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Torikai T.,Japan Aviation Electronics Industry | Yamauchi T.,Japan Aviation Electronics Industry | Aihara S.,Japan Aviation Electronics Industry | Mine S.,Mitsubishi Group | And 6 more authors.
POF 2012: 21st International Conference on Plastic Optical Fibers - Proceedings | Year: 2012

We have developed an optical I/O connector embedded using optical collimator lenses fabricated with well-defined and proven ball-point pen technology. The collimator lens consists of a glass-ball lens and a plastic optical fiber (POF) in a ball-point pen type metal sleeve. The POF is point-crimped in the sleeve without any adhesives. This enables a reliable fiber assembly without any damage to the POF, because the sensitive fiber end-facet is protected by the surrounding glass-ball and metal sleeve. The coupling loss is as low as 3dB, including Fresnel losses between engaged plug and receptacle collimator lenses. This optical I/O connection scheme has encouraged us to promote the POF as a cost-effective interconnection medium into the consumer electronics market. © 2012 ICPOF.


News Article | February 15, 2017
Site: marketersmedia.com

Wiseguyreports.Com Adds “I/O Connectors -Market Demand, Growth, Opportunities and analysis of Top Key Player Forecast to 2022” To Its Research Database This report studies sales (consumption) of I/O Connectors in Global market, especially in United States, China, Europe and Japan, focuses on top players in these regions/countries, with sales, price, revenue and market share for each player in these regions, covering Market Segment by Regions, this report splits Global into several key Regions, with sales (consumption), revenue, market share and growth rate of I/O Connectors in these regions, from 2011 to 2021 (forecast), like Split by product Types, with sales, revenue, price and gross margin, market share and growth rate of each type, can be divided into Type I Type II Split by applications, this report focuses on sales, market share and growth rate of I/O Connectors in each application, can be divided into Application 1 Application 2 Global I/O Connectors Sales Market Report 2017 1 I/O Connectors Overview 1.1 Product Overview and Scope of I/O Connectors 1.2 Classification of I/O Connectors 1.2.1 Type I 1.2.2 Type II 1.3 Application of I/O Connectors 1.3.1 Application 1 1.3.2 Application 2 1.4 I/O Connectors Market by Regions 1.4.1 United States Status and Prospect (2012-2022) 1.4.2 China Status and Prospect (2012-2022) 1.4.3 Europe Status and Prospect (2012-2022) 1.4.4 Japan Status and Prospect (2012-2022) 1.4.5 Southeast Asia Status and Prospect (2012-2022) 1.4.6 India Status and Prospect (2012-2022) 1.5 Global Market Size (Value and Volume) of I/O Connectors (2012-2022) 1.5.1 Global I/O Connectors Sales and Growth Rate (2012-2022) 1.5.2 Global I/O Connectors Revenue and Growth Rate (2012-2022) 9 Global I/O Connectors Manufacturers Analysis 9.1 Amphenol 9.1.1 Company Basic Information, Manufacturing Base and Competitors 9.1.2 I/O Connectors Product Type, Application and Specification 9.1.2.1 Product A 9.1.2.2 Product B 9.1.3 Amphenol I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.1.4 Main Business/Business Overview 9.2 3M 9.2.1 Company Basic Information, Manufacturing Base and Competitors 9.2.2 I/O Connectors Product Type, Application and Specification 9.2.2.1 Product A 9.2.2.2 Product B 9.2.3 3M I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.2.4 Main Business/Business Overview 9.3 Molex 9.3.1 Company Basic Information, Manufacturing Base and Competitors 9.3.2 I/O Connectors Product Type, Application and Specification 9.3.2.1 Product A 9.3.2.2 Product B 9.3.3 Molex I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.3.4 Main Business/Business Overview 9.4 Cvilux Corporation 9.4.1 Company Basic Information, Manufacturing Base and Competitors 9.4.2 I/O Connectors Product Type, Application and Specification 9.4.2.1 Product A 9.4.2.2 Product B 9.4.3 Cvilux Corporation I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.4.4 Main Business/Business Overview 9.5 HARTING 9.5.1 Company Basic Information, Manufacturing Base and Competitors 9.5.2 I/O Connectors Product Type, Application and Specification 9.5.2.1 Product A 9.5.2.2 Product B 9.5.3 HARTING I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.5.4 Main Business/Business Overview 9.6 TE Connectivity 9.6.1 Company Basic Information, Manufacturing Base and Competitors 9.6.2 I/O Connectors Product Type, Application and Specification 9.6.2.1 Product A 9.6.2.2 Product B 9.6.3 TE Connectivity I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.6.4 Main Business/Business Overview 9.7 FCI Electronics 9.7.1 Company Basic Information, Manufacturing Base and Competitors 9.7.2 I/O Connectors Product Type, Application and Specification 9.7.2.1 Product A 9.7.2.2 Product B 9.7.3 FCI Electronics I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.7.4 Main Business/Business Overview 9.8 AVX Corporation 9.8.1 Company Basic Information, Manufacturing Base and Competitors 9.8.2 I/O Connectors Product Type, Application and Specification 9.8.2.1 Product A 9.8.2.2 Product B 9.8.3 AVX Corporation I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.8.4 Main Business/Business Overview 9.9 OMRON 9.9.1 Company Basic Information, Manufacturing Base and Competitors 9.9.2 I/O Connectors Product Type, Application and Specification 9.9.2.1 Product A 9.9.2.2 Product B 9.9.3 OMRON I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.9.4 Main Business/Business Overview 9.10 Control Technology 9.10.1 Company Basic Information, Manufacturing Base and Competitors 9.10.2 I/O Connectors Product Type, Application and Specification 9.10.2.1 Product A 9.10.2.2 Product B 9.10.3 Control Technology I/O Connectors Sales, Revenue, Price and Gross Margin (2012-2017) 9.10.4 Main Business/Business Overview 9.11 TTI 9.12 Lairdtech 9.13 WERNER WIRTH 9.14 Halytech 9.15 Meritec 9.16 Moxa 9.17 Japan Aviation Electronics Industry 9.18 Royal DSM 9.19 SilverStone 9.20 PHOENIX CONTACT For more information, please visit https://www.wiseguyreports.com/sample-request/962913-global-i-o-connectors-sales-market-report-2017


