Taipei, Taiwan
Taipei, Taiwan

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Patent
Kinik Company | Date: 2015-04-02

The present invention relates to a chemical mechanical polishing conditioner, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer; wherein each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips; wherein the abrasive units have uniform heights, such that the abrasive units form a planarized surface. Therefore, the present invention can improve planarization of the conditioner, enhance efficiency, and prolong lifetime.


The present invention relates to a chemical mechanical polishing conditioner having different heights, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive units have a first tip height and a second tip height. The first tip height is different from the second tip height. The chemical mechanical polishing conditioner can adjust the surface roughness of the pad to be polished and improve the drainage of abrasive slurry.


Patent
Kinik Company | Date: 2016-05-12

Provided is a chemical mechanical polishing (CMP) conditioner comprising: a substrate comprising a horizontal top surface and multiple abrasive units mounted on the horizontal top surface. Each abrasive unit comprises a base of the abrasive unit, an abrasive layer, and a binding layer. The base of the abrasive unit comprises an upper surface and a lower surface. The abrasive layer is formed on the upper surface and comprises multiple abrasive tips. The binding layer is formed between the lower surface and the substrate, and an inclined plane is formed towards the lower surface. The present invention further provides a method for manufacturing the CMP conditioner. The polishing capabilities of different regions of CMP conditioner can be regulated by the abrasive units. Then the CMP conditioner of the present invention satisfies the requirements in the current industry about different polishing capabilities.


Provided is a chemical mechanical polishing conditioner capable of controlling a polishing depth. The CMP conditioner capable of controlling the polishing depth comprises a substrate; a binding layer disposed on the substrate; multiple abrasive units placed on the binding layer; and multiple abrasive terminal units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer, and the abrasive layer is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive tips of the abrasive units are relatively higher than surfaces of the abrasive terminal units to form a protrusion height. Accordingly, the CMP conditioner controls the polishing depth of an article to be conditioned.


Patent
Kinik Company | Date: 2015-10-20

A grinding tool includes a rigid support body and a carrier substrate. The carrier substrate is attached to the support body, and is supported by the support body. Two opposing surfaces of the carrier substrate respectively define a working surface and a non-working surface. A plurality of first abrasive particles are affixed on the working surface, and a plurality of second abrasive particles are affixed on the non-working surface. The first abrasive particles have a first average size, and the second abrasive particles have a second average size smaller than the first average size. The carrier substrate is attached to the support body at the non-working surface. Moreover, a method of manufacturing the grinding tool is described herein.


Patent
Kinik Company | Date: 2015-12-08

A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another. In some embodiments, methods of fabricating a grinding tool are also described.


Patent
Kinik Company | Date: 2016-04-19

A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed across the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having a pyramid shape, the pyramid shape being a right square pyramid or a right hexagonal pyramid.


Patent
Kinik Company | Date: 2016-04-20

A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed over the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having an obliquely truncated pyramid shape. Some embodiments described herein also include a method of manufacturing the grinding tool.


Patent
Kinik Company | Date: 2016-02-04

Provided is a CMP conditioner comprising: a substrate, multiple abrasive bars, and multiple slide blocks. The substrate is divided into a central surface and an outer surface. The central surface is a recessed part. The outer surface encompasses the central surface. Multiple mounting holes are recessed from the outer surface. The abrasive bars are each respectively mounted in the mounting holes. Each of the multiple abrasive bars comprises a bar body and an abrasive particle. The abrasive particle is mounted on a top surface of the abrasive bar. The multiple slide blocks are distributed among the mounting holes of the outer surface. Each of the multiple slide blocks comprises a slide dressing surface. The present invention utilizes the slide blocks to reduce the contact between the substrate and a polishing mat efficiently. The slide blocks may decrease dissolving out of metal components within the substrate and the pollution induced.


Patent
Kinik Company | Date: 2015-05-26

Provided is a CMP conditioner comprising: a substrate comprising multiple concave parts, the concave parts formed in a surface of the substrate and each concave part having a side wall; multiple fixed plates, each fixed plate comprising a bottom, a top, a concavity and an inclined plane, the bottom fixed into the concave part, the top integrated with the bottom with a contact surface formed between the top and the bottom, the concavity formed in the top and opposite the bottom, the inclined plane formed between the contact surface and the concavity, an angle and a space formed between the inclined plane and the side wall; and multiple abrasive units, each abrasive unit mounted in the concavity. When the CMP conditioner is applied to a pad, the thickness of the pad can recover to its original thickness; i.e., the cutting depth is increased to improve the dressing performance.

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