Kobelco Research Institute

Kobe, Japan

Kobelco Research Institute

Kobe, Japan
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Patent
Kabushiki Kaisha Kobe Seiko Sho and Kobelco Research Institute | Date: 2013-08-14

There is provided an Al-based alloy sputtering target, which can provide an enhanced deposition rate (or sputtering rate) when the sputtering target is used, and which can preferably prevent the occurrence of splashes. The Al-based alloy sputtering target of the present invention includes Ta and may preferably include an Al-Ta-based intermetallic compound containing Al and Ta, which compound has a mean particle diameter of from 0.005 m to 1.0 m and a mean interparticle distance of from 0.01 m to 10.0 m.


Patent
Kobelco Research Institute and Kobe Steel | Date: 2014-11-28

An oxide sintered body is obtained by sintering indium oxide, gallium oxide and tin oxide. The oxide sintered body has a relative density of 90% or more and an average grain size of 10 m or less. In the oxide sintered body, the relations 30 atomic %[In]50 atomic %, 20 atomic %[Ga]30 atomic % and 25 atomic %[Sn]45 atomic % are satisfied. [In], [Ga] and [Sn] are ratios of contents (atomic %) of indium gallium and tin, respectively, to all metal elements contained in the oxide sintered body. The oxide sintered body has an InGaO_(3 )phase which satisfies the relation [InGaO_(3)]0.05.


Patent
Kobe Steel and Kobelco Research Institute | Date: 2014-09-22

An electrode for use in an input device is formed on a transparent substrate. The electrode has a laminated structure including a first layer, a second layer and a third layer on one surface of the transparent substrate, in this order from the farthest side from the surface. The first layer includes a transparent conductive film. The second layer includes one or more members of a nitride of Mo and a nitride of an Mo alloy. The third layer includes a metal film having a reflectance of 40% or higher and a transmittance of 10% or less.


Patent
Kobelco Research Institute and Toshima Manufacturing Co. | Date: 2015-01-28

The Li-containing transition metal oxide sintered compact of the present invention includes Li and a transition metal, and further includes Al, Si, Zr, Ca, and Y as impurity elements, of which contents are controlled to the following ranges: Al 90 ppm; Si 100 ppm; Zr 100 ppm; Ca 80 ppm; and Y 20 ppm, wherein the sintered compact has a relative density of 95% or higher and a specific resistance of lower than 2 x 10^(7) cm. The present invention makes it possible to stably form Li-containing transition metal oxide thin films useful as the positive electrode thin films of secondary batteries or the like at a high deposition rate without causing abnormal discharge.


Provided is a sintered body comprising LiCoO_(2 )used for a sputtering target. The area A of a surface of the sintered body that corresponds to a sputtering surface is 200-1500 cm^(2 )and the relative density of the entire sintered body is 75% or higher. When B1 represents the area of a region in which the area ratio that is occupied by pores is 10% or higher in the surface that corresponds to a sputtering surface, the ratio of B1 to the area A is 50% or higher, and the area B2 of a region having a specific resistance of 1.010^(2 )-cm or smaller in the surface that corresponds to a sputtering surface occupies 25% or more of the area A.


Provided is a Li-containing phosphoric-acid compound sintered body of both high relative density and very small crystal grain diameter with reduced incidence of defects (voids) such as air holes, the Li-containing phosphoric-acid compound sintered body causing a Li-containing phosphoric-acid compound thin film useful as a solid electrolyte for a secondary cell or the like to be stabilized without any incidence of target cracking or irregular electrical discharge, and offering high-speed film-forming capability. This Li-containing phosphoric-acid compound sintered body contains no defects measuring 50 m or larger within a 1 mm^(2) cross-sectional region in the interior thereof, while having an average crystal grain diameter of no more than 15 m and a relative density of at least 85%.


Patent
Kobelco Research Institute | Date: 2014-04-28

Provided is a target assembly which is manufactured by bonding a Li-containing oxide sputtering target and an Al-based or Cu-based backing plate through a bonding material. The Li-containing oxide target assembly does not undergo warping or cracking during the bonding. The Li-containing oxide target assembly according to the present invention is manufactured by bonding a Li-containing oxide sputtering target to a backing plate via a bonding material, and has bending strength of 20 MPa or larger.


Patent
Kobelco Research Institute | Date: 2015-01-09

A method for cutting a workpiece except silicon includes moving a resin-coated saw wire having a resin coating that covers the surface of a steel wire. In the method, at least one of the resin-coated saw wire or the workpiece is swung, a diamond abrasive grain having an average grain size of more than 0 m and 8 m or less is sprayed onto the resin-coated saw wire, and a wire running speed of the resin-coated saw wire is 800 m/min or higher.


Provided is a sintered body comprising LiCoO_(2) used for a sputtering target. The area A of a surface of the sintered body that corresponds to a sputtering surface is 200 - 1500 cm^(2) and the relative density of the entire sintered body is 75% or higher. When B1 represents the area of a region in which the area ratio that is occupied by pores is 10% or higher in the surface that corresponds to a sputtering surface, the ratio of B1 to the area A is 50% or higher, and the area B2 of a region having a specific resistance of 1.0 10^(2) -cm or smaller in the surface that corresponds to a sputtering surface occupies 25% or more of the area A.


Patent
Kobelco Research Institute | Date: 2016-03-09

Provided is a target assembly which is manufactured by bonding a Li-containing oxide sputtering target and an Al-based or Cu-based backing plate through a bonding material. The Li-containing oxide target assembly does not undergo warping or cracking during the bonding. The Li-containing oxide target assembly according to the present invention is manufactured by bonding a Li-containing oxide sputtering target to a backing plate via a bonding material, and has bending strength of 20 MPa or larger.

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