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Agaeva F.A.,Khetagurov North Ossetia State University | Kaloev N.I.,Gorsk State Agrarian University | Bigaeva I.M.,Khetagurov North Ossetia State University | Esieva L.K.,Khetagurov North Ossetia State University | Chel'dieva G.M.,Khetagurov North Ossetia State University
Russian Journal of Inorganic Chemistry | Year: 2010

Component interactions in the iron-molybdenum-samarium system at 773 K were studied by powder X-ray diffraction, microstructure observation, electron probe microanalysis, and hardness and microhardness testing. The formation of a ternary intermetallic compound ψ with a ThMn12 structural type was found in this system. Binary intermetallc compounds were found to interact not only with one another to form two-phase equilibria (Fe2Mo + Fe7Mo6, Sm2Fe17 + SmFe3, SmFe3 + SmFe2, and Fe2Mo6 + SmFe2) but also with pure components (Fe + Fe2Mo, Fe + Sm2Fe17, Mo + Fe7Mo6, Sm + SmFe 2, and Sm + Fe7Mo6). Three-phase regions were also detected in the isothermal section of the diagram: Fe + Fe2Mo + ψ, Fe7Mo6 + Fe2Mo + ψ, Fe 7Mo6 + SmFe2 + ψ, and SmFe3 + SmFe2 + ψ. © Pleiades Publishing, Ltd., 2010.

Bliev A.P.,Khetagurov North Ossetia State University | Sozanov V.G.,Khetagurov North Ossetia State University
Russian Microelectronics | Year: 2013

The results of studies of nanodimensional silicon (NS) samples, which do not degrade under the intense laser radiation exposure, are presented. It was shown that a significant increase in the intensity of the photoluminescence signal from the NS can be attributed to both the special features of their structural configuration and the available thin SiO2 layer on the surface of the nanocrystals. © 2013 Pleiades Publishing, Ltd.

Chigorina E.A.,Khetagurov North Ossetia State University | Arutyunyants A.A.,Khetagurov North Ossetia State University | Bestaev M.V.,Khetagurov North Ossetia State University | Chigorina T.M.,Khetagurov North Ossetia State University | Abaev V.T.,Khetagurov North Ossetia State University
Polymer Science - Series D | Year: 2010

Polyorganosiloxane compounds with improved physicomechanical properties are presented. The possibility of changing the properties of adhesive sealants by introducing them into the composition of new modifying additions, structure-forming additions (QM-resins), curing accelerators, and coupling agents has been shown. The elaborated compounds can be recommended for sealing semiconductor devices and integral schemes. © 2010 Pleiades Publishing, Ltd.

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