Hokuto T.,University of Hyogo | Yasukawa T.,University of Hyogo | Kunikata R.,Japan Aviation Electronics Industry | Suda A.,Japan Aviation Electronics Industry | And 4 more authors.
Biotechnology Journal | Year: 2016

Electrochemical imaging is an excellent technique to characterize an activity of biomaterials, such as enzymes and cells. Large scale integration-based amperometric sensor (Bio-LSI) has been developed for the simultaneous and continuous detection of the concentration distribution of redox species generated by reactions of biomolecules. In this study, the Bio-LSI system was demonstrated to be applicable for simultaneous detection of different anaytes in multiple specimens. The multiple specimens containing human immunoglobulin G (hIgG) and mouse IgG (mIgG) were introduced into each channel of the upper substrate across the antibody lines for hIgG and mIgG on the lower substrate. Hydrogen peroxide generated by the enzyme reaction of glucose oxidase captured at intersections was simultaneously detected by 400 microelectrodes of Bio-LSI chip. The oxidation current increased with increasing the concentrations of hIgG, which can be detected in the range of 0.01-1.0 μg mL-1. Simultaneous detection of hIgG and mIgG in multiple specimens was achieved by using line pattern of both antibodies. Therefore, the presence of different target molecules in the multiple samples would be quantitatively and simultaneously visualized as a current image by the Bio-LSI system. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.


Arakawa M.,Tohoku University | Kushibiki J.-I.,Tohoku University | Ohashi Y.,Tohoku University | Maruyama Y.,Tohoku University | And 10 more authors.
Japanese Journal of Applied Physics | Year: 2015

We developed a procedure for fabricating a Fabry-Perot optical cavity with less long-term length variation. We fabricated a homogenized TiO2- SiO2 ultralow-expansion (ULE) glass ingot from a commercial TiO2-SiO2 ULE glass ingot with striae. We also controlled the zero-crossing temperature of the coefficient of thermal expansion of the homogenized ingot to approximately 30 °C by heat treatment at 970 °C for 72 h to change the fictive temperature of the ingot. A 100-mm-long cavity spacer was carefully fabricated while reducing the mechanical residual stress introduced by machining. A cavity composed of the spacer and two mirrors of 39-layered Ta2O5/SiO2 films exhibited a high finesse of 420,000 at 729nm and a high length stability of 13 fm/day after 500 days from the beginning of the measurement at a constant temperature of 29.78 °C. © 2015 The Japan Society of Applied Physics.


Patent
Japan Aviation Electronics Industry | Date: 2016-02-03

A plurality of upper plug contacts 10 are each brought into contact with a master elastic piece 24 and a slave elastic piece 25 of a corresponding lower receptacle contact 13 in accordance with elastic deformation of the master elastic piece 24 and the slave elastic piece 25. A plurality of lower plug contacts 12 are each brought into contact with a master elastic piece 24 and a slave elastic piece 25 of a corresponding upper receptacle contact 11 in accordance with elastic deformation of the master elastic piece 24 and the slave elastic piece 25. For example, as shown in Fig. 7, in a state where an upper connector 3 and a lower connector 5 are mated, a direction of the elastic deformation of the master elastic piece 24 and the slave elastic piece 25 of each upper receptacle contact 11 is different from a direction of the elastic deformation of the master elastic piece 24 and the slave elastic piece 25 of each lower receptacle contact 13.

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