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Wei K.,Kunming University of Science and Technology | Wei K.,The Key Laboratory of Vacuum Metallurgy of Non ferrous Metals of Yunnan Province | Zheng D.,Kunming University of Science and Technology | Zheng D.,The Key Laboratory of Vacuum Metallurgy of Non ferrous Metals of Yunnan Province | And 6 more authors.
Silicon | Year: 2015

Aluminum is one of the main impurity elements in metallurgical-grade silicon (MG-Si). The methods of aluminum removal from MG-Si are slag refining, directional solidification, acid leaching and vacuum evaporation refining, respectively. Based on the theoretical calculation, the vacuum evaporation refining experiments for aluminum removal were carried out in this paper. The effects of refining time and temperature on the removal efficiency of aluminum were investigated. The results show that the vacuum evaporation is an efficient refining technique for removing impurity aluminum from MG-Si. The content of aluminum in MG-Si can be reduced from 1120 × 10−6 to 427 × 10−6, and its removal efficiency is 61.9 %. Meanwhile, the removal efficiency of aluminum is improved with the increasing refining time and temperature during vacuum evaporation. © 2014, Springer Science+Business Media Dordrecht.


Shi S.,Kunming University of Science and Technology | Shi S.,The Key Laboratory of Vacuum Metallurgy of Non Ferrous Metals of Yunnan Province | Yang B.,Kunming University of Science and Technology | Yang B.,The Key Laboratory of Vacuum Metallurgy of Non Ferrous Metals of Yunnan Province | And 4 more authors.
Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology | Year: 2011

The superfine copper powders were grown by vacuum evaporation and condensation. The impacts of the growth conditions, including evaporation rate and evaporation temperature, pressure, and cooling rate, on microstructures and properties of the copper grains were characterized with X-ray diffraction, scanning electron microscopy, and glow discharge mass spectrometry. The results show that the pressure and evaporation temperature strongly affect both the microstructures and evaporation rate of Cu grains. For instance, under optimized conditions, the fairly uniform, well-dispersed Cu particles with face-centered cubic structures and an averaged size of 2 μm, were obtained. Possible mechanism was also tentatively discussed.

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