JENOPTIK Optical Systems GmbH

Jena, Germany

JENOPTIK Optical Systems GmbH

Jena, Germany
SEARCH FILTERS
Time filter
Source Type

Patent
JENOPTIK Optical Systems GmbH | Date: 2016-09-29

An adjustable lens mount with an outer mount ring, a laterally adjustable inner mount ring and at least two connection structures. The at least two connection structures communicate in each instance with a manipulator with a radial acting axis. The connection structures in each instance have a coupling member and a lever connected therewith. The coupling member is connected to the inner mount ring farther radially outside than the lever is connected to the outer mount ring.


Patent
JENOPTIK Optical Systems GmbH | Date: 2016-09-22

Optical mount assembly comprising a lens mount with a plurality of retaining arms (3.1) which are arranged in a rotationally symmetrical manner and with a lens (1) which is connected via its cylindrical circumferential surface (1.1) to the retaining arms (3.1) in each instance via at least two adhesive areas (4.1) within a joint area (4). The retaining arms (3.1) have within the joint area (4) a slot structure with at least one slot (5.2) which is filled with adhesive during assembly and proceeding from which the adhesive is transported into the adhesive gap (6) and which forms the adhesive areas (4.1).


Patent
JENOPTIK Optical Systems GmbH | Date: 2016-09-21

A stiffened lens mount with an outer mount ring having an axis of symmetry, an inner mount ring arranged coaxial to the outer mount ring and connection structures. The inner mount ring has at least one end face arranged perpendicular to the axis of symmetry, and a coaxially arranged stiffening ring fixedly connected to the inner mount ring via the at least one end face along an imaginary circle.


Patent
JENOPTIK Optical Systems GmbH | Date: 2016-09-21

A monolithic lens mount is formed by an annular body which is divided through material recesses into an outer mount ring, an inner mount ring and three connection structures which are arranged so as to be offset by 120 relative to one another. The connection structures in each instance form a chain of at least three, preferably five, connection webs which transition into one another and which are constructed as radial connection webs and axial connection webs. The axial flexural stiffness and radial flexural stiffness and the torsional stiffness of the connection structures can be determined via the dimensioning of the radial connection webs and axial connection webs.


Patent
JENOPTIK Optical Systems GmbH | Date: 2015-03-10

The invention relates to an adjustable, deformable mirror for compensating irregularities of a beam with a mirror element for reflecting incident rays of the beam, a base body for securing the mirror element and at least one actuating element for applying forces to the mirror element, wherein the mirror element is a planar element with a thickness of at least 1 mm, and the actuating element is a lever mechanism with lever elements. The invention also relates to a method for compensating irregularities of a beam as well as an optical arrangement with a mirror according to the invention.


Patent
JENOPTIK Optical Systems GmbH | Date: 2015-02-26

Mount assembly with a monolithic mount formed by a mount ring with a plurality of retaining arms with free ends and an element, which retaining arms are arranged concentrically around the axis of symmetry of the mount ring and extend at least partially in axial direction. Three of the retaining arms contact an end face formed at the element and hold the element axially, while the other retaining arms are bonded to a circumferential surface formed at the element and prevent the element in particular from rotating.


The approach presented here provides a membrane unit (105) comprising micro-optical structures (115), which comprises a wafer (110) as carrier basis of the micro-optical structures (115), an intermediate substrate (300) connected to the wafer (110), and a carrier (130) connected to the intermediate substrate (300), wherein the coefficients of thermal expansion of the wafer (100), of the intermediate substrate (300) and of the carrier (130) are dimensioned such that a coefficient of expansion of the carrier (130) is greater than a coefficient of expansion of the intermediate substrate (300) and the coefficient of expansion of the intermediate substrate (300) is greater than or equal to a coefficient of expansion of the wafer (110).


The approach presented here provides a membrane unit (105) comprising micro-optical structures (115), which comprises a wafer (110) as carrier basis of the micro-optical structures (115), an intermediate substrate (300) connected to the wafer (110), and a carrier (130) connected to the intermediate substrate (300), wherein the coefficients of thermal expansion of the wafer (100), of the intermediate substrate (300) and of the carrier (130) are dimensioned such that a coefficient of expansion of the carrier (130) is greater than a coefficient of expansion of the intermediate substrate (300) and the coefficient of expansion of the intermediate substrate (300) is greater than or equal to a coefficient of expansion of the wafer (110).


Grant
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-02-2014 | Award Amount: 181.08M | Year: 2015

The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative device architecture and comprising demonstration of a lithographic platform for EUV and immersion technology, advanced process and holistic metrology platforms, new materials and mask infrastructure. A lithography scanner will be developed based on EUV technology to achieve the 7nm module patterning specification. Metrology platforms need to be qualified for N7s 1D, 2D and 3D geometries with the appropriate precision and accuracy. For the 7nm technology modules a large number of new materials will need to be introduced. The introduction of these new materials brings challenges for all involved processes and the related equipment set. Next to new deposition processes also the interaction of the involved materials with subsequent etch, clean and planarization steps will be studied. Major European stakeholders in EUV mask development will collaboratively work together on a number of key remaining EUV mask issues. The first two years of the project will be dedicated to find the best options for patterning, device performance, and integration. In the last year a full N7 integration with electrical measurements will be performed to enable the validation of the 7nm process options for a High Volume Manufacturing. The SeNaTe project relates to the ECSEL work program topic Process technologies More Moore. It addresses and targets as set out in the MASP at the discovery of new Semiconductor Process, Equipment and Materials solutions for advanced CMOS processes that enable the nano-structuring of electronic devices with 7nm resolution in high-volume manufacturing and fast prototyping.


A lens mount for radially fixing, or for radially adjusting and fixing, in a lens tube, having a mounting ring in which tangentially running first slots form cylindrical segments which, during the operation of turning the external diameter of the mounting ring to a nominal dimension are deformed by a screw by a width of the first slots, and therefore the circumferential surface of the mounting ring is not turned, at least in part, along the segment and the external diameter has an oversize.

Loading JENOPTIK Optical Systems GmbH collaborators
Loading JENOPTIK Optical Systems GmbH collaborators