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Wang Y.,Harbin Institute of Technology | Wang Y.,Key Laboratory of Micro systems and Micro structures Manufacturing HIT | Qi W.,Harbin Institute of Technology | Cai Z.,Harbin Institute of Technology | And 5 more authors.
Proceedings of 2011 International Conference on Electronic and Mechanical Engineering and Information Technology, EMEIT 2011 | Year: 2011

This paper presents a correlation of the commercial CAD/CAM software into the micro 4-axis electrical discharge milling (ED-milling) process. By applying the commercial CAD/CAM software, the model can be designed and the NC code can be generated. According to the NC code, the 4-axis ED-milling process can be carried out successfully by the micro 4-axis machine tool on the cylindrical workpiece. The milling process was presented and the tool electrode wear was shown in the diagram. The on-line CCD and SEM pictures of the 3D micro structure on the cylindrical workpiece were shown in the paper at last. © 2011 IEEE. Source


Wang Y.K.,Key Laboratory of Micro systems and Micro structures Manufacturing HIT | Wang Y.K.,Harbin Institute of Technology | Chen X.,Key Laboratory of Micro systems and Micro structures Manufacturing HIT | Chen X.,Harbin Institute of Technology | And 3 more authors.
Advanced Materials Research | Year: 2014

In this study, an ultrafine WEDM (wire electrical discharge machining) of micro-channel mold is proposed. It could be divided into two parts, rough machining and finish processing. In rough machining procedure, high machining voltage is adopted to improve machining efficiency. In finish machining procedure, extended and trimmed tool path is adopted to obtain the cusp at the corner, low electrical parameters is adopted to improve surface quality and dimensional precision. By conducting finish machining of 40V, a better surface-quality with Ra of 0.32μm and high aspect ratio of 20:1 was fabricated. © (2014) Trans Tech Publications, Switzerland. Source


Guo C.,Key Laboratory of Micro systems and Micro structures Manufacturing HIT | Guo C.,Harbin Institute of Technology | Wang Y.,Key Laboratory of Micro systems and Micro structures Manufacturing HIT | Wang Y.,Harbin Institute of Technology | And 4 more authors.
Key Engineering Materials | Year: 2014

A three-dimensional coupled thermal-structural model for micro electrical discharge is presented in this paper. Temperature field and thermal stress field of a single spark discharge process are analysed using this model by indirect coupling method. Temperature field is firstly solved which acts as the foundation of solving thermal stress field. To make the simulation results more reliable, these important elements are also taken into account, such as temperature-dependent properties of material, the phenomenon of plasma channel radius expanding, the percentage of discharge energy transferred to the workpiece and Gaussian distribution of heat flux. The results can explain the formation of cracks around the discharge crater. The thickness of the white layer and residual stresses can be predicated using this model. Source

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