Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology

Nanjing, China

Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology

Nanjing, China
SEARCH FILTERS
Time filter
Source Type

Gao Y.,Nanjing Southeast University | Gao Y.,Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology | Li H.,Nanjing Southeast University | Li H.,Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology | And 4 more authors.
Sensors (Switzerland) | Year: 2017

This paper presents the design and application of a lever coupling mechanism to improve the shock resistance of a dual-mass silicon micro-gyroscope with drive mode coupled along the driving direction without sacrificing the mechanical sensitivity. Firstly, the mechanical sensitivity and the shock response of the micro-gyroscope are theoretically analyzed. In the mechanical design, a novel lever coupling mechanism is proposed to change the modal order and to improve the frequency separation. The micro-gyroscope with the lever coupling mechanism optimizes the drive mode order, increasing the in-phase mode frequency to be much larger than the anti-phase one. Shock analysis results show that the micro-gyroscope structure with the designed lever coupling mechanism can notably reduce the magnitudes of the shock response and cut down the stress produced in the shock process compared with the traditional elastic coupled one. Simulations reveal that the shock resistance along the drive direction is greatly increased. onsequently, the lever coupling mechanism can change the gyroscope’s modal order and improve the frequency separation by structurally offering a higher stiffness difference ratio. The shock resistance along the driving direction is tremendously enhanced without loss of the mechanical sensitivity. © 2017 by the authors. Licensee MDPI, Basel, Switzerland.


Huang L.,Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology | Huang L.,Nanjing Southeast University | Yang H.,Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology | Yang H.,Nanjing Southeast University | And 6 more authors.
Sensors (Switzerland) | Year: 2013

The micromechanical silicon resonant accelerometer has attracted considerable attention in the research and development of high-precision MEMS accelerometers because of its output of quasi-digital signals, high sensitivity, high resolution, wide dynamic range, anti-interference capacity and good stability. Because of the mismatching thermal expansion coefficients of silicon and glass, the micromechanical silicon resonant accelerometer based on the Silicon on Glass (SOG) technique is deeply affected by the temperature during the fabrication, packaging and use processes. The thermal stress caused by temperature changes directly affects the frequency output of the accelerometer. Based on the working principle of the micromechanical resonant accelerometer, a special accelerometer structure that reduces the temperature influence on the accelerometer is designed. The accelerometer can greatly reduce the thermal stress caused by high temperatures in the process of fabrication and packaging. Currently, the closed-loop drive circuit is devised based on a phase-locked loop. The unloaded resonant frequencies of the prototype of the micromechanical silicon resonant accelerometer are approximately 31.4 kHz and 31.5 kHz. The scale factor is 66.24003 Hz/g. The scale factor stability is 14.886 ppm, the scale factor repeatability is 23 ppm, the bias stability is 23 μg, the bias repeatability is 170 μg, and the bias temperature coefficient is 0.0734 Hz/°C. © 2013 by the authors; licensee MDPI, Basel, Switzerland.


PubMed | Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology
Type: Journal Article | Journal: Sensors (Basel, Switzerland) | Year: 2013

The micromechanical silicon resonant accelerometer has attracted considerable attention in the research and development of high-precision MEMS accelerometers because of its output of quasi-digital signals, high sensitivity, high resolution, wide dynamic range, anti-interference capacity and good stability. Because of the mismatching thermal expansion coefficients of silicon and glass, the micromechanical silicon resonant accelerometer based on the Silicon on Glass (SOG) technique is deeply affected by the temperature during the fabrication, packaging and use processes. The thermal stress caused by temperature changes directly affects the frequency output of the accelerometer. Based on the working principle of the micromechanical resonant accelerometer, a special accelerometer structure that reduces the temperature influence on the accelerometer is designed. The accelerometer can greatly reduce the thermal stress caused by high temperatures in the process of fabrication and packaging. Currently, the closed-loop drive circuit is devised based on a phase-locked loop. The unloaded resonant frequencies of the prototype of the micromechanical silicon resonant accelerometer are approximately 31.4 kHz and 31.5 kHz. The scale factor is 66.24003 Hz/g. The scale factor stability is 14.886 ppm, the scale factor repeatability is 23 ppm, the bias stability is 23 g, the bias repeatability is 170 g, and the bias temperature coefficient is 0.0734 Hz/C.

Loading Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology collaborators
Loading Key Laboratory of Micro Inertial Instruments and Advanced Navigation Technology collaborators