037 or internationally +1-201-689-8037. The call will also be available by live webcast at investor.kns.com. A replay will be available from approximately one hour after the completion of the call through August 9, 2017 by calling toll-free +1-877-660-6853 or internationally +1-201-612-7415 and using the replay ID number of 13666382. A webcast replay will also be available at investor.kns.com. Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices (www.kns.com). Caution Concerning Results and Forward Looking Statements In addition to historical statements, this press release contains statements relating to future events and our future results. These statements are “forward-looking” statements within the meaning of the Private Securities Litigation Reform Act of 1995, and include, but are not limited to, statements that relate to our future revenue, sustained, increasing, continuing or strengthening demand for our products, replacement demand, our research and development efforts, our ability to control costs, and our ability to identify and realize new growth opportunities within segments, such as automotive and industrial as well as surrounding technology adoption such as system in package and advanced packaging techniques. While these forward-looking statements represent our judgments and future expectations concerning our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to: the risk that customer orders already received may be postponed or canceled, generally without charges; the risk that anticipated customer orders may not materialize; the risk that our suppliers may not be able to meet our demands on a timely basis; the volatility in the demand for semiconductors and our products and services; the risk that identified market opportunities may not grow or developed as we anticipated; volatile global economic conditions, which could result in, among other things, sharply lower demand for products containing semiconductors and for the Company’s products, and disruption of capital and credit markets; the risk of failure to successfully manage our operations; the possibility that we may need to impair the carrying value of goodwill and/or intangibles established in connection with one or more of our prior acquisitions; acts of terrorism and violence; risks, such as changes in trade regulations, currency fluctuations, political instability and war, which may be associated with a substantial non-U.S. customer and supplier base and substantial non-U.S. manufacturing operations; and the factors listed or discussed in Kulicke and Soffa Industries, Inc. 2016 Annual Report on Form 10-K and our other filings with the Securities and Exchange Commission. Kulicke and Soffa Industries, Inc. is under no obligation to (and expressly disclaims any obligation to) update or alter its forward-looking statements whether as a result of new information, future events or otherwise.


SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), today announced it has acquired a 100% equity stake of privately held Liteq BV. Liteq, founded in 2014, has developed the first dedicated step-and-repeat tool serving the unique and broad-ranging requirements of Advanced Packaging lithography. Liteq’s modular offerings of high-throughput, modular i-line steppers uniquely utilize a laser-light source, as opposed to more commonly used mercury-vapor-lamp sources. This forward-looking approach drives best-in-class cost-of-ownership to competitively serve existing and next-generation production requirements for fast-growing advanced packaging processes such as System-in-Package, Fan-Out Wafer Level Packaging, Through-Silicon-Via in addition to traditional Flip-Chip. VLSI research, a leading technology research and advisory company, anticipates the advanced packaging lithography market to grow to $296 million in 2021, from $186 million in 2016, providing K&S an additional long-term growth opportunity and expanding its offerings within the advanced packaging market. Over the past several years, K&S has continued to aggressively develop several other advanced packaging related tools. “We are very pleased to welcome Liteq’s employees, customers and supply chain partners into the K&S family," remarked Fusen Chen, Kulicke & Soffa's President and Chief Executive Officer. “This highly complementary investment emphasizes our strategic and opportunistic capital deployment approach by further extending the Company’s presence, strength, and value proposition within advanced packaging." Gerrit van der Beek, Liteq’s Chief Executive Officer stated, "Liteq has tremendous growth potential and collectively we are much better positioned to provide innovative solutions and services addressing the advanced packaging market. Leveraging on the extensive sales and distribution network; strong customer base and proven interconnect expertise of K&S, in addition to the committed support from our business partners, we are well positioned to address the industry’s next set of challenges." Liteq is located in Eindhoven, the Netherlands, the heart of Europe’s Brainport Eindhoven. This innovative area offers a dense concentration of technology-centric customers, strategic suppliers and highly-skilled employees. Kulicke & Soffa’s existing Netherlands facility, housing a workforce of over 200 employees is also based in Eindhoven. Liteq’s technologies were developed through close cooperation of several technology, financial and developmental organizations within the region including ASML Netherlands BV, Beltec Holding BV, the Brabant Development Agency (BOM), Sioux, Random Capital BV and Torrente BV. Paul van Attekum, ASML CSVP of Corporate Strategy & Marketing said: “ASML was an early investor in Liteq and has supported the company in the development of the advanced packaging lithography tool. We believe the tool is ready for evaluation by customers. While ASML is selling its stake as part of this transaction, we will continue to provide specific development support to Liteq over the next few years within the framework of a support agreement.” Arnoud de Geus, Sioux’s Director of New Business Development said, “Sioux is a long-term strategic supplier of K&S and has supported Liteq from inception. K&S will strengthen Liteq’s market channels and global commercial reach tremendously. Sioux remains fully committed to support Liteq during and after this transition.” Miriam Dragstra, Capital Director of Brabant Development Agency (BOM) said, “Recognizing the strong Noord Brabant supply base and local presence of K&S, BOM is convinced that another innovative company will continue to flourish, adding to the growing eco-system of high-precision equipment companies. We are proud to have contributed to this successful venture, which highlights the incubation power of the Noord Brabant Province." As traditional front-end production improvements fail to deliver the same historic cost and performance benefits, the semiconductor industry is evolving by seeking out new packaging techniques to deliver form factor, power efficiency and performance to mobile, cloud and internet-of-things driven applications. This changing landscape has provided a new set of industry challenges and opportunities. K&S is increasingly well positioned and continues to respond to these new challenges by delivering innovative equipment solutions through close customer engagement, operational excellence, acquisitions, and a long-term commitment to research and development. Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com) Liteq BV is an innovative company based in the Brainport Eindhoven region, the Netherlands. It is the first company to develop a dedicated lithography solution for the advanced packaging of microchips. Liteq’s solution is based on a high productivity stepper which supports multiple packaging platforms and achieves optimal cost of ownership. Liteq originates from 2014. ASML Netherlands BV, Beltec Holding BV, the Brabant Development Agency (BOM), Sioux, Random Capital BV and Torrente BV were shareholders of Liteq. A unique feature of the Liteq stepper is the use of a laser light source instead of a mercury-vapor lamp. This enables Liteq to deliver excellent throughput and imaging performance.


News Article | August 15, 2017
Site: www.businesswire.com

SINGAPORE--(BUSINESS WIRE)--Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") today announced it has fully executed its entire $100 million repurchase program, originally announced on August 27, 2014. Kulicke & Soffa has also announced its Board of Directors has authorized an additional $100 million repurchase program. The new authorization is effective immediately, may be suspended or discontinued at any time and is expected to be funded using the Company’s available cash, cash equivalents and short-term investments. Under the program, Kulicke & Soffa may purchase shares of its common stock through open market and privately negotiated transactions at prices deemed appropriate by management. The timing and amount of repurchase transactions under this program will depend on market conditions, availability of US cash as well as other corporate and regulatory considerations. As of July 1, 2017, K&S had $565.4 million in cash, cash equivalents and short term investments and 71.1 million shares outstanding. “Over the prior 3 years the repurchase program has provided the opportunity to take advantage of market discrepancies and opportunistically reduce our outstanding share count,” stated Fusen Chen, Kulicke & Soffa’s President and CEO. “As we look ahead, we will continue to take a long-term approach and execute this program with available resources when appropriate.” Since, August 27, 2014, the initial announcement of the Company’s repurchase program, K&S has deployed $100 million and had repurchased 8.2 million shares in open market transactions. Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices (www.kns.com). In addition to historical statements, this press release contains statements relating to future events. These forward-looking statements include, but are not limited to, statements concerning the amount, timing, availability, and strategy with respect to any future stock repurchases; the ability to deliver increased value and return capital to shareholders; and the strategic use of the Company’s available cash; expectations regarding the Company’s business, financial outlook, plans or long-term strategy and growth prospects; as well as statements reflecting expectations, intentions, assumptions or beliefs about future events, and other statements that do not relate strictly to historical or current facts. These statements can be affected by inaccurate assumptions and by known and unknown risks and uncertainties that are difficult to predict or beyond the Company's control, including, among others, market conditions; fluctuations in the price and volume of the Company's common stock; the effects of industry, economic or political conditions outside of the control of the Company; quarterly variations in operating results; adverse economic and financial conditions, including weakness in the capital markets; trends and growth opportunities in relevant markets; our ability to successfully identify and complete acquisitions; the cost of borrowing, availability of credit and cash, debt covenant compliance, interest rate fluctuations and other factors affecting financing and investing activities; and the ability to access sufficient funding to finance desired strategies, growth and operations. For more information regarding these risks and uncertainties as well as certain additional risks that we face, you should refer to the Risk Factors detailed in Item 1A of Part I of the Company’s 2016 Annual Report on Form 10-K, and subsequent reports filed from time to time with the Securities and Exchange Commission.


