Jeonnam Provincial College

South Korea

Jeonnam Provincial College

South Korea

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Jung K.-J.,Jeonnam Provincial College | Lee S.-J.,Chonnam National University
Journal of the Korean Society of Food Science and Nutrition | Year: 2011

This research was performed to determine the quality characteristics of cookies made from flour added with 0, 1, 3, and 5% sea mustard (Undaria pinnatifida Suringer) powder. The quality characteristics of the cookies, including pH and density of the dough, moisture content, spread factor, loss rate, leavening rate, color, mineral content, texture properties, and sensory properties, were estimated. The density of the dough, water content, spread factor, loss rate, leavening rate, a and b values of color scale, and mineral content of the cookies significantly increased while those of pH, L value, and hardness decreased with higher content of sea mustard powder. With the exception of flavor, consumer acceptability scores in terms of appearance, taste, texture, and overall preference for cookies made from 3% sea mustard powder significantly ranked the highest. Taken together, the results of this study suggest that addition of 3% sea mustard powder to flour is effective for increasing the consumer acceptability and functionality of cookies.


Yoon H.-S.,Chonnam National University | Kim M.-Y.,Jeonnam Provincial College
Proceedings of the 2015 10th IEEE Conference on Industrial Electronics and Applications, ICIEA 2015 | Year: 2015

To transmit and to store digital video sequences, compression is necessary. Motion Estimation (ME) Technique is used to redundant data in video sequences. ME which limits the performance of image quality, generated bitrates and encoding time requires huge complexity. To reduce the computational complexity, a Hierarchical motion estimation scheme in Multi-view Video Coding (MVC) is proposed. The proposed method exploits the characteristics of the distribution of motion vectors to terminate the motion estimation early and to place the search points in the search area. Experiment results show that the complexity reduction of the proposed method over FS and TZ can be up to 98.9% and 42∼78% respectively while maintaining image quality and bitrates. This electronic document is a 'live' template and already. © 2015 IEEE.


Li M.,Harbin Institute of Technology | Yang M.,Harbin Institute of Technology | Kim J.,Jeonnam Provincial College
Materials Letters | Year: 2012

The growth orientations of Cu6Sn5 grains formed at a Sn3.5Ag/polycrystalline Cu interface were investigated. Similar as reported on Cu single crystals, strong textures in Cu6Sn5 layers can also form on polycrystalline Cu, but the texture formation mechanisms differ. The texture formation on polycrystalline Cu occurs during the ripening growth and results from the differences in stability of the interfacial grains with various orientations at different temperatures. A reaction temperature of 240 °C causes the Cu6Sn5 layer to form [0001] texture in the direction normal to the substrate, and a special morphology of interfacial Cu6Sn5 grains can be formed on this layer to reinforce joint properties. © 2011 Elsevier B.V.


Yang M.,Harbin Institute of Technology | Li M.,Harbin Institute of Technology | Wang L.,China National Electrical Apparatus Research Institute | Fu Y.,China National Electrical Apparatus Research Institute | And 2 more authors.
Materials Letters | Year: 2011

The growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface was investigated. During soldering, Cu6Sn 5 grains formed at the interface, showing a flattened ovoid shape. During solidification, Cu precipitated from molten solder in the form of Cu 6Sn5, forming faceted surfaces on existing interfacial grains. The interfacial Cu6Sn5 morphology was unrelated to its crystal orientation, which was primarily dependent on reaction temperature. A reaction temperature of 240 °C led to an increase in (002) growth and a decrease in (101) growth with time. However, the (002) plane peak was not detected in the interfacial grains formed at a higher reaction temperature (280 °C). © 2011 Elsevier B.V. All rights reserved.


Li M.Y.,Harbin Institute of Technology | Zhang Z.H.,Harbin Institute of Technology | Kim J.M.,Jeonnam Provincial College
Applied Physics Letters | Year: 2011

Polymorphic transformation mechanism of η and η′ in single crystalline Cu6Sn5 has been investigated in this study. η phase exists at room temperature in the quenched specimens and transforms to η′ phase under aging at 150 °C for 40 d. The nucleation and growth of η′ phase is observed by field emission scanning electron microscope and surface reconstruction of polymorphic transformation is confirmed by both x-ray diffractometer and differential scanning calorimetry analysis. The results show that the volumetric strain energy is the dominant reason for occurring polymorphic transformation rather than order-disorder transition of η and η′ phases. © 2011 American Institute of Physics.


