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Tan W.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Liu H.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Li L.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Wan Y.,Jiangsu HuaHaiChengKe Advanced Materials Co.
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging | Year: 2011

Thermal stability and color change of carnauba wax, ester wax, OP wax, S wax, stearic acid, GMS and a few polyethylene wax types were investigated by heating them to a specific temperature 175C for about 50hours. Cluster analysis was adopted by analyzing the weight loss of the wax. Based on the weight loss data, these wax can be divided into three groups, the most stable group which includes carnauba wax and polyethylene wax; and the most unstable wax is stearic acid wax. Based on the observation of color changed analysis, the most stable is polyethylene wax without any functional group. The effects of these wax types on the properties of epoxy molding compound like water absorption, DMA modulus, Spiral flow and Tg. were studied by using basic epoxy molding compound (EMC) system. The EMC system consists of biphenyl and multifunction resin, with filler content of 86%. The results showed the EMC with GMS wax has the highest water absorption; stearic acid gives the most lubricating effect by showing the longest spiral flow; no significant effect was observed at room temperature but significant different at high temperature (260°C) with DMA modulus. Tg result showed wax has an effect on the cured crosslink density. The difference can be as high as 30°C. The compatibility between the wax and the EMC system was studied by observation on the surface flow mark of molded QFP package. It was found that the most incompatibility is carnauba wax, follow by E wax, oxidized polyethylene and GMS wax. S wax, stearic wax and polyethylene wax showed the best in terms of compatibility. © 2011 IEEE.

Liu H.J.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Tan W.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Li L.X.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Qiu C.,Jiangsu HuaHaiChengKe Advanced Materials Co. | And 2 more authors.
ECS Transactions | Year: 2014

Coupling agent, which acts as the bridge of epoxy resin and silica filler as well as the adhesion promoter of the Epoxy Molding Compound (EMC) and metal leadfream, is one of the most important ingredients in EMC manufacture. Here, the influences of the incorperation mannner of coupling agent agent, different types and content of coupling agent on the performance of EMC have been screened. Dynamic Mechanical Analyzer (DMA) modulus, impact strength, water absorption and adhesion test on copper, silver and PPF have been introduced to characterize the performance of EMC. Test results showed that for the incorperation manners, 85% coupling agent hydrolysate directly added in the high speed mixing process show hgiher adhesion strength on the silver, when coupling agent is used to pretreat silica, all the pretreated batches show a little lower DMA modulus than that non treated one. For different coupling agent types, normal epoxy group silane show higher adhesion on copper as well as other silanes, special silane A show higher adhesion on silver while special silane B show higher adeshion on PPF, meanwhile composite silane C show lower water absorption. For the content of the coupling agent, when the perportion of the siliane is more than 1%, the impact strength significantly decreased. © 2014 The Electrochemical Society.

Qiu C.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Tan W.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Liu H.J.,Jiangsu HuaHaiChengKe Advanced Materials Co. | Jiang X.J.,Jiangsu HuaHaiChengKe Advanced Materials Co. | And 2 more authors.
ECS Transactions | Year: 2014

This paper studied the moisture of the post-mold-cured packages with the effects of resin structure, equivalent ratio of epoxy resin to Phenolic resin (E/OH), coupling agent, stress modifier and release agent on the moisture are further studied. The results showed that the resin structure has significant effect on the moisture, the order is multifunctional epoxy resin > o-crosel novolac epoxy resin > biphenyl epoxy resin > Naphthalene epoxy resin. The moisture decreases while the ration of E/OH increased. The moisture decreases rapidly with increase of the ratio of E/OH from 0.3 to 1.0. The moisture decreases slowly when it is larger than 1.0. The highest moisture of catalyst are 2MZ-A and 2MAOK while the lowest are 2MZ and TPP. The highest moisture of wax are GMS and stearic acid, while the lowest are polyethylene wax, oxidized polyethylene wax, and Carnauba wax, and the moisture of E wax, OP wax and S wax are in the middle. © 2014 The Electrochemical Society.

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