Yokkaichi, Japan
Yokkaichi, Japan

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An immersion upper layer film-forming composition includes [A] a polymer component that includes a polymer (A1), and [B] a solvent, the polymer (A1) including a structural unit (I) that includes a group represented by the following formula (i). The structural unit (I) is preferably a structural unit (I-1) represented by the following formula (1). The polymer component [A] preferably further includes a structural unit (II-1) represented by the following formula (2), the structural unit (II-1) being included in the polymer (A1) or a polymer other than the polymer (A1). The polymer component [A] preferably further includes a structural unit (III) that includes a carboxyl group, the structural unit (III) being included in the polymer (A1) or a polymer other than the polymer (A1).


A base film-forming composition includes a compound including a group capable of reacting with SiOH or SiH, and a solvent. The base film-forming composition is for forming a base film provided between a layer including a silicon atom and a directed self-assembling film in a directed self-assembly lithography process. The receding contact angle of the base film for pure water is no less than 70 and no greater than 90. The compound is preferably represented by formula (1). In the formula (1), A represents a linking group having a valency of (m+n); D represents a monovalent organic group having at least 10 carbon atoms; E represents the group capable of reacting with SiOH or SiH; and m and n are each independently an integer of 1 to 200. (E_(n)-AD)_(m)(1)


A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.


The present invention provides a radiation-sensitive resin composition that contains a polymer having a structural unit that includes an acid-labile group; and an acid generator, wherein the acid generator includes a compound including a sulfonate anion having SO_(3)^(), wherein a hydrogen atom or an electron-donating group bonds to an carbon atom with respect to SO_(3)^(), and an electron-withdrawing group bonds to a carbon atom with respect to SO_(3)^(); and a radiation-degradable onium cation. The compound preferably has a group represented by the following formula (1-1) or (1-2). In the following formulae (1-1) and (1-2), R^(1 )and R^(2 )each independently represent a hydrogen atom or a monovalent electron-donating group. R^(3 )represent a monovalent electron-withdrawing group. R^(4 )represents a hydrogen atom or a monovalent hydrocarbon group.


A chemically amplified resist material comprises: a polymer component that is capable of being made soluble or insoluble in a developer solution by an action of an acid; and a generative component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure. The polymer component comprises: a first polymer comprising a first structural unit that comprises a fluorine atom and does not comprise a salt structure; or a second polymer comprising a second structural unit that comprises a fluorine atom and a salt structure. The generative component comprises: a radiation-sensitive acid-and-sensitizer generating agent; any two of the radiation-sensitive acid-and-sensitizer generating agent, a radiation-sensitive sensitizer generating agent and a radiation-sensitive acid generating agent; or the radiation-sensitive acid-and-sensitizer generating agent, the radiation-sensitive sensitizer generating agent and the radiation-sensitive acid generating agent.


Patent
JSR Corporation | Date: 2016-09-08

A resist pattern-forming method comprises applying a chemically amplified resist material on a substrate to form a resist film on the substrate. The resist film is patternwise exposed to a radioactive ray having a wavelength of no greater than 250 nm. The resist film patternwise exposed is floodwise exposed to a radioactive ray having a wavelength of greater than 250 nm. The resist film floodwise exposed is baked and developed with a developer solution comprising an organic solvent. The chemically amplified resist material comprises a component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure. The component comprises: a radiation-sensitive sensitizer generating agent, and at least one of a radiation-sensitive acid-and-sensitizer generating agent and a radiation-sensitive acid generating agent. The radiation-sensitive sensitizer generating agent comprises a compound represented by formula (B).


A resist pattern-forming method comprises applying a chemically amplified radiation-sensitive resin composition on a substrate to form a resist film. The chemically amplified radiation-sensitive resin composition comprises a first component solubility in a developer solution of which is capable of being altered by an action of an acid, a second component that is capable of generating an acid by an action of a first exposure light comprising a radioactive ray having a first wavelength, and a sensitizer precursor to be converted into a sensitizer by an action of the first exposure light. A first exposure of the resist film to the first exposure light is conducted. A second exposure of the resist film exposed to the first exposure light, to a second exposure light is conducted. The second exposure light comprises a radioactive ray having a second wavelength longer than the first wavelength.


A chemically amplified resist material contains: (1) a polymer component that is capable of being made soluble or insoluble in a developer solution by an action of an acid; (2) a component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure, wherein the polymer component (1) contains a first polymer having a first structural unit that includes a fluorine atom and does not include a salt structure, or a second polymer having a second structural unit that includes a fluorine atom and a salt structure, and wherein the component (2) contains component (a), any two of components (a) to (c), or all of components (a) to (c).


To provide a solid-phase carrier to which impurities are hard to nonspecifically adsorb. A solid-phase carrier, formed by binding a chain polymer, wherein the chain polymer comprises a random polymer structure containing a first structural unit having a reactive functional group, and a second structural unit having no reactive functional group or having a reactive functional group having a reactivity lower than that of the reactive functional group of the first structural unit, and the content ratio of the number of moles a of the reactive functional group contained in the first structural unit to the number of moles b of the entire structural unit contained in the chain polymer, (a/b), is from 0.01 to 0.7.


A method of producing a partition wall comprises (a) forming a film using a photosensitive composition, (b) exposing the thus formed film, (c) developing the thus exposed film with an aqueous alkaline solution, and (d) applying wind to the thus developed film. The partition wall compartmentalizes a housing space which is formed between first and second electrode layer stacks and which contains a polar liquid and a non-polar liquid that are immiscible with each other.

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