News Article | September 11, 2017
Site: www.businesswire.com

SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today that it will be exhibiting at the SEMICON Taiwan trade show in Taipei, September 13 through September 15, 2017. Kulicke & Soffa will introduce its upcoming GEN-S Series of ball bonding solutions and will also showcase several other leading solutions serving the growing Automotive, Industrial and Advanced Packaging markets. The Company will be demonstrating these products at booth number 540 on level 4 of the Taipei Nangang Exhibition Center. Kulicke & Soffa (NASDAQ:KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)


Patent
Kulicke and Soffa | Date: 2011-02-16

The invention pertains to the field of automation technology and relates to an apparatus and a method for handling chips, in particular semiconductor dies. A chip handling tool is configured to receive a chip, in particular a semiconductor die, at a takeover location and to hand over said chip to a delivery location, and comprises a work surface configured to be brought into connection with a first surface on a first side of the chip. The chip handling tool further comprises illumination means for illuminating the chip from its first side while said first side of the chip is in connection with the work surface. A chip handling process is also presented.


A chip handling apparatus, unit and method is presented. The chip handling apparatus comprises a chip supply station; a chip mounting station; and one or more chip handling units configured to pick a chip from the supply station, transport the chip to the mounting station, and place the chip at a mounting location; wherein each chip handling unit is configured to temporarily retain the chip in a defined position relative to the chip handling unit. The chip handling apparatus further comprises means for inducing sonic vibrations in the chip when retained by one of the chip handling units; and means for measuring the vibrations induced in the chip.


Patent
Kulicke and Soffa | Date: 2011-03-16

A pick tool for picking a planar object from a supply station is presented, in particular to be used for picking a semiconductor die from a carrier tape, said pick tool comprising: a work surface, said work surface comprising at least one contact region that may be brought into contact with a first surface on a first side of the planar object; one or more vacuum outlets in the work surface that may be connected to a vacuum source to allow for temporarily fixing the planar object to the work surface; and wherein a flexible seal is provided to maintain vacuum if the planar object becomes deformed.


Patent
Kulicke and Soffa | Date: 2011-10-26

A tool tip interface, in particular a shank, for use with a handling tool configured to handle a planar object, in particular a semiconductor die, is presented which comprises: a machine side interface which comprises a vacuum supply connection; a tip side interface having a bottom side on which a support surface for a tool tip is formed and on which one or more depressions are formed so that the one or more depressions define support surface portions which are at least partially surrounded by depressed regions, wherein support surface portions and depressed regions are uniformly distributed over at least a central region of the bottom side of the tip side interface.

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