Yang M.,Harbin Institute of Technology | Li M.,Harbin Institute of Technology | Kim J.,Jeonnam Provincial College
Intermetallics | Year: 2012

The growth orientation of Cu 6Sn 5 intermetallic compounds (IMCs) formed at the eutectic Sn37Pb/polycrystalline Cu interface during solid-state aging was investigated. The results indicate that the interfacial Cu 6Sn 5 grains exhibit textured growth under solid-state conditions, and their preferred orientations are affected by the initial joint preparation conditions. Cu 6Sn 5 grains in the [0001] direction normal to the interface are stable in solid and molten Sn37Pb solder at 200 °C, but are rapidly consumed at 280 °C. This effect leads to the formation of different textures in the Cu 6Sn 5 layer during the solid-state aging treatment of joints formed at 200 and 280 °C. In addition, the influence of texture evolution on the growth of interfacial IMCs was evaluated. The results indicate that Sn diffusion is faster along the [0001] direction of the Cu 6Sn 5 crystal than along an angle of 25-45° to the [0001] direction; therefore, more IMCs are generated at the interface of the joints formed at 200 °C than at those formed at 280 °C under the same solid-state reaction conditions. © 2012 Elsevier Ltd. All rights reserved.


Xiao Y.,Harbin Institute of Technology | Ji H.,Harbin Institute of Technology | Li M.,Harbin Institute of Technology | Kim J.,Jeonnam Provincial College | Kim H.,Jeonnam Provincial College
Materials and Design | Year: 2013

The ultrasound-assisted brazing of 1060 Al alloy using a Zn-14Al hypereutectic filler metal was investigated at different temperatures. The effects of brazing temperature on the bonding ratio, shear strength and microstructure of the joints were studied. Cavities and discontinuous cracks were found in the joint ultrasonically brazed at 410 °C, and the joint showed a low bonding ratio and poor shear strength. Excellent bonding ratios and high shear strength were obtained in the joints ultrasonically brazed at 440 °C and 470 °C. The primary α-Al phase showed a refined spherical shape in the joint ultrasonically brazed at 440 °C, but showed a coarse dendritic structure in the joint ultrasonically brazed at 470 °C and that brazed at 440 °C without ultrasonic vibration. The refined spherical microstructure shown in the joint ultrasonically brazed at 440 °C was attributed to cavitation-aided grain refinement effects. © 2013 Elsevier Ltd.


Xiao Y.,Harbin Institute of Technology | Ji H.,Harbin Institute of Technology | Li M.,Harbin Institute of Technology | Kim J.,Jeonnam Provincial College
Materials and Design | Year: 2013

Ultrasound-assisted brazing of Cu/Al dissimilar metals was performed using a Zn-3Al filler metal. The effects of brazing temperature on the microstructure and mechanical properties of Cu/Al joints were investigated. Results showed that excellent metallurgic bonding could be obtained in the fluxless brazed Cu/Al joints with the assistance of ultrasonic vibration. In the joint brazed at 400°C, the filler metal layer showed a non-uniform microstructure and a thick CuZn5 IMC layer was found on the Cu interface. Increasing the brazing temperature to 440°C, however, leaded to a refined and dispersed microstructure of the filler metal layer and to a thin Al4.2Cu3.2Zn0.7 serrate structure in the Cu interfacial IMC layer. Further increasing the brazing temperature to 480°C resulted in the coarsening of the filler metal and the significantly growth of the Al4.2Cu3.2Zn0.7 IMC layer into a dendrite structure. Nanoindentation tests showed that the hardness of the Al4.2Cu3.2Zn0.7 and CuZn5 phase was 11.4 and 4.65GPa, respectively. Tensile strength tests showed that all the Cu/Al joints were failed in the Cu interfacial regions. The joint brazed at 440°C exhibited the highest tensile strength of 78.93MPa. © 2013 Elsevier Ltd.


Three brass-plated steel cords with different copper contents from 51.4 to 75.5% were prepared and their adhesion properties to rubber compound were examined. Adhesion properties improved with the decrease in the copper content. The high adhesion of brass-plated steel cord with low copper content to the rubber was obtained after cure and after hostile aging treatments. The stability against humidity aging and the cause for the high adhesion of the brass-plated steel cord with low copper content were discussed in conjunction with the formation and growth of adhesion interphase determined by Auger electron spectroscopy depth profile. The excellent adhesion stability of brass-plated cord with low copper content can be explained by the suppression of the excessive growth of copper sulfide and the inhibition of dezincification due to the low copper content. © 2014 Taylor & Francis.


The adhesion between hexamethoxymethylmelamine (HMMM)-containing rubber compounds and brass-plated steel cords was studied to understand the role of HMMM as an adhesion promoter. No improvement in adhesion after cure was shown with loading of HMMM in the range 1.3-5.2 phr, while enhancement of adhesion retention after humidity aging was observed with loading of HMMM in the range 1.3-5.2 phr. The adhesion interphase between the brassplated steel cord and the rubber compound subjected to humidity-aging treatment showed using Auger electron spectroscopy (AES) stabilized depth profile by HMMM incorporation as loading of HMMM, resulting in enhancement of adhesion retention. © 2012 Taylor & Francis.

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