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Schelcher G.,CNRS Fundamental Electronics Institute | Fabbri F.,CNRS Fundamental Electronics Institute | Lefeuvre E.,CNRS Fundamental Electronics Institute | Brault S.,KFM Technology | And 3 more authors.
Journal of Microelectromechanical Systems | Year: 2011

The novelty of this paper is the proof of functional microdevice fabrication using a recently developed low-temperature transfer process. The process is based on adhesion control of molded Ni microstructures on a donor wafer by using plasma-deposited fluorocarbon films. Low-temperature adhesive bonding of the microstructures on the target wafer using benzocyclobutene sealing enables mechanical tearing off from the donor wafer. Interest of this process for manufacturing microsensors is demonstrated here in the case of microbeams used as pressure sensors based on the Pirani principle. A simple analytical model is used to estimate the electrothermal behavior of the suspended microwires as a function of the ambient gas pressure. Estimations are compared to experimental measurements performed on Ni electroplated microwires of 550-1200-μm length, 10-μm width, and 0.7-7-μm thickness characterized into a vacuum chamber. These microsensors present a maximum of sensitivity in the range of 0.1-100 mbar, which is in line with standard performances of Pirani gauges. The presented results thus demonstrate the interest of a simple film transfer process for the elaboration of 3-D functional microstructures. © 2011 IEEE. Source


The invention relates to an electronic circuit (


Schelchera G.,CNRS Fundamental Electronics Institute | Schelchera G.,Ecole Nationale Superieure de Chimie de Paris | Braulta S.,CNRS Fundamental Electronics Institute | Parraina F.,CNRS Fundamental Electronics Institute | And 7 more authors.
ECS Transactions | Year: 2010

A low cost and low temperature MEMS transfer process is presented. The process is based on adhesion control of molded electroplated Ni microstructures on donor wafer by using plasma deposited fluorocarbon film. Adhesive bonding of the microstructures on the target wafer using BCB sealing enables mechanical tearing out from the donor wafer. This proposed process has allowed us to realize from 7 μm down to 700 nm thick Ni patterns on Si, Pyrex glass wafers and Kapton foils. Multiple transfers lead to Ni stacked microstructures. We demonstrated the interest of a simple film transfer process for elaboration of 3D microstructures. ©The Electrochemical Society. Source


Brault S.,University Paris - Sud | Garel O.,University Paris - Sud | Schelcher G.,University Paris - Sud | Isac N.,University Paris - Sud | And 5 more authors.
Microsystem Technologies | Year: 2010

A low cost and low temperature thin film packaging process based on the transfer of an electroplated Nickel 3D cap is proposed. This process is based on adhesion control of a thick molded cap Ni film on the carrier wafer by using a plasma deposited fluorocarbon film, on mechanical debonding and on adhesive bonding of the microcaps on the host wafer with BCB sealing rings. Mechanical characterizations show that the transferred microcaps have a high stiffness, a low stress and a high adhesion. Because this process is simple and only involves a low temperature (250°C) heating of the host wafer, it is highly versatile and suitable for the encapsulation of micro and nano devices, circuits and systems elaborated on a large range of substrate materials. © 2010 Springer-Verlag. Source


Schelcher G.,CNRS Fundamental Electronics Institute | Schelcher G.,Ecole Nationale Superieure de Chimie de Paris | Brault S.,KFM Technology | Parrain F.,CNRS Fundamental Electronics Institute | And 7 more authors.
Journal of the Electrochemical Society | Year: 2011

A low cost and low temperature microelectromechanical systems (MEMS) transfer process is presented. The process is based on adhesion control of molded electroplated Ni microstructures on the donor wafer by using a plasma deposited fluorocarbon film. Adhesive bonding of the microstructures on the target wafer using BCB sealing enables mechanical tearing off from the donor wafer. This proposed process has allowed us to realize from 7 μm down to 700 nm thick Ni patterns on Si, Pyrex glass wafers and Kapton foils. Multiple transfers lead to Ni stacked microstructures. We demonstrated the interest of a simple film transfer process for the elaboration of 3D microstructures. © 2011 The Electrochemical Society. Source

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