JSR Corporation | Date: 2015-10-07
A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent.
JSR Corporation | Date: 2015-03-25
A composition for pattern formation includes a block copolymer and a solvent. The block copolymer includes a group including a reactive group on at least one end of a main chain of the block copolymer. A pattern-forming method includes providing a directed self-assembling film directly or indirectly on a substrate using the composition. The directed self-assembling film includes a phase separation structure which includes a plurality of phases. A part of the plurality of phases of the directed self-assembling film is removed.
JSR Corporation | Date: 2015-07-22
A stack includes a substrate material that has a circuit surface and that is temporarily fixed on a support via a temporary fixing material. The temporary fixing material includes a temporary fixing material layer (I) that is in contact with the circuit surface of the substrate material and a temporary fixing material layer (II) that is formed on the support-facing surface of the layer (I). The temporary fixing material layer (I) is formed of a temporary fixing composition (i) that includes a thermoplastic resin (Ai), a polyfunctional (meth)acrylate compound (Bi), and a radical polymerization initiator (Ci), and the temporary fixing material layer (II) is formed of a temporary fixing composition (ii) that includes a thermoplastic resin (Aii) and a release agent (Dii).
JSR Corporation | Date: 2015-06-25
A container containing a cobalt carbonyl complex and a gas that contains carbon monoxide, and a cobalt carbonyl complex composition comprising a cobalt carbonyl complex and a solvent, wherein the concentration of carbon monoxide dissolved in the solvent is 0.001 to 1 wt %. Since the cobalt carbonyl complex contained in the above container or the above composition can retain its sublimation properties for a long time without being converted into a stable complex, when a cobalt film is formed by chemical vapor deposition using the container and the composition, a high-quality film can be formed by a simple process, and the production cost of the cobalt film can be reduced due to high use efficiency of the precursor.
JSR Corporation | Date: 2015-02-12
A composition for pattern formation includes a block copolymer and a solvent. The block copolymer is capable of forming a phase separation structure through directed self-assembly. The block copolymer includes a first block and a second block. The first block includes a first repeating unit which includes at least two silicon atoms. The second block includes a second repeating unit which does not include a silicon atom. A sum of the atomic weight of atoms constituting the first repeating unit is no greater than 700.