Guo W.,Beihang University |
Zhang H.,Tsinghua University |
Zhang H.,Key Laboratory for Advanced Manufacturing by Materials Processing Technology |
Zhang X.,Beihang University |
And 7 more authors.
Journal of Alloys and Compounds | Year: 2017
A new mixed nano paste consisting of silver nanoparticles, silver nanowires and copper nanoparticles has been proposed as the active material in an alternative joining approach for interconnection in electronic packaging. The mixed nano paste was optimized by adding different contents of copper nanoparticles into silver nanoparticle and nanowire pastes. Compared with the common silver nanoparticle paste, the electrochemical migration time of this mixed nano paste increased with greater addition of copper nanoparticles. Silver nanowires were also found to decrease the resistance of this mixed nano paste effectively due to their continuity. Although higher additions of copper nanoparticles into the mixed nano paste could facilitate the desired result of anti-electrochemical migration, they also decrease the shear strength of the sintered joints using the mixed pastes. In order to balance anti-electrochemical migration and sintering properties of the mixed nano pastes, when 10% copper nanoparticles were added to the mixed silver nanoparticle and nanowire pastes, the average shear strength of sintered joints at 250–350 °C was above 25 MPa. Based on the comprehensive properties, the mixed silver nanoparticle nanowire with 10% copper nanoparticle pastes were determined to be a better paste for sintered connections in electrical packaging. © 2016 Elsevier B.V.
Sun P.,Key Laboratory for Advanced Manufacturing by Materials Processing Technology |
Zhu M.,Key Laboratory for Advanced Manufacturing by Materials Processing Technology |
Zhu M.,Tsinghua University |
Wang K.,Key Laboratory for Advanced Manufacturing by Materials Processing Technology |
And 5 more authors.
ACS Applied Materials and Interfaces | Year: 2013
Materials with low temperature coefficient of resistivity (TCR) are of great importance in some areas, for example, highly accurate electronic measurement instruments and microelectronic integrated circuits. In this work, we demonstrated the ultrathin graphene-graphene oxide (GO) hybrid films prepared by layer-by-layer assembly with very small TCR (30-100 C) in the air. Electrical response of the hybrid films to temperature variation was investigated along with the progressive reduction of GO sheets. The mechanism of electrical response to temperature variation of the hybrid film was discussed, which revealed that the interaction between graphene and GO and the chemical doping effect were responsible for the tunable control of its electrical response to temperature variation. The unique properties of graphene-GO hybrid film made it a promising candidate in many areas, such as high-end film electronic device and sensor applications. © 2013 American Chemical Society.