Dongguan, China
Dongguan, China

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Xiao X.-H.,Hunan University | Peng M.-F.,Hunan University | Li F.-H.,Hunan University | Zhan J.,Hunan University of Science and Technology | Tang R.-J.,Japans TDK Groups
Tien Tzu Hsueh Pao/Acta Electronica Sinica | Year: 2012

The assessment for the reliability design of Built-DFH in Magnetic head is very important. It recurrently uses the empirical data to instruct the production in the craft now. Unfortunately, the error is very large. Theoretically, everybody is simulating the reliability using the Matlab software. Owing to the limit of the cell size, the simulation algorithm will expire along with the rounding error superimposition. This article uses the ANSYS software. The experiment was to establish the basic parameters and select the appropriate cell type, material properties and give the finite element model of the head. The results according to the life prediction using the model above shows, the finite element model is effective. Furthermore, in new DFH in 50 Ω, the strength of thermal effects is larger above 10% than the traditional shield. The regions with problems of the actual life failed samples are in the line of the corner.

Xiao X.-H.,Hunan University | Peng M.-F.,Hunan University | He J.-B.,Central South University | Tang R.-J.,Japans TDK Groups | Zhou Y.-L.,Japans TDK Groups
Tien Tzu Hsueh Pao/Acta Electronica Sinica | Year: 2015

The reliability analysis for the magnetic head includes solders joint early drops splash protection and solders joint post failure analysis. In actual production, applying the jetting solder ball bonding (SBB) technology, solder splash have occurred frequently. Combining the laser heating and nitrogen pressure technology, this thesis aimed at building a new double of droplet model for calculating the striking velocity of the solder which is used to connect the Built-DFH in Slider, while different parameters of the laser heating and the nitrogen pressure are compared through the orthogonal test. The controllable scanning magnetic fields and bias are further incorporated and the failure of magnetic solder joint is studied. The results showed that before the solder falls, laser energy is the most important factor affecting the solder splash. After the solder falls, we find that the temperature of the melting ball has no decrease during the fall. The temperature of the impinging melting ball depends on its initial value. The failure of magnetic solder joint is caused by solder droplet splash and intermetallic compounds. ©, 2015, Chinese Institute of Electronics. All right reserved.

Xiao X.,Hunan University | Peng M.,Hunan University | Cardoso J.S.,INESC Porto | Tang R.,Japans Tdk Groups | Zhou Y.L.,Japans Tdk Groups
Applied Physics A: Materials Science and Processing | Year: 2014

Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years. © 2014, Springer-Verlag Berlin Heidelberg.

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