Kompetenzzentrum Automobil und Industrieelektronik KAI GmbH

Villach, Austria

Kompetenzzentrum Automobil und Industrieelektronik KAI GmbH

Villach, Austria
SEARCH FILTERS
Time filter
Source Type

Henkel C.,Vienna University of Technology | Bethge O.,Vienna University of Technology | Abermann S.,AIT Austrian Institute of Technology | Puchner S.,Kompetenzzentrum Automobil und Industrieelektronik GmbH KAI | And 2 more authors.
Applied Physics Letters | Year: 2010

We report on the improvement of electrical quality of (100)-Ge/high- k -dielectric interfaces by introducing thin Pt top layers on the dielectric and subsequent oxidative treatments or using a Pt-deposition process with inherent oxidative components. Here, deposition of thin physical vapor deposition-Pt layers, combined with subsequent oxygen treatments, or oxygen assisted atomic layer deposition of Pt on these dielectrics, is applied. Strong reduction of interface trap densities down to mid- 1011 eV-1 cm -2 is achieved. The approach is shown for Pt/ZrO2/La 2 O3/Ge, Pt/ZrO2/GeO2/Ge, and Pt/ZrO2/Ge gate stacks. By x-ray photoelectron spectroscopy evidence is given for oxygen enrichment at Ge/high- k -dielectric interfaces, to be responsible for the improved electrical properties. © 2010 American Institute of Physics.


Holzer L.A.,Medical University of Graz | Sevelda F.,Medical University of Vienna | Fraberger G.,Medical University of Vienna | Bluder O.,Kompetenzzentrum Automobil und Industrieelektronik KAI GmbH | And 2 more authors.
PLoS ONE | Year: 2014

Background: Limb amputation is often an inevitable procedure in the advanced condition of various diseases and poses a dramatic impact on a patient's life. The aim of the present study is to analyze the impact of lower-limb amputations on aesthetic factors such as body image and self-esteem as well as quality of life (QoL). Methods: 298 patients (149 uni- or bilateral lower-limb amputees and 149 controls) were included in this cross-sectional study in three centers. Demographic data was collected and patients received a 118-item questionnaire including the Multidimensional Body-Self Relations Questionnaire (MBSRQ), the Rosenberg Self-esteem (RSE) scale and the SF-36 Health Survey (QoL). ANOVA and student's t-test were used for statistical analysis. Results: Unilateral lower-limb amputees showed a significant lower MBSRQ score of 3.07±0.54 compared with 3.41±0.34 in controls (p<0.001) and a lower score in the RSE compared to controls (21.63±4.72 vs. 21.46±5.86). However, differences were not statistically significant (p = 0.36). Patients with phantom pain sensation had a significantly reduced RSE (p = 0.01). The SF-36 health survey was significantly lower in patients with lower-limb amputation compared to controls (42.17±14.47 vs. 64.05±12.39) (p<0.001). Conclusion: This study showed that lower-limb amputations significantly influence patients' body image and QoL. Self-esteem seems to be an independent aspect, which is not affected by lower-limb amputation. However, self-esteem is influenced significantly by phantom pain sensation. © 2014 Holzer et al.


Huang R.,Kompetenzzentrum Automobil und Industrieelektronik KAI GmbH | Huang R.,Vienna University of Technology | Robl W.,Infineon Technologies | Dehm G.,University of Leoben | And 3 more authors.
Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA | Year: 2010

The self-annealing effect of electroplated copper films was investigated by measuring the time dependence of the film stress for different film thicknesses between 1.5μm and 20μm. This recrystallization process results in significant microstructure change and a film-thickness-dependent stress evolution at room temperature. This behavior can be explained by the superposition of grain growth and grain size dependent yielding. Existing models have been used and improved to describe the mechanisms related to stress evolution. © 2010 IEEE.


Huang R.,Kompetenzzentrum Automobil und Industrieelektronik KAI GmbH | Robl W.,Infineon Technologies | Detzel T.,Infineon Technologies | Ceric H.,Vienna University of Technology
IEEE International Reliability Physics Symposium Proceedings | Year: 2010

Electroplated Cu films are known to change their microstructure at room temperature due to the self-annealing effect. This recrystallization process results in a film-thickness-dependent stress evolution. Films with the thickness of 5μm and below decrease in stress with time, while thicker films reveal initially an increase in film stress followed by a stress relaxation at a later stage. This behavior is explained by the superposition of grain growth and grain size dependent yielding. Existing models have been used and improved to describe the mechanisms related to stress evolution. In general, the models proposed in this study provide a satisfactory description of the stress evolution of electroplated Cu films and the simulated results show good agreement with the experimental data. This gives the possibility to evaluate and predict mechanical behavior of electroplated Cu films at room temperature. © 2010 IEEE.


Huang R.,Kompetenzzentrum Automobil und Industrieelektronik KAI GmbH | Huang R.,Vienna University of Technology | Robl W.,Infineon Technologies | Ceric H.,Vienna University of Technology | And 3 more authors.
IEEE Transactions on Device and Materials Reliability | Year: 2010

Electroplated copper films are known to change their microstructure due to the self-annealing effect. The self-annealing effect of electroplated copper films was investigated by measuring the time dependence of the film stress and sheet resistance for different layer thicknesses between 1.5 and 20 μm. While the sheet resistance was found to decrease as time elapsed, a size-dependent change in film stress was observed. Films with the thickness of 5 μm; and below decrease in stress, while thicker films initially reveal an increase in film stress followed by a stress relaxation at a later stage. This behavior is explained by the superposition of grain growth and grain-size-dependent yielding. © 2010 IEEE.

Loading Kompetenzzentrum Automobil und Industrieelektronik KAI GmbH collaborators
Loading Kompetenzzentrum Automobil und Industrieelektronik KAI GmbH collaborators