San Jose, CA, United States
San Jose, CA, United States

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Patent
InvenSense | Date: 2017-03-01

A method and system for forming a MEMS device are disclosed. In a first aspect, the method comprises providing a conductive material over at least a portion of a top metal layer of a base substrate, patterning the conductive material and the at least a portion of the top metal layer, and bonding the conductive material with a device layer of a MEMS substrate via metal silicide formation. In a second aspect, the MEMS device comprises a MEMS substrate, wherein the MEMS substrate includes a handle layer, a device layer, and an insulating layer in between. The MEMS device further comprises a base substrate, wherein the base substrate includes a top metal layer and a conductive material over at least a portion of the top metal layer, wherein the conductive material is bonded with the device layer via metal silicide formation.


A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.


Patent
InvenSense | Date: 2017-01-13

A distributed automatic level control function is provided, in which information relating to a common automatic level control parameter is transmitted to each of a plurality of microphone devices, wherein the information transmitted to at least one microphone device is derived from an audio sample of at least one different microphone device. Each microphone device produces the common automatic level control parameter based on the information received by the microphone device and applies the common automatic level control parameter produced by the microphone device to a distributed automatic level controller of the microphone device.


An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.


Patent
InvenSense | Date: 2017-03-08

Methods for bonding two wafers are disclosed. In one aspect, a first wafer includes an integrated circuit and the second wafer including a MEMS device. The method comprises depositing a bond pad on a metal on the first wafer and sequentially bonding the first wafer to the second wafer utilizing first and second temperatures. The second wafer is bonded to the bond pad at the first temperature and the bond pad and the metal are bonded at the second temperature. In another aspect, a first wafer including an integrated circuit, the second wafer includes a MEMS device. The method comprises depositing a bond pad on a metal on one of the first wafer and the second wafer and bonding the first wafer to the second wafer at a first temperature via a direct bond interface. The method includes bonding the bond pad to the metal at a second temperature.


Patent
InvenSense | Date: 2017-06-28

A gyroscope comprises a substrate and a guided mass system. The guided mass system comprises proof masses and guiding arms disposed in a plane parallel to the substrate. The proof masses are coupled to the guiding arm by springs. The guiding arm is coupled to the substrate by springs. At least one of the proof-masses is directly coupled to the substrate by at least one anchor via a spring system. The gyroscope also comprises an actuator for vibrating one of the proof-masses in the first direction, which causes another proof mass to rotate in the plane. Finally, the gyroscope also includes transducers for sensing motion of the guided mass system in response to angular velocities about a single axis or multiple input axes.


A method of providing a CMOS -MEMS structure is disclosed. The method comprises patterning a first top metal on a MEMS actuator substrate and a second top metal on a CMOS substrate. Each of the MEMS actuator substrate and the CMOS substrate include an oxide layer thereon. The method includes etching each of the oxide layers on the MEMS actuator substrate and the base substrate, utilizing a first bonding step to bond the first patterned top metal of the MEMS actuator substrate to the second patterned top metal of the base substrate. Finally the method includes etching an actuator layer into the MEMS actuator substrate and utilizing a second bonding step to bond the MEMS actuator substrate to a MEMS handle substrate.


Patent
InvenSense | Date: 2017-04-05

Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.


In a method of associating a single entity with multiple electronic devices, a server accesses user data collected via internet communications with a plurality of electronic devices. Each item of user data includes a location signature and a unique identifier. The server determines an intersection of location between two electronic devices of the plurality of electronic devices based on the user data accessed from the two electronic devices. The user data is accessed from a first of the two electronic devices has a first unique identifier that is different than a second unique identifier of the user data accessed from a second of the two electronic devices. Based on the intersection of location, a single entity is associated with both the first unique identifier and the second unique identifier.


Patent
InvenSense | Date: 2017-07-05

A method and system for providing a MEMS sensor integrated with a flip chip are disclosed. In a first aspect, the system comprises a MEMS sensor, at least one flip chip coupled to the MEMS sensor, and at least one through-silicon via (TSV) that electrically connects the at least one flip chip to the MEMS sensor. In a second aspect, the system comprises a MEMS sensor that includes a CMOS coupled to a MEMS structure, wherein the CMOS comprises a substrate coupled to an interconnect in contact with the MEMS structure. The system further comprises a plurality of flip chips coupled to the substrate, a plurality of TSV that electrically connect the plurality of flip chips to the interconnect, and a plurality of layers on the substrate to provide electrical connections between the plurality of flip chips and from the plurality of flip chips to at least one external component